利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

75 条记录 (耗时 0.034 秒)

    Chip level package of light-emitting diode
    11.
    发明授权
    Chip level package of light-emitting diode 有权
    芯片级封装的发光二极管

    公开(公告)号：US08344412B2

    公开(公告)日：2013-01-01

    申请号：US12648911

    申请日：2009-12-29

    申请人： Chia-Liang Hsu ,  Shu-Ting Hsu ,  Min-Hsun Hsieh ,  Chih-Chiang Lu ,  Alexander Wang

    发明人： Chia-Liang Hsu ,  Shu-Ting Hsu ,  Min-Hsun Hsieh ,  Chih-Chiang Lu ,  Alexander Wang

    IPC分类号： H01L33/00

    CPC分类号： H01L33/385 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

    摘要： The application discloses a light-emitting diode chip level package structure including: a permanent substrate having a first surface and a second surface; a first electrode on the first surface; a second electrode on the second surface; an adhesive layer on where the first surface of the permanent substrate is not covered by the first electrode; a growth substrate on the adhesive layer; a patterned semiconductor structure on the growth substrate; a third electrode and a fourth electrode on the patterned semiconductor structure and electrically connect with the patterned semiconductor structure; an electrical connecting structure on the sidewall of the patterned semiconductor structure electrically connecting the third electrode and the fourth electrode with the first electrode; and an insulation layer located on the side wall of the patterned semiconductor structure and between the electrical connecting structure for electrically insulating the patterned semiconductor structure.

    摘要翻译： 本申请公开了一种发光二极管芯片级封装结构，包括：具有第一表面和第二表面的永久基板; 第一表面上的第一电极; 在第二表面上的第二电极; 在永久性基板的第一表面未被第一电极覆盖的粘合剂层上; 粘合剂层上的生长衬底; 生长衬底上的图案化半导体结构; 图案化半导体结构上的第三电极和第四电极，并与图案化的半导体结构电连接; 所述图案化半导体结构的侧壁上的电连接结构将所述第三电极和所述第四电极与所述第一电极电连接; 以及位于图案化半导体结构的侧壁上以及用于使图案化半导体结构电绝缘的电连接结构之间的绝缘层。

    LIGHT-EMITTING DEVICE
    12.
    发明申请
    LIGHT-EMITTING DEVICE 有权
    发光装置

    公开(公告)号：US20120261695A1

    公开(公告)日：2012-10-18

    申请号：US13307899

    申请日：2011-11-30

    申请人： Yi-Ming Chen ,  Min-Hsun Hsieh ,  Chia-Liang Hsu

    发明人： Yi-Ming Chen ,  Min-Hsun Hsieh ,  Chia-Liang Hsu

    IPC分类号： H01L33/10

    CPC分类号： H01L33/08 ,  H01L33/0079 ,  H01L33/10 ,  H01L33/38 ,  H01L33/382 ,  H01L33/385 ,  H01L33/405 ,  H01L33/44 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A light-emitting device includes a first electrode; a light-emitting stacked layer on the first electrode; a first contact layer on the light-emitting stacked layer, wherein the first contact layer includes a first contact link and a plurality of first contact lines connected to the first contact link; a first conductive post in the light-emitting stacked layer and electrically connecting the first electrode and the first contact layer; and a passivation layer between the first conductive post and the light-emitting stacked layer.

    摘要翻译： 发光装置包括第一电极; 在第一电极上的发光堆叠层; 在所述发光层叠层上的第一接触层，其中所述第一接触层包括第一接触链和连接到所述第一接触链的多个第一接触线; 在所述发光层叠层中的第一导电柱，并且电连接所述第一电极和所述第一接触层; 以及第一导电柱和发光层叠层之间的钝化层。

    Light-emitting device containing a composite electroplated substrate
    16.
    发明授权
    Light-emitting device containing a composite electroplated substrate 有权
    含有复合电镀基板的发光装置

    公开(公告)号：US08110845B2

    公开(公告)日：2012-02-07

    申请号：US13181222

    申请日：2011-07-12

    申请人： Chia-Liang Hsu ,  Min-Hsun Hsieh ,  Chih-Chiang Lu ,  Chien-Fu Huang

    发明人： Chia-Liang Hsu ,  Min-Hsun Hsieh ,  Chih-Chiang Lu ,  Chien-Fu Huang

    IPC分类号： H01L33/00

    CPC分类号： H01L33/0079 ,  H01L33/405 ,  H01L33/46

    摘要： The application is related to a method of forming a substrate of a light-emitting diode by composite electroplating. The application illustrates a light-emitting diode comprising the following elements: a light-emitting epitaxy structure, a reflective layer disposed on the light-emitting epitaxy structure, a seed layer disposed on the reflective layer, a composite electroplating substrate disposed on the seed layer by composite electroplating, and a protection layer disposed on the composite electroplating substrate.

    摘要翻译： 该应用涉及通过复合电镀形成发光二极管的基板的方法。 本发明示出了包括以下元件的发光二极管：发光外延结构，设置在发光外延结构上的反射层，设置在反射层上的种子层，设置在种子层上的复合电镀基板 通过复合电镀，以及设置在复合电镀基板上的保护层。

    Light-emitting device
    18.
    发明授权
    Light-emitting device 有权

    公开(公告)号：US09601657B2

    公开(公告)日：2017-03-21

    申请号：US13050444

    申请日：2011-03-17

    申请人： Chia-Liang Hsu

    发明人： Chia-Liang Hsu

    IPC分类号： H01L33/00 ,  H01L33/02 ,  H01L33/38 ,  H01L33/10

    CPC分类号： H01L33/02 ,  H01L33/0079 ,  H01L33/10 ,  H01L33/38 ,  H01L33/382 ,  H01L33/385

    摘要： This disclosure discloses a light-emitting device. The light-emitting device comprises: a substrate; an intermediate layer formed on the substrate; a transparent bonding layer; a first semiconductor window layer bonded to the semiconductor layer through the transparent bonding layer; and a light-emitting stack formed on the first semiconductor window layer. The intermediate layer has a refractive index between the refractive index of the substrate and the refractive index of the first semiconductor window layer.

    METHOD FOR FORMING LIGHT-EMITTING DEVICE
    19.
    发明申请
    METHOD FOR FORMING LIGHT-EMITTING DEVICE 有权
    形成发光装置的方法

    公开(公告)号：US20130273673A1

    公开(公告)日：2013-10-17

    申请号：US13446228

    申请日：2012-04-13

    申请人： Chia-Liang Hsu ,  Chih-Chiang Lu

    发明人： Chia-Liang Hsu ,  Chih-Chiang Lu

    IPC分类号： H01L21/66 ,  H01L33/08

    CPC分类号： H01L33/0095 ,  G01R31/2635 ,  H01L27/156

    摘要： A method for forming a light-emitting device of the present application comprises providing a wafer; forming a first plurality of light-emitting elements on the wafer; providing a first connection structure to connect each of the first plurality of light-emitting elements; and applying a current flow to one of the first plurality of light-emitting elements for testing at least one electrical property of the light-emitting element while no current flow is applied to the remaining of the first plurality of light-emitting elements.

    摘要翻译： 本申请的发光装置的形成方法包括提供晶片; 在晶片上形成第一组多个发光元件; 提供第一连接结构以连接所述第一多个发光元件中的每一个; 以及向所述第一多个发光元件中的一个施加电流，以测试所述发光元件的至少一个电特性，同时不向所述第一多个发光元件的剩余部分施加电流。

    Chip-bonding light emitting diode chip
    20.
    发明授权
    Chip-bonding light emitting diode chip 有权
    芯片贴片发光二极管芯片

    公开(公告)号：US08283683B2

    公开(公告)日：2012-10-09

    申请号：US12629030

    申请日：2009-12-01

    申请人： Chang-Da Tsai ,  Wei-Che Wu ,  Chia-Liang Hsu ,  Ching-Shih Ma

    发明人： Chang-Da Tsai ,  Wei-Che Wu ,  Chia-Liang Hsu ,  Ching-Shih Ma

    IPC分类号： H01L33/00

    CPC分类号： H01L33/0079 ,  H01L33/30 ,  H01L33/385 ,  H01L33/40 ,  H01L33/405 ,  H01L33/483 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49107 ,  H01L2924/181 ,  H01L2924/00012

    摘要： A light emitting diode chip includes a permanent substrate having a holding space formed on the permanent substrate; an insulating layer and a metal layer sequentially formed on the permanent substrate and the holding spacer; a die having a eutectic layer and a light-emitting region and bonded to the metal layer within the holding space via the eutectic layer coupling to the metal layer; a filler structure filled between the holding space and the die; and an electrode formed on the die and in contact with the light-emitting region.

    摘要翻译： 发光二极管芯片包括永久性基板，其具有形成在永久基板上的保持空间; 绝缘层和顺序地形成在永久性基板和保持间隔物上的金属层; 具有共晶层和发光区域的管芯，并通过耦合到金属层的共晶层与保持空间内的金属层接合; 填充在所述保持空间和所述模具之间的填充结构; 以及形成在管芯上并与发光区域接触的电极。