Abstract:
A semiconductor structure and a method for manufacturing the same are provided. The semiconductor structure comprises an access device, a dielectric layer, a barrier layer, a first interlayer conductor, a first barrier liner, a second interlayer conductor, a second barrier liner, a memory element and a top electrode layer. The access device has two terminals. The dielectric layer covers the access device. The barrier layer is disposed on the dielectric layer. The first and second interlayer conductors are connected to the two terminals, respectively. The first and second barrier liners are disposed on sidewalls of the first and second interlayer conductors, respectively. The memory element is disposed on the first interlayer conductor. The top electrode layer is disposed on the barrier layer and the memory element and covers the memory element.
Abstract:
A resistive memory device is provided, comprising a bottom electrode, a patterned dielectric layer with a via formed on the bottom electrode, a barrier layer formed at sidewalls and a bottom surface of the via as a liner, a ring-shaped metal layer formed at sidewalls and a bottom surface of the barrier layer, and a ring-shaped metal oxide formed on a top surface of the ring-shaped metal layer.
Abstract:
Metal oxide based memory devices and methods for manufacturing are described herein. A method for manufacturing a memory cell includes forming an insulation layer on an access device followed by forming vias through the insulation layer to expose the first and second access device terminals. First and second interlayer conductors extending through the vias are formed next. Top surfaces of the interlayer conductors are oxidized to form oxide layers. The oxide layer on the first interlayer conductor forms a memory layer. On top of the insulation layer a layer of protection metal is formed covering the oxide layers. The layer of protection metal is patterned and etched to form a top electrode layer covering the memory layer. The oxide layer on the second interlayer conductor is removed. Parallel first and second access lines are then formed on the top electrode layer and the second interlayer conductor, respectively.
Abstract:
A memory device and an in-memory search method thereof are provided. The in-memory search method includes: providing, in a first stage, a first voltage or a second voltage to a word line of at least one target memory cell according to a logical status of searched data, and reading a first current; providing, in a second stage, a third voltage or a fourth voltage to the word line of the at least one target memory cell according to the logical status of the searched data, and reading a second current; and obtaining a search result according to a difference between the second current and the first current.
Abstract:
A memory device and an operation method thereof for performing a multiply-accumulate operation are provided. The memory device includes at least one memory string, a plurality of data lines and a string line. The memory string includes a plurality of unit cells having a plurality of stored values. The data lines are respectively connected to the unit cells to receive a plurality of data signals having a plurality of inputting values. When the data signals are inputted into the unit cells, a plurality of nodes among the unit cells are kept at identical voltages. The string line is connected to the memory string to receive a sensing signal and obtain a measured value representing a sum-of-product result of the inputting values and the stored values. The data signals and the sensing signal are received at different time.
Abstract:
A TCAM comprises a plurality of first search lines, a plurality of second search lines, a plurality of memory cell strings and one or more current sensing units. The memory cell strings comprise a plurality of memory cells. The current sensing units are coupled to the memory cell strings. In a search operation, a determination that whether any of the data stored in the memory cell strings matches a data string to be searched is made according to whether the one or more current sensing units detect current from the memory cell strings, or according to the magnitude of the current flowing out from the memory cell strings detected by the one or more current sensing units. Each memory cell includes a first transistor and a second transistor. Gates of the first and second transistors are coupled to a corresponding first search line and a corresponding second search line.
Abstract:
A memory device includes a stack and a plurality of memory strings. The stack is disposed on the substrate, and the stack includes a plurality of conductive layers and a plurality of insulating layers alternately stacked. The memory strings pass through the stack along a first direction, wherein a first memory string in the memory strings includes a first conductive pillar and a second conductive pillar, a channel layer, and a memory structure. The first conductive pillar and the second conductive pillar respectively extend along the first direction and are separated from each other. The channel layer is disposed between the first conductive pillar and the second conductive pillar. The memory structure surrounds the second conductive pillar, and the memory structure includes a resistive memory material.
Abstract:
A content-address memory (CAM) and an operation method are provided. The content-address memory comprises: a plurality of first signal lines; a plurality of second signal lines; and a plurality of CAM memory cells coupled to the first signal lines and the second signal lines, wherein in data match, a plurality of input signals are input into the CAM memory cells via the first signal lines; the input signals are compared with contents stored in the CAM memory cells; and a match result is determined based on an electrical characteristic of the second signal lines.
Abstract:
A flash memory cell includes a rectifying device and a transistor. The rectifying device has an input end coupled to a bit line. The transistor has a charge storage structure. The transistor has a first end coupled to an output end of the rectifying device, the transistor has a second end coupled to a source line, and a control end of the transistor is coupled to a word line.
Abstract:
An in-memory computation device and computation method are provided. The in-memory computation device, including a memory cell array, an input buffer, and a sense amplifier, is provided. The memory cell array includes a memory cell block. The memory cell block corresponds to at least one word line, and stores multiple weight values. Memory cells on the memory cell block respectively store multiple bits of each weight value. The input buffer is coupled to multiple bit lines, and respectively transmits multiple input signals to the bit lines. The memory cell array performs a multiply-add operation on the input signals and the weight values to generate multiple first operation results corresponding to multiple bit orders. The sense amplifier adds the first operation results to generate a second operation result according to the bit orders corresponding to the first operation results.