摘要:
An electrical laminate comprising layers of an unsaturated polyester resin-impregnated fibrous cellulosic substrate is disclosed. The substrate is preimpregnated with a mixture and/or a condensate of an aminoplast with a higher fatty derivative having at least one functional group capable of condensation with the methylol group of aminoplast. The laminate exhibits improved moisture resistance and punchability.
摘要:
An electrical laminate comprising layers of a polyester resin-impregnated fibrous cellulosic substrate is disclosed. The substrate is preimpregnated with a nitrogen-containing composition having (a) an N-methylol or N-lower alkoxymethyl group attached to said nitrogen atom, and (b) an unsaturated group capable of copolymerizing with a cross-linking monomer present in the polyester resin.
摘要:
A clean air apparatus includes a housing having an opening through which a carrier housing semiconductor wafers is supplied into the housing and an I/O port for supporting the carrier and a furnace for treating the wafer, provided in the upper portion of the housing. The carriers are at the same time supported by a first carrier stage provided in the upper portion of the housing and supported by a second carrier stage provided in the lower portion of the housing. The carrier or carriers are selectively moved between the I/O port and the first stage, between the I/O port and the second stage, and between the first stage and the second stage. A clean air is applied to the wafers in the carriers supported by the I/O port, the first stage and the second stage.
摘要:
An electrical laminate comprising layers of a resin impregnated fibrous substrate is disclosed. The resin has a glass transition point from about 20.degree. C. to 80.degree. C. and comprises a cured product of a mixture of an unsaturated polyester polymer and a cross-linking monomer. The laminate exhibits an improved punchability at a temperature not lower but not 20.degree. C. higher than the glass transition point of the resin.
摘要:
A vertical heating apparatus comprises a casing having an opening through which a plurality of transport members receiving articles to be processed are loaded in and unloaded from the casing, a heat treating furnace provided in an upper portion of the casing, a transport member storing portion provided in the casing at a side space of the heat treating furnace, for receiving the transport members, a processing member for transporting the articles to be processed in the heat treating furnace, a transferring mechanism for transferring the articles to be processed and received by the transport members to the processing member, and a vertically moving mechanism provided below the heat treating furnace in the casing, for loading and unloading the articles to be processed and received by the processing member in and from the heat treating furnace.
摘要:
An injection-molding process including kneading functional particles with a binder resin in a kneader, temporarily storing the kneaded material supplied from the kneader in a reservoir device and feeding the kneaded material stored in the reservoir device to an injection device, the reservoir device including a pair of reservoirs, the kneaded material stored in one reservoir device is fed to the injection device where the kneaded material is then injection-molded, and simultaneously the kneaded material is fed from the kneader to another reservoir device and stored in it. Then, the kneaded material stored in the other reservoir device is fed to the injection device where the kneaded material is then injection-molded, and simultaneously the kneaded material is fed from the kneader to the one reservoir device and stored in it, so that the injection molding process is conducted by alternately repeating the above steps by switching operations. This injection-molding process is capable of producing a molded product of uniform quality by preventing feed pressure of the kneaded material fed to an injection device from being transmitted to the kneader.
摘要:
An injection-molding device including an injection machine, a mold unit connected to the injection machine having separable molds defining a cavity for forming a molded product, and chucks next to the mold unit for removing a molded product from the mold. The molded product is initially coolied in the mold cavity then again cooled after removal from the mold unit. Plural chucks are advanced into and retreated from a region defined by the open molds, the chucks being a pair of blocks grasping the surface of the molded product, each block having a circulating path through which a heating medium is passed to cool the grasping surface. The injection-molding apparatus produces articles having high dimensional accuracy, for example, electronic parts such as a magnet roll or the like.
摘要:
A heat treating apparatus comprises a reaction tube for receiving a plurality of articles to be treated and a heating unit surrounding at least part of the reaction tube. The reaction tube comprises a first structural section, at least part of which is surrounded by the heating unit and a second structural section, at least part of which extends from the heating unit. The first structural section is made of material having thermal resistivity and thermal conductivity higher than the second structural section.
摘要:
A resin composition for semiconductor encapsulation having good moldability, of which the cured product has effective electromagnetic wave shieldability, is provided. A resin composition for semiconductor encapsulation, containing spherical sintered ferrite particles having the following properties (a) to (c) : (a) the soluble ion content of the particles is at most 5 ppm; (b) the mean particle size of the particles is from 10 to 50 μm; (c) the crystal structure of the particles by X-ray diffractiometry is a spinel structure.