Method of fabricating semiconductor device
    12.
    发明授权
    Method of fabricating semiconductor device 失效
    制造半导体器件的方法

    公开(公告)号:US6146938A

    公开(公告)日:2000-11-14

    申请号:US340143

    申请日:1999-06-28

    摘要: A native film formed on the surface of a silicon substrate is removed. Arsenic is doped into the surface of the silicon substrate to form an n-type impurity diffusion layer as a lower capacitor electrode. A silicon nitride film as a capacitor insulating film is formed on the n-type impurity diffusion layer without growing any oxide film on the surface of the n-type impurity diffusion layer. An upper capacitor electrode is formed on the silicon nitride film.

    摘要翻译: 去除在硅衬底的表面上形成的天然膜。 砷被掺杂到硅衬底的表面中以形成作为下电容器电极的n型杂质扩散层。 在n型杂质扩散层上形成作为电容绝缘膜的氮化硅膜,而不会在n型杂质扩散层的表面上生长任何氧化膜。 在氮化硅膜上形成上部电容电极。

    Semiconductor device and method of manufacturing the same including a dual layer raised source and drain
    13.
    发明授权
    Semiconductor device and method of manufacturing the same including a dual layer raised source and drain 失效
    半导体器件及其制造方法包括双层升高源极和漏极

    公开(公告)号:US06794713B2

    公开(公告)日:2004-09-21

    申请号:US10655022

    申请日:2003-09-05

    IPC分类号: H01L2976

    摘要: SiGe or SiC films are selectively grown on source/drain regions, followed by selectively growing silicon. A monocrystalline film having a high dislocation density or a polycrystalline film can be grown in growing the silicon film by making the C or Ge concentration higher than a predetermined level. The silicon layer on each of the source/drain regions is not monocrystalline or, even if monocrystalline, has a high density of dislocation. Therefore, the silicon film formed thereon is in the form of a monocrystalline silicon film having a high dislocation density or a polycrystalline silicon film. It is possible to suppress an impurity diffusion to reach a deep region caused by channeling of ions generated in the doping step by means of an ion implantation.

    摘要翻译: SiGe或SiC膜选择性地在源极/漏极区域上生长,随后选择性地生长硅。 通过使C或Ge浓度高于预定水平,可以在生长硅膜时生长具有高位错密度的单晶膜或多晶膜。 源极/漏极区域中的每一个上的硅层不是单晶的,即使单晶也具有高密度的位错。 因此,其上形成的硅膜是具有高位错密度的单晶硅膜或多晶硅膜的形式。 可以通过离子注入来抑制在掺杂步骤中产生的离子的沟道引起的深度区域的杂质扩散。

    Semiconductor device and method of manufacturing the same including raised source/drain comprising SiGe or SiC
    14.
    发明授权
    Semiconductor device and method of manufacturing the same including raised source/drain comprising SiGe or SiC 失效
    半导体器件及其制造方法,包括包含SiGe或SiC的升高源极/漏极

    公开(公告)号:US06713359B1

    公开(公告)日:2004-03-30

    申请号:US09564191

    申请日:2000-05-04

    IPC分类号: H01L21336

    摘要: SiGe or SiC films are selectively grown on source/drain regions, followed by selectively growing silicon. A monocrystalline film having a high dislocation density or a polycrystalline film can be grown in growing the silicon film by making the C or Ge concentration higher than a predetermined level. The silicon layer on each of the source/drain regions is not monocrystalline or, even if monocrystalline, has a high density of dislocation. Therefore, the silicon film formed thereon is in the form of a monocrystalline silicon film having a high dislocation density or a polycrystalline silicon film. It is possible to suppress an impurity diffusion to reach a deep region caused by channeling of ions generated in the doping step by means of an ion implantation.

    摘要翻译: SiGe或SiC膜选择性地在源极/漏极区域上生长,随后选择性地生长硅。 通过使C或Ge浓度高于预定水平,可以在生长硅膜时生长具有高位错密度的单晶膜或多晶膜。 源极/漏极区域中的每一个上的硅层不是单晶的,即使单晶也具有高密度的位错。 因此,其上形成的硅膜是具有高位错密度的单晶硅膜或多晶硅膜的形式。 可以通过离子注入来抑制在掺杂步骤中产生的离子的沟道引起的深度区域的杂质扩散。