METHOD OF MANUFACTURING LAMINATE
    13.
    发明申请

    公开(公告)号:US20220293555A1

    公开(公告)日:2022-09-15

    申请号:US17636309

    申请日:2020-08-20

    Abstract: A method of manufacturing a laminate, the method including: providing a film-form firing material on a support sheet, the film-form firing material containing a sinterable metal particle and a binder component and having an identical or substantially identical shape and an identical size to a shape and size of a semiconductor chip; applying, to a substrate, the film-form firing material on the support sheet; peeling off the support sheet from the substrate and the film-form firing material; applying a back surface side of the semiconductor chip to the film-form firing material on the substrate to face each other; and sinter-bonding the semiconductor chip and the substrate by heating the film-form firing material to 200° C. or higher.

    FILM-SHAPED FIRING MATERIAL AND FILM-SHAPED FIRING MATERIAL WITH A SUPPORT SHEET

    公开(公告)号:US20210078080A1

    公开(公告)日:2021-03-18

    申请号:US16970484

    申请日:2019-02-08

    Abstract: A film-shaped firing material (1) is provided, including first metal particles (10), second metal particles (20), and a binder component (30), in which the average particle diameter of the first metal particles (10) is 100 nm or less, and the maximum particle diameter thereof is 250 nm or less, the average particle diameter of the second metal particles (20) is in a range of 1000 to 7000 nm, the minimum particle diameter thereof is greater than 250 nm, and the maximum particle diameter thereof is 10000 nm or less, and the mass ratio of the first metal particles to the second metal particles is 0.1 or greater.

Patent Agency Ranking