摘要:
Methods and devices for adhesively bonding a sensor die to a substrate are described. In some cases, a sensor assembly may include a pressure sensor die mounted to a substrate with an adhesive. The pressure sensor die may be fabricated to include a back-side having one or more adhesion features (e.g. recesses or indentations), which increase the surface area of the pressure sensor die that is in contact with the adhesive, to thereby increase the adhesion force therebetween. In some cases, the one or more adhesion features may define a non-planar interface between the pressure sensor die and the adhesive which, in some instances, may reduce the formation and/or propagation of cracks in the adhesive, which also may help increase the adhesion force therebetween.
摘要:
Methods and devices for increasing a sensor resolution are disclosed. In one example, a two measurement process is used. A first measurement is used to effectively measure across a full range (e.g. 0 to 5 VDC) of the sensor. This first measurement may identify the current operating point of the sensor (e.g. 3.5 VDC). A second measurement may then be made to effectively measure across a sub-range of the sensor that encompasses the current operating point of the sensor (e.g. across a sub-range of 3.0 to 4.0 VDC for a current operating point of 3.5 VDC). The gain of the amplifier may be raised during the second measurement to produce a higher resolution measurement. In some cases, the first measurement may be used to determine an appropriate offset that may be applied so as to scale the amplifier to the desired sub-range of sensor that includes the current operating point of the sensor. In some cases, the two measurements may be used together to compute an effectively higher resolution measurement signal. In some cases, this may allow for a smaller and/or cheaper sensor to be used, while still achieving good results.
摘要:
Flow sensor assemblies having increased flow range capabilities are disclosed. In one illustrative embodiment, a flow sensor assembly includes a housing with an inlet flow port, an outlet flow port, and a fluid channel extending between the inlet flow port and the outlet flow port. One or more partitions are provided in the fluid channel of the housing to define two or more fluid sub-passages. A flow sensor, for sensing a measure related to a flow rate of a fluid flowing through the fluid channel, is positioned in one of the two or more fluid sub-passages. In some cases, the cross-sectional area of each of the two or more fluid sub-passages may be substantially the same, but this is not required. The housing may be formed from a single molded part defining the inlet and outlet flow ports, at least a portion of the fluid channel, and one or more of the partitions. In this case, a top cover may be provided and mounted to the housing to define the remaining portion of the fluid channel, if desired.
摘要:
An integrated circuit for implementing brushless DC motor control includes a substrate, a band gap temperature sensor, and a magnetic sensor. The substrate has a temperature output pin for connection to an external device and a magnetic sensor output pin for connection to the external device. The band gap temperature sensor is formed on the substrate and is configured to sense temperature and supply a temperature signal representative of the sensed temperature to the temperature output pin. The magnetic sensor is formed on the substrate and is configured to sense magnetic field variations and supply a sensor output signal representative thereof to the magnetic sensor output pin.
摘要:
A MEMS airflow sensor die having a heater control circuit, differential instrumentation amplifier, temperature compensation, and/or offset correction circuitry integrated with an airflow sensor on the MEMS die. The added circuitry may be placed on space available on the basic airflow die with MEMS fabrication techniques without enlarging the sensor die. The die with the added circuitry may result in a device having a reduced form factor, improved reliability and lower cost.
摘要:
Flow sensor assemblies having increased flow range capabilities are disclosed. In one illustrative embodiment, a flow sensor assembly includes a housing with an inlet flow port, an outlet flow port, and a fluid channel extending between the inlet flow port and the outlet flow port. One or more partitions are provided in the fluid channel of the housing to define two or more fluid sub-passages. A flow sensor, for sensing a measure related to a flow rate of a fluid flowing through the fluid channel, is positioned in one of the two or more fluid sub-passages. In some cases, the cross-sectional area of each of the two or more fluid sub-passages may be substantially the same, but this is not required. The housing may be formed from a single molded part defining the inlet and outlet flow ports, at least a portion of the fluid channel, and one or more of the partitions. In this case, a top cover may be provided and mounted to the housing to define the remaining portion of the fluid channel, if desired.
摘要:
A flow sensor apparatus and method. A seal with a conductive interconnect is provided that includes a mass flow sense element mounted to a housing containing a thick film and/or thin film bridge structure for sensing media (e.g., mass flow) within a flow tube. The seal effectively isolates wirebond pads and electrical connections from the sensed media. The media, whether liquid or gas, can contain ionics that eventually contaminate the top of the mass flow sense element. The use of the seal with the conductive interconnect thus seals off the electrical connections and prevents exposure to the sensed media.
摘要:
A pressure sensing apparatus (1) includes an elastically deformable pressure-sensitive diaphragm assembly (13) having a pressure-sensitive metal or metal alloy diaphragm (14). A functional filled dielectric layer (25) is on the diaphragm and includes a base dielectric material and at least one CTE raising filler. A CTE of the functional filled dielectric layer provides a CTE @ 800° C.≧8 ppm/° C., such as ≧10 ppm/° C. A plurality of piezoresistive elements (27) are on the functional filled dielectric layer (25).
摘要:
A force sensor may include a housing having a cavity enclosing a sense die, an actuating element and an elastomeric seal. The sense die may have a force sensing element for sensing a force applied to a surface of the sense die, and a temperature compensation circuit. The temperature compensation circuit may be located on the surface of the sense die and may be configured to at least partially compensate for the temperature sensitivity of the force sensing element. The actuating element may extend outside the housing and be used to transfer a force applied externally from the housing to the sense die. The elastomeric seal may include one or more conductive elements separated from the edge of the elastomeric seal by an insulating elastomeric material.
摘要:
A force sensor may include a housing having a cavity enclosing a sense die, an actuating element and an elastomeric seal. The sense die may have a force sensing element for sensing a force applied to a surface of the sense die, and a temperature compensation circuit. The temperature compensation circuit may be located on the surface of the sense die and may be configured to at least partially compensate for the temperature sensitivity of the force sensing element. The actuating element may extend outside the housing and be used to transfer a force applied externally from the housing to the sense die. The elastomeric seal may include one or more conductive elements separated from the edge of the elastomeric seal by an insulating elastomeric material.