公开(公告)号：US09559006B2

公开(公告)日：2017-01-31

申请号：US14821369

申请日：2015-08-07

Applicant: Nichia Corporation

Inventor： Takayuki Sogo ,  Takanobu Sogai ,  Takeshi Kususe

IPC: H01L33/00 ,  H01L21/78 ,  H01L33/48 ,  H01L33/38 ,  H01L33/36 ,  H01L33/62 ,  H01L33/40

CPC classification number: H01L33/385 ,  H01L21/78 ,  H01L33/36 ,  H01L33/38 ,  H01L33/382 ,  H01L33/405 ,  H01L33/48 ,  H01L33/483 ,  H01L33/486 ,  H01L33/56 ,  H01L33/62 ,  H01L2933/0016 ,  H01L2933/0033 ,  H01L2933/005

Abstract: A light emitting device includes a semiconductor light emitting element including a semiconductor stacked-layer body and an electrode disposed on a first surface of the semiconductor stacked-layer body; a resin member disposed on a first surface side of the semiconductor stacked-layer body; and a metal layer disposed in the resin member and electrically connected to the electrode. A recess is defined in an upper surface of the resin member. The metal layer is projected from the upper surface of the resin member, and is disposed to surround at least a portion of the recess.

Abstract translation: 发光器件包括半导体发光元件，其包括半导体叠层体和设置在半导体叠层体的第一表面上的电极; 树脂构件，设置在所述半导体层叠体的第一表面侧; 以及设置在所述树脂构件中并电连接到所述电极的金属层。 在树脂构件的上表面中限定凹部。 金属层从树脂构件的上表面突出，并且设置成围绕凹部的至少一部分。

公开(公告)号：US09293674B2

公开(公告)日：2016-03-22

申请号：US14176375

申请日：2014-02-10

Applicant: NICHIA CORPORATION ,  CITIZEN ELECTRONICS CO., LTD. ,  CITIZEN HOLDINGS CO., LTD.

Inventor： Takeshi Kususe ,  Toshiaki Ogawa ,  Shunsuke Minato ,  Nodoka Oyamada

IPC: H01L33/62 ,  H01L33/50 ,  H01L33/38 ,  H01L33/54 ,  H01L23/00 ,  H01L33/46

CPC classification number: H01L33/62 ,  H01L24/96 ,  H01L33/38 ,  H01L33/382 ,  H01L33/46 ,  H01L33/505 ,  H01L33/54 ,  H01L2224/04105 ,  H01L2924/12036 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00

Abstract: A semiconductor device has a light emitting element, and a resin layer; the light emitting element includes a semiconductor laminated body in which a first semiconductor layer and a second semiconductor layer are laminated in sequence, a second electrode connected to the second semiconductor layer on an upper surface of the second semiconductor layer that forms an upper surface of the semiconductor laminated body, and a first electrode connected to the first semiconductor layer on an upper surface of the first semiconductor layer in which a portion of the second semiconductor layer on one surface of the semiconductor laminated body is removed and a portion of the first semiconductor layer is exposed; and the resin layer is configured to cover at least a side surface of the light emitting element, and an upper surface of the resin layer is lower than the upper surface of the semiconductor laminated body.

Abstract translation: 半导体器件具有发光元件和树脂层; 发光元件包括依次层叠有第一半导体层和第二半导体层的半导体层叠体，在形成第二半导体层的上表面的第二半导体层的上表面上连接到第二半导体层的第二电极 半导体层叠体以及在第一半导体层的上表面与第一半导体层连接的第一电极，其中半导体层叠体的一个表面上的第二半导体层的一部分被去除，并且第一半导体层的一部分 被暴露 并且所述树脂层被构造成覆盖所述发光元件的至少一个侧表面，并且所述树脂层的上表面低于所述半导体层叠体的上表面。

公开(公告)号：US10326064B2

公开(公告)日：2019-06-18

申请号：US15955391

申请日：2018-04-17

Applicant: NICHIA CORPORATION

Inventor： Shusaku Bando ,  Dai Wakamatsu ,  Takeshi Kususe

IPC: H01L33/48 ,  H01L33/50 ,  H01L33/60

Abstract: A light emitting device includes a light emitting element, a light transmissive member, and a cover member. The light transmissive member is disposed on an upper face of the light emitting element. The cover member covers a lateral face of the light emitting element and a lateral face of the light transmissive member, and includes first and second cover members. The first cover member is disposed adjacent to the lateral face of the light emitting element and the lateral face of the light transmissive member, and contains a first light reflecting material and a fluorine-based first resin. The second cover member covers the first cover member, and contains a second light reflecting material and a second resin. A refractive index difference between the first light reflecting material and the first resin is larger than a refractive index difference between the second light reflecting material and the second resin.

公开(公告)号：US10243124B2

公开(公告)日：2019-03-26

申请号：US15831392

申请日：2017-12-05

Applicant: NICHIA CORPORATION

Inventor： Taiki Yuasa ,  Takeshi Kususe

IPC: H01L33/60 ,  H01L33/46 ,  H01L33/50 ,  H01L33/62 ,  H01L33/56 ,  H01L33/48

Abstract: A light emitting device includes a light emitting element having a light emitting surface from which the light emitting element is configured to emit a first light having a first peak emission wavelength in a wavelength range of 380 nm or longer and 430 nm or shorter. A light transform layer is disposed on the light emitting surface of the light emitting element to transform the first light to a second light having a second peak wavelength longer than the first peak wavelength. A reflecting film is provided on the light transform layer to reflect the first light and to transmit the second light. The reflecting film has a reflectivity of 40% or more in a reflection spectrum of the reflecting film with respect to a light having a wavelength of 380 nm or longer and 430 nm or shorter and an angle of incidence from 0° to 85°.

公开(公告)号：US20180182941A1

公开(公告)日：2018-06-28

申请号：US15831392

申请日：2017-12-05

Applicant: NICHIA CORPORATION

Inventor： Taiki YUASA ,  Takeshi Kususe

IPC: H01L33/60 ,  H01L33/50

CPC classification number: H01L33/60 ,  H01L33/46 ,  H01L33/486 ,  H01L33/502 ,  H01L33/504 ,  H01L33/56 ,  H01L33/62 ,  H01L2224/16245 ,  H01L2933/0083

Abstract: A light emitting device includes a light emitting element having a light emitting surface from which the light emitting element is configured to emit a first light having a first peak emission wavelength in a wavelength range of 380 nm or longer and 430 nm or shorter. A light transform layer is disposed on the light emitting surface of the light emitting element to transform the first light to a second light having a second peak wavelength longer than the first peak wavelength. A reflecting film is provided on the light transform layer to reflect the first light and to transmit the second light. The reflecting film has a reflectivity of 40% or more in a reflection spectrum of the reflecting film with respect to a light having a wavelength of 380 nm or longer and 430 nm or shorter and an angle of incidence from 0° to 85°.

公开(公告)号：US10651336B2

公开(公告)日：2020-05-12

申请号：US16579422

申请日：2019-09-23

Applicant: NICHIA CORPORATION

Inventor： Takeshi Kususe ,  Satoshi Shichijo ,  Kunihito Sugimoto

IPC: H01L33/54 ,  H01L33/00 ,  H01L33/32 ,  H01L25/075 ,  H01L33/62 ,  H01L21/56 ,  H01L33/44 ,  H01L33/60 ,  H01L33/40 ,  H01L33/50 ,  H01L33/38

Abstract: A light-emitting device includes: a mounting base; a plurality of light-emitting elements mounted on or above the mounting base; a plurality of light-transmissive members respectively disposed on upper surfaces of the plurality of light-emitting elements; a plurality of light guide members respectively covering lateral surfaces of the plurality of light-emitting elements; a plurality of antireflective films respectively disposed on upper surfaces of the plurality of the light-transmissive members; and a covering member covering lateral surfaces of the plurality of antireflective films.

公开(公告)号：US10461215B2

公开(公告)日：2019-10-29

申请号：US16024620

申请日：2018-06-29

Applicant: NICHIA CORPORATION

Inventor： Takeshi Kususe ,  Satoshi Shichijo ,  Kunihito Sugimoto

IPC: H01L33/00 ,  H01L33/32 ,  H01L25/075 ,  H01L33/62 ,  H01L21/56 ,  H01L33/40 ,  H01L33/50 ,  H01L33/38 ,  H01L33/44

Abstract: A method of manufacturing a light-emitting device includes: directly bonding a plurality of light-emitting elements to a collective light-transmissive member having a plate shape, each light-emitting element comprising a plurality of electrodes; subsequently, forming stud bumps on each electrode of each light-emitting element; subsequently, dividing the collective light-transmissive member to obtain a plurality of light-transmissive members on each of which one or more of the light-emitting elements are bonded; and subsequently, mounting the light-emitting elements on or above a mounting base by a flip-chip technique.

公开(公告)号：US09893238B2

公开(公告)日：2018-02-13

申请号：US15385419

申请日：2016-12-20

Applicant: NICHIA CORPORATION

Inventor： Takayuki Sogo ,  Takanobu Sogai ,  Takeshi Kususe

IPC: H01L33/62 ,  H01L33/38 ,  H01L21/78 ,  H01L33/40 ,  H01L33/48 ,  H01L33/56 ,  H01L33/36

CPC classification number: H01L33/385 ,  H01L21/78 ,  H01L33/36 ,  H01L33/38 ,  H01L33/382 ,  H01L33/405 ,  H01L33/48 ,  H01L33/483 ,  H01L33/486 ,  H01L33/56 ,  H01L33/62 ,  H01L2933/0016 ,  H01L2933/0033 ,  H01L2933/005

Abstract: A light emitting device includes a semiconductor light emitting element including a semiconductor stacked-layer body and an electrode disposed on a first surface of the semiconductor stacked-layer body; a resin member disposed on a first surface side of the semiconductor stacked-layer body; and a metal layer disposed in the resin member and electrically connected to the electrode. A recess is defined in an upper surface of the resin member. The metal layer is projected from the upper surface of the resin member, and is disposed to surround at least a portion of the recess.

公开(公告)号：US08742438B2

公开(公告)日：2014-06-03

申请号：US13711444

申请日：2012-12-11

Applicant: Nichia Corporation

Inventor： Takeshi Kususe ,  Takahiko Sakamoto

IPC: H01L29/201

CPC classification number: H01L33/60 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L27/156 ,  H01L33/08 ,  H01L33/20 ,  H01L33/32 ,  H01L33/385 ,  H01L33/62 ,  H01L2224/04042 ,  H01L2224/0603 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/48091 ,  H01L2224/48139 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01059 ,  H01L2924/0106 ,  H01L2924/01063 ,  H01L2924/01065 ,  H01L2924/01066 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/0107 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/10336 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/00012

Abstract: A nitride semiconductor light-emitting device includes a layered portion emitting light on a substrate. The layered portion includes an n-type semiconductor layer, an active layer, and a p-type semiconductor layer. The periphery of the layered portion is inclined, and the surface of the n-type semiconductor layer is exposed at the periphery. An n electrode is disposed on the exposed surface of the n-type semiconductor layer. This device structure can enhance the emission efficiency and the light extraction efficiency.

Abstract translation: 氮化物半导体发光器件包括在衬底上发光的层状部分。 分层部分包括n型半导体层，有源层和p型半导体层。 层叠部的周边倾斜，并且n型半导体层的表面在周边露出。 n电极设置在n型半导体层的暴露表面上。 该器件结构可以提高发光效率和光提取效率。