摘要:
A logical latch is permanently programmable to a selected state for use as a control circuit with extremely low power consumption in an integrated circuit.
摘要:
A bias voltage generator generates the same bias voltage VBB for different external power supply voltages EVCC (for example, for EVCC=3.3V or 5.0V). During power-up, the charge pump that generates VBB is controlled by an enable signal ExtEn referenced to EVCC. Later an internal supply voltage IVCC becomes fully developed to a value independent from EVCC (for example, IVCC=3.0V), and the charge pump becomes controlled by an enable signal IntEn referenced to IVCC. This enable signal IntEn will cause VBB to reach its target value, for example, -1.5V. This target value is independent of EVCC. During power-up, when the charge pump is controlled by ExtEn, the bias voltage VBB is driven to an intermediate value (for example, -0.5V or -1V). This intermediate value depends on EVCC, but is below the target value in magnitude. The intermediate value reduces the likelihood of latch-up during power-up, but the intermediate value does not go beyond the target value thus does not create a significant pn-junction current leakage in semiconductor regions to which the bias voltage is applied.
摘要:
A memory such as a flash EPROM contains writing circuitry (58 and 60) that adjusts how much current or/and voltage is provided to a writing conductor (92) connected to the memory cells (50) of a cell group for simultaneously writing the bits of a bit group such as a word or byte into the cells of that cell group as a function of how many of those bits are in one of a pair of opposite logic states.
摘要:
Dynamic Random Access Memory (DRAM) cells are formed in a P well formed in a biased deep N well (DNW). PMOS transistors are formed in N wells. The NMOS channels stop implant mask is modified not to be a reverse of the N well mask in order to block the channels stop implant from an N+ contact region used for DNW biasing. In DRAMs and other integrated circuits, a minimal spacing requirement between a well of an integrated circuit on the one hand and adjacent circuitry on the other hand is eliminated by laying out the adjacent circuitry so that the well is located adjacent to a transistor having an electrode connected to the same voltage as the voltage that biases the well. For example, in DRAMs, the minimal spacing requirement between the DNW and the read/write circuitry is eliminated by locating the DNW next to a transistor precharging the bit lines before memory accesses. One electrode of the transistor is connected to a precharge voltage. This electrode overlaps the DNW which is biased to the same precharge voltage. This electrode provides the DNW N+ contact region.
摘要:
In each row of a nonvolatile memory array, the select gates of all the memory cells are connected together and are used to select a row for memory access. The control gates of each row are also connected together, and the source regions of each row are connected together. Also, the control gates of plural rows are connected together, and the source regions of plural rows are connected together, but if the source regions of two rows are connected together, then their control gates are not connected together. If one of the two rows is being accessed but the other one of the two rows is not being accessed, their control gates are driven to different voltages, reducing the probability of a punch-through in the non-accessed row.
摘要:
In a burst operation, a counter receives one or more bits of a starting column address. The count signal generated by the counter is provided to column decoders. The column decoders select two columns in response to a single value of the count signal. The two columns can be at non-consecutive column addresses. Alternatively, the two columns can be at consecutive column addresses starting at an odd column address boundary. Data are transferred between the two columns and a buffer in parallel. Data are transferred between the buffer and a data terminal serially. Some embodiments are suitable for burst operations defined by standards for synchronous dynamic random access memories.
摘要:
A memory such as a flash EPROM contains writing circuitry (58 and 60) that adjusts how much current or/and voltage is provided to a writing conductor (92) connected to the memory cells (50) of a cell group for simultaneously writing the bits of a bit group such as a word or byte into the cells of that cell group as a function of how many of those bits are in one of a pair of opposite logic states.
摘要:
A nonvolatile memory array can be erased by sectors, or alternatively a chip erase operation can be performed to erase all the cells of the array in parallel.
摘要:
Dynamic Random Access Memory (DRAM) cells are formed in a P well formed in a biased deep N well (DNW). PMOS transistors are formed in N wells. The NMOS channels stop implant mask is modified not to be a reverse of the N well mask in order to block the channels stop implant from an N+ contact region used for DNW biasing. In DRAMs and other integrated circuits, a minimal spacing requirement between a well of an integrated circuit on the one hand and adjacent circuitry on the other hand is eliminated by laying out the adjacent circuitry so that the well is located adjacent to a transistor having an electrode connected to the same voltage as the voltage that biases the well. For example, in DRAMs, the minimal spacing requirement between the DNW and the read/write circuitry is eliminated by locating the DNW next to a transistor precharging the bit lines before memory accesses. One electrode of the transistor is connected to a precharge voltage. This electrode overlaps the DNW which is biased to the same precharge voltage. This electrode provides the DNW N+ contact region.
摘要:
A fuse-programmable circuit controllably enables or disables an electrical signal (S). The circuit includes a transmission gate (118) connected between the circuit's input and output terminals. The transmission gate is controlled by complimentary outputs OUTH, OUTL of a fuse-programmable latch (130). A PMOS transistor (Q41) and a fuse (F41) are connected in series between the output terminal and a power supply voltage (VCC). An NMOS transistor (Q42) and a fuse (F42) are connected in series between the output terminal and a reference voltage (ground). The gate of the PMOS transistor is connected to the latch output OUTH. The gate of the NMOS transistor is connected to the latch output OUTL. When OUTH is high and OUTL is low, the transmission gate couples the signal (S) from the input terminal to the output terminal. When OUTH is low and OUTL is high, the transmission gate is closed. The output terminal is permanently fixed at the power supply voltage level or the reference voltage level depending on which of the two fuses (F41 or F42) is blown and which of the two fuses is intact.