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公开(公告)号:US10475500B2
公开(公告)日:2019-11-12
申请号:US16111021
申请日:2018-08-23
Applicant: Micron Technology, Inc.
Abstract: Methods, systems, and devices for operating a ferroelectric memory cell or cells are described. A cell may be written with a value that is intended to convey a different logic state than may typically be associated with the value. For example, a cell that has stored a charge associated with one logic state for a time period may be re-written to store a different charge, and the re-written cell may still be read to have the originally stored logic state. An indicator may be stored in a latch to indicate whether the logic state currently stored by the cell is the intended logic state of the cell. A cell may, for example, be re-written with an opposite value periodically, based on the occurrence of an event, or based on a determination that the cell has stored one value (or charge) for a certain time period.
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公开(公告)号:US10147486B2
公开(公告)日:2018-12-04
申请号:US15050248
申请日:2016-02-22
Applicant: Micron Technology, Inc.
Inventor: Emiliano Faraoni , Scott E. Sills , Alessandro Calderoni , Adam Johnson
IPC: G11C13/00
Abstract: Memory systems and memory programming methods are described. According to one arrangement, a memory system includes a memory array comprising a plurality of memory cells individually configured to have a plurality of different memory states, access circuitry configured to apply signals to the memory cells to program the memory cells to the different memory states, and a controller to configured to control the access circuitry to apply a first of the signals to one of the memory cells to program the one memory cell from a first memory state to a second memory state different than the first memory state, to determine that the one memory cell failed to place into the second memory state as a result of the application of the first signal, and to control the access circuitry to apply a second signal to the one memory cell to program the one memory cell from the first memory state to the second memory state as a result of the determination, wherein the first and second signals have a different electrical characteristic.
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公开(公告)号:US10062432B2
公开(公告)日:2018-08-28
申请号:US14719053
申请日:2015-05-21
Applicant: Micron Technology, Inc.
Inventor: D. V. Nirmal Ramaswamy , Gurtej S. Sandhu , Lei Bi , Adam D. Johnson , Brent Keeth , Alessandro Calderoni , Scott E. Sills
CPC classification number: G11C13/004 , G11C11/1673 , G11C13/0069 , G11C2013/0047 , G11C2013/0057
Abstract: The present disclosure includes apparatuses and methods for sensing a resistive memory cell. A number of embodiments include performing a sensing operation on a memory cell to determine a current value associated with the memory cell, applying a programming signal to the memory cell, and determining a data state of the memory cell based on the current value associated with the memory cell before applying the programming signal and a current value associated with the memory cell after applying the programming signal.
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公开(公告)号:US20180006044A1
公开(公告)日:2018-01-04
申请号:US15691806
申请日:2017-08-31
Applicant: Micron Technology, Inc.
Inventor: Ashonita A. Chavan , Alessandro Calderoni , D.V. Nirmal Ramaswamy
IPC: H01L27/11507 , H01L29/423 , H01L49/02
Abstract: Ferroelectric memory and methods of forming the same are provided. An example memory cell can include a buried recessed access device (BRAD) formed in a substrate and a ferroelectric capacitor formed on the BRAD.
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公开(公告)号:US20180005681A1
公开(公告)日:2018-01-04
申请号:US15693032
申请日:2017-08-31
Applicant: Micron Technology, Inc.
Inventor: Alessandro Calderoni , Durai Vishak Nirmal Ramaswamy
IPC: G11C11/22
CPC classification number: G11C11/2273 , G11C11/221 , G11C11/2257 , G11C11/2259 , G11C11/2275 , G11C11/2293
Abstract: Methods, systems, and devices for memory array operation are described. A series of pulses may be applied to a fatigued memory cell to improve performance of memory cell. For example, a ferroelectric memory cell may enter a fatigue state after a number of access operations are performed at an access rate. After the number of access operations have been performed at the access rate, a fatigue state of the ferroelectric memory cell may be identified and the series of pulses may be applied to the ferroelectric capacitor at a different (e.g., higher) rate. For instance, a delay between pulses of the series of pulses may be shorter than the delay between access operations of the ferroelectric memory cell.
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公开(公告)号:US20170025474A1
公开(公告)日:2017-01-26
申请号:US14808959
申请日:2015-07-24
Applicant: Micron Technology, Inc.
Inventor: Scott E. Sills , Durai Vishak Nirmal Ramaswamy , Alessandro Calderoni
CPC classification number: H01L45/1233 , H01L27/11507 , H01L27/2409 , H01L27/2436 , H01L27/2472 , H01L45/04 , H01L45/06
Abstract: An array of cross point memory cells comprises spaced first lines which cross spaced second lines. Two memory cells are individually between one of two immediately adjacent of the second lines and a same single one of the first lines.
Abstract translation: 交叉点存储单元的阵列包括交叉隔开的第二行的间隔开的第一行。 两个存储器单元分别位于紧邻第二行的两个中的一个之间,并且第一行中相同的单个单元格之间。
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公开(公告)号:US20150311217A1
公开(公告)日:2015-10-29
申请号:US14263610
申请日:2014-04-28
Applicant: Micron Technology, Inc.
Inventor: Ashonita A. Chavan , Alessandro Calderoni , D.V. Nirmal Ramaswamy
IPC: H01L27/115
CPC classification number: H01L27/11507 , H01L27/10876 , H01L28/90 , H01L29/4236
Abstract: Ferroelectric memory and methods of forming the same are provided. An example memory cell can include a buried recessed access device (BRAD) formed in a substrate and a ferroelectric capacitor formed on the BRAD.
Abstract translation: 提供铁电存储器及其形成方法。 示例性存储单元可以包括形成在衬底中的埋入式存取器件(BRAD)和形成在BRAD上的铁电电容器。
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公开(公告)号:US20150194212A1
公开(公告)日:2015-07-09
申请号:US14151729
申请日:2014-01-09
Applicant: Micron Technology, Inc.
Inventor: Emiliano Faraoni , Scott E. Sills , Alessandro Calderoni , Adam Johnson
IPC: G11C13/00
CPC classification number: G11C13/0064 , G11C13/0011 , G11C13/0069 , G11C2013/0066 , G11C2013/0071 , G11C2013/0073 , G11C2013/0092 , G11C2213/79
Abstract: Memory systems and memory programming methods are described. According to one arrangement, a memory system includes a memory array comprising a plurality of memory cells individually configured to have a plurality of different memory states, access circuitry configured to apply signals to the memory cells to program the memory cells to the different memory states, and a controller to configured to control the access circuitry to apply a first of the signals to one of the memory cells to program the one memory cell from a first memory state to a second memory state different than the first memory state, to determine that the one memory cell failed to place into the second memory state as a result of the application of the first signal, and to control the access circuitry to apply a second signal to the one memory cell to program the one memory cell from the first memory state to the second memory state as a result of the determination, wherein the first and second signals have a different electrical characteristic.
Abstract translation: 描述了存储器系统和存储器编程方法。 根据一种布置,存储器系统包括存储器阵列,该存储器阵列包括单独配置成具有多个不同存储器状态的多个存储器单元,其被配置为将信号施加到存储器单元以将存储器单元编程到不同的存储器状态, 以及控制器,被配置为控制所述访问电路以将所述信号中的第一信号施加到所述存储器单元之一,以将所述一个存储器单元从第一存储器状态编程到与所述第一存储器状态不同的第二存储器状态,以确定所述 作为施加第一信号的结果,一个存储器单元不能进入第二存储器状态,并且控制访问电路将第二信号施加到一个存储器单元,以将一个存储器单元从第一存储器状态编程为 作为确定结果的第二存储器状态,其中第一和第二信号具有不同的电特性。
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公开(公告)号:US12300298B2
公开(公告)日:2025-05-13
申请号:US18047568
申请日:2022-10-18
Applicant: Micron Technology, Inc.
Inventor: Durai Vishak Nirmal Ramaswamy , Giorgio Servalli , Angelo Visconti , Marcello Mariani , Alessandro Calderoni
Abstract: Methods, systems, and devices for differential storage in memory arrays are described. A memory device may include pairs of memory cells configured to store a single logic state (e.g., a single bit of information). Additionally, the memory device may include sense amplifiers configured to sense the logic state based on a difference between a voltage of a first ferroelectric memory cell of the pair of memory cells and a voltage of a second ferroelectric memory cell of the pair of memory cells. In one example, the memory device may include pairs of memory cells within a single memory array on a single level. Here, each memory cell pair may include a memory cells that are each coupled with a same word line and plate line. Additionally, each memory cell pair may include memory cells each coupled with different digit lines.
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公开(公告)号:US20250029638A1
公开(公告)日:2025-01-23
申请号:US18778321
申请日:2024-07-19
Applicant: Micron Technology, Inc.
Inventor: Kamal M. Karda , Karthik Sarpatwari , Alessandro Calderoni , Durai Vishak Nirmal Ramaswamy , Yunfei Gao
IPC: G11C5/06 , H01L23/528 , H10B12/00
Abstract: Some embodiments include apparatuses and methods of operating the apparatuses. One of the apparatuses includes a first memory cell and a second memory cell, each of the first and second memory cells including a first transistor including a first region and a first charge storage structure separated from the first region; a second transistor including a second region formed over the first charge storage structure; a first data line coupled to the first memory cell configured to provide a first sum based on current on the first data line during a memory operation; a second data line coupled to the second memory cell configured to provide a second sum based on current on the second data line during the memory operation; and an output circuit to provide output information based on values of the first and second sums.
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