公开(公告)号：US10186633B2

公开(公告)日：2019-01-22

申请号：US15683238

申请日：2017-08-22

Applicant: NICHIA CORPORATION

Inventor： Satoshi Shichijo ,  Kunihito Sugimoto ,  Kenji Ozeki ,  Shogo Abe

IPC: H01L33/20 ,  H01L33/60 ,  H01L33/50 ,  H01L25/075 ,  H01L25/16 ,  H01L33/54 ,  H01L33/62

Abstract: A method of manufacturing a light emitting device includes: forming a light-transmissive member that is substantially rectangular in a plan view to cover an upper surface of a light emitting element mounted on a base member; and forming a frame body so as to surround the light-transmissive member, wherein, in the step of forming the frame body, the frame body is formed such that a distance from an upper surface of the base member to an upper end of the frame body is smaller along a short side of the light-transmissive member than along a long side of the light-transmissive member.

公开(公告)号：US12264791B2

公开(公告)日：2025-04-01

申请号：US18625067

申请日：2024-04-02

Applicant: NICHIA CORPORATION

Inventor： Satoshi Shichijo ,  Tatsuya Hayashi ,  Yusuke Hayashi ,  Masahiro Okazaki

IPC: F21K9/64 ,  F21K9/68 ,  F21S41/176 ,  F21Y115/10

Abstract: A light-emitting device includes a light-emitting element, a light-transmissive member, and a first light adjustment member. The light-transmissive member has a first upper surface, a second upper surface, a lower surface facing a first surface of a support substrate of the light-emitting element, a first lateral surface contiguous with the first upper surface and the second upper surface, a second lateral surface contiguous with the second upper surface and the lower surface, and a third lateral surface contiguous with the first upper surface and the lower surface. The first light adjustment member exposes the first upper surface of the light-transmissive member and covers the second upper surface and the first lateral surface of the light-transmissive member. The light-transmissive member and the first light adjustment member collectively define a rectangular cross-sectional shape.

公开(公告)号：US10651336B2

公开(公告)日：2020-05-12

申请号：US16579422

申请日：2019-09-23

Applicant: NICHIA CORPORATION

Inventor： Takeshi Kususe ,  Satoshi Shichijo ,  Kunihito Sugimoto

IPC: H01L33/54 ,  H01L33/00 ,  H01L33/32 ,  H01L25/075 ,  H01L33/62 ,  H01L21/56 ,  H01L33/44 ,  H01L33/60 ,  H01L33/40 ,  H01L33/50 ,  H01L33/38

Abstract: A light-emitting device includes: a mounting base; a plurality of light-emitting elements mounted on or above the mounting base; a plurality of light-transmissive members respectively disposed on upper surfaces of the plurality of light-emitting elements; a plurality of light guide members respectively covering lateral surfaces of the plurality of light-emitting elements; a plurality of antireflective films respectively disposed on upper surfaces of the plurality of the light-transmissive members; and a covering member covering lateral surfaces of the plurality of antireflective films.

公开(公告)号：US10461215B2

公开(公告)日：2019-10-29

申请号：US16024620

申请日：2018-06-29

Applicant: NICHIA CORPORATION

Inventor： Takeshi Kususe ,  Satoshi Shichijo ,  Kunihito Sugimoto

IPC: H01L33/00 ,  H01L33/32 ,  H01L25/075 ,  H01L33/62 ,  H01L21/56 ,  H01L33/40 ,  H01L33/50 ,  H01L33/38 ,  H01L33/44

Abstract: A method of manufacturing a light-emitting device includes: directly bonding a plurality of light-emitting elements to a collective light-transmissive member having a plate shape, each light-emitting element comprising a plurality of electrodes; subsequently, forming stud bumps on each electrode of each light-emitting element; subsequently, dividing the collective light-transmissive member to obtain a plurality of light-transmissive members on each of which one or more of the light-emitting elements are bonded; and subsequently, mounting the light-emitting elements on or above a mounting base by a flip-chip technique.

公开(公告)号：US10279728B2

公开(公告)日：2019-05-07

申请号：US15662702

申请日：2017-07-28

Applicant: NICHIA CORPORATION

Inventor： Satoshi Shichijo

IPC: B60Q1/04 ,  F21S45/10 ,  H01L33/60 ,  H01L33/50 ,  F21S43/14 ,  F21S41/64 ,  F21S41/141

Abstract: A light emitting device includes a light emitting element, a first light transmissive member, a second light transmissive member, and a light reflective member. The first light transmissive member contains a first phosphor. The first light transmissive member is in contact with an upper surface of the light emitting element, and has an area smaller than the light emitting element in a plan view. The second light transmissive member contains a second phosphor. The second light transmissive member covers lateral surfaces of the first light transmissive member and a part of the upper surface of the light emitting element that is exposed from the first light transmissive member, with an upper surface of the first light transmissive member being not covered by the second light transmissive member. The light reflective member covers lateral surfaces of the second light transmissive member and lateral surfaces of the light emitting element.

公开(公告)号：US09991434B2

公开(公告)日：2018-06-05

申请号：US14976702

申请日：2015-12-21

Applicant: NICHIA CORPORATION

Inventor： Masatsugu Ichikawa ,  Satoshi Shichijo ,  Takehito Shimatsu

IPC: H01L33/00 ,  H01L27/15 ,  H01L33/64 ,  H01L21/00 ,  H01L23/00 ,  C04B37/00 ,  H01L23/373

CPC classification number: H01L33/64 ,  C04B37/00 ,  H01L23/3735 ,  H01L23/3736 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/33 ,  H01L33/0079 ,  H01L33/641 ,  H01L33/644 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2924/01047 ,  H01L2924/01079

Abstract: A semiconductor device includes an insulating substrate,a semiconductor element disposed on an upper surface of the substrate, a heat dissipation member, and a metal bonding layer that bonds the lower surface of the substrate to the upper surface of the heat dissipation member, and the area of the upper surface of the heat dissipation member is larger than the area of the lower surface of the substrate, and the metal bonding layer contacts the whole of the lower surface of the substrate and has an area larger than the area of the lower surface of the substrate, and the heat conductivity of the metal bonding layer is higher than the heat conductivity of the heat dissipation member.

公开(公告)号：US09722156B2

公开(公告)日：2017-08-01

申请号：US15239914

申请日：2016-08-18

Applicant: NICHIA CORPORATION

Inventor： Satoshi Shichijo ,  Kunihito Sugimoto ,  Kenji Ozeki

IPC: H01L33/50 ,  H01L33/60 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58

CPC classification number: H01L33/60 ,  H01L33/50 ,  H01L33/502 ,  H01L33/505 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58

Abstract: A light-emitting device includes a light-emitting element; a first light transmissive member that is disposed over the light-emitting element and that includes a first upper surface, a lower surface, a first lateral surface; and a second lateral surface positioned outside the first lateral surface, a second light transmissive member that covers at least a part of the first lateral surface; and a light reflective member that is disposed on a lateral surface of the second light transmissive member, the second lateral surface of the first light transmissive member, and a lateral surface of the light-emitting element.