公开(公告)号：US20220173280A1

公开(公告)日：2022-06-02

申请号：US17536993

申请日：2021-11-29

Applicant: NICHIA CORPORATION

Inventor： Toshiaki YAMASHITA

IPC: H01L33/50 ,  H01L33/00 ,  G02B5/20

Abstract: A light-transmissive member includes: a light transmitting portion having an emission surface from which light is emitted; and a metal region on the emission surface, wherein the metal region comprises either (i) a metal film having a thickness in a range of 1 nm to 10 nm, or (ii) dispersed metal particles each having a maximum length in a direction perpendicular to the emission surface in a range of 1 nm to 100 nm.

公开(公告)号：US20210091531A1

公开(公告)日：2021-03-25

申请号：US17016202

申请日：2020-09-09

Applicant: NICHIA CORPORATION

Inventor： Akinori HARA ,  Toshiaki YAMASHITA

IPC: H01S5/026 ,  G02B27/30

Abstract: A light emission device includes: a plurality of semiconductor light-emitting elements; an optical element configured to collimate light emitted from each of the plurality of semiconductor light-emitting elements and output a plurality of collimated beams; a converging portion having an aspheric surface configured to converge the plurality of collimated beams; and a wavelength-converting portion including a transmissive region and a reflective region that surrounds the transmissive region, the transmissive region including a light-incident surface at which the plurality of collimated beams enter, wherein the transmissive region includes a phosphor adapted to be excited by the plurality of collimated beams that have been converged by the converging portion.

公开(公告)号：US20180087726A1

公开(公告)日：2018-03-29

申请号：US15711339

申请日：2017-09-21

Applicant: NICHIA CORPORATION

Inventor： Toshiaki YAMASHITA

IPC: F21K9/64 ,  F21V13/04 ,  F21V29/505 ,  F21V29/70 ,  F21V9/16 ,  G02B5/04

CPC classification number: F21K9/64 ,  F21V5/04 ,  F21V9/30 ,  F21V13/04 ,  F21V29/505 ,  F21V29/507 ,  F21V29/70 ,  F21Y2115/10 ,  F21Y2115/30 ,  G02B5/04 ,  G02B7/182 ,  H01S5/005 ,  H01S5/02208 ,  H01S5/02292

Abstract: A light emitting device includes a support member, a semiconductor laser element, a light reflecting member, and a wavelength conversion member. The support member has a base and a cap that includes a light extraction window from which light is extracted upward. The semiconductor laser element is disposed within a space defined by the base and the cap. The light reflecting member is disposed in the space at a position where light from the semiconductor laser element is reflected toward the light extraction window. The wavelength conversion member is disposed between the semiconductor laser element and the light reflecting member, and includes a support surface that supports the light reflecting member, and a light incidence surface on which the light emitted by the semiconductor laser element is incident. Part of the wavelength conversion member is fitted into the light extraction window.

公开(公告)号：US20180080631A1

公开(公告)日：2018-03-22

申请号：US15709886

申请日：2017-09-20

Applicant: NICHIA CORPORATION

Inventor： Masahiko SANO ,  Toshiaki YAMASHITA

IPC: F21V9/16 ,  F21V29/507 ,  F21K9/64 ,  F21V29/85

CPC classification number: F21V9/30 ,  C09K11/00 ,  F21K9/64 ,  F21S41/176 ,  F21V9/32 ,  F21V13/14 ,  F21V29/507 ,  F21V29/86 ,  F21Y2115/30 ,  H01L33/508 ,  H01S5/005 ,  H01S5/02216 ,  H01S5/02296

Abstract: A phosphor-containing member includes a base portion made of a diffuse reflective ceramic, and a plurality of phosphor portions each containing a phosphor and made of a ceramic. The plurality of phosphor portions are disposed directly on an upper surface of the base portion and are spaced apart from each other. A light emitting device includes the phosphor-containing member and a light source that is spaced apart from the phosphor-containing member and configured to irradiate light for exciting the phosphors on an upper surface of each of the phosphor portions.

公开(公告)号：US20210332475A1

公开(公告)日：2021-10-28

申请号：US17230763

申请日：2021-04-14

Applicant: NICHIA CORPORATION

Inventor： Naoki EBOSHI ,  Hiroaki YUTO ,  Hiroki SAKATA ,  Toshiaki YAMASHITA ,  Akinori HARA

IPC: C23C14/58 ,  H01S5/0225 ,  F21V7/26 ,  C23C14/14

Abstract: A method for manufacturing a wavelength conversion member, includes: providing a wavelength conversion layer having a phosphor-containing portion and a light reflecting portion surrounding the phosphor-containing portion, and the wavelength conversion layer having an upper surface, a bottom surface and at least one side surface; forming a light-blocking film on the upper surface of the wavelength conversion layer; and removing a part of the light-blocking film by laser processing to expose at least a part of the phosphor-containing portion from the light-blocking film.

公开(公告)号：US20200343689A1

公开(公告)日：2020-10-29

申请号：US16834828

申请日：2020-03-30

Applicant: NICHIA CORPORATION

Inventor： Toshiaki YAMASHITA

IPC: H01S5/06 ,  H01S5/323 ,  H01S5/30 ,  H01S5/022

Abstract: A light emitting device includes a plurality of semiconductor laser elements, a light-transmissive member, and a wavelength conversion member. Each of the semiconductor laser elements is configured to emit light having a first wavelength. The light-transmissive member includes a plurality of first inclined surfaces and a lower surface. The light-transmissive member is positioned with respect to the semiconductor laser elements so that beams of the light emitted from the semiconductor laser elements enter the light-transmissive member respectively through the first inclined surfaces and exit from the lower surface. The wavelength conversion member is disposed in contact with the lower surface of the light-transmissive member and configured to convert at least a portion of the light exiting from the lower surface to wavelength-converted light having a second wavelength.

公开(公告)号：US20200066951A1

公开(公告)日：2020-02-27

申请号：US16667379

申请日：2019-10-29

Applicant: NICHIA CORPORATION

Inventor： Toshiaki YAMASHITA

IPC: H01L33/60 ,  F21K9/64 ,  H01L33/64 ,  H01L33/50 ,  H01S5/022 ,  H01L33/44

Abstract: A light-emitting device includes: a semiconductor laser element; a surrounding member surrounding the semiconductor laser element; a fluorescent member containing a fluorescent material that is excitable by light emitted from the semiconductor laser element so as to emit light having a wavelength different from a wavelength of the light emitted from the semiconductor laser element; a supporting member located above the surrounding member, wherein the supporting member comprises a through-hole that allows light emitted from the semiconductor laser element to pass therethrough, and wherein the fluorescent member is located in the through-hole; a light-transmissive heat dissipating member, wherein a lower surface of the heat dissipating member is bonded to the surrounding member, and an upper surface of the heat dissipating member is bonded to the supporting member; and a reflective film disposed on the heat dissipating member.

公开(公告)号：US20180149591A1

公开(公告)日：2018-05-31

申请号：US15814828

申请日：2017-11-16

Applicant: NICHIA CORPORATION

Inventor： Toshiaki YAMASHITA

IPC: G01N21/64 ,  H01L33/50

CPC classification number: G01N21/64 ,  F21K9/64 ,  F21S41/16 ,  F21S41/176 ,  F21V9/30 ,  F21Y2115/30 ,  G01N2021/6419 ,  H01L33/502 ,  H01S5/005 ,  H01S5/0071 ,  H01S5/02212 ,  H01S5/02216 ,  H01S5/02296 ,  H01S5/4031 ,  H01S5/4087

Abstract: A light emitting device includes a fluorescent material, a first laser element and a second laser element. The first laser element is configured to emit a first laser light to excite the fluorescent material. The first laser light having a first peak wavelength that is shorter than an excitation peak wavelength of the fluorescent material. The second laser element is configured to emit a second laser light to excite the fluorescent material. The second laser light has a second peak wavelength that is longer than the excitation peak wavelength of the fluorescent material.

公开(公告)号：US20170345984A1

公开(公告)日：2017-11-30

申请号：US15608661

申请日：2017-05-30

Applicant: NICHIA CORPORATION

Inventor： Toshiaki YAMASHITA

IPC: H01L33/60 ,  H01L33/44 ,  H01L33/50 ,  H01L33/54 ,  H01L33/40

CPC classification number: H01L33/60 ,  F21K9/64 ,  F21S41/16 ,  H01L33/405 ,  H01L33/44 ,  H01L33/50 ,  H01L33/507 ,  H01L33/54 ,  H01L33/644 ,  H01S5/005 ,  H01S5/02212 ,  H01S5/02296 ,  H01S5/02469

Abstract: A light-emitting device includes: a semiconductor laser element; a supporting member located above the semiconductor laser element, the supporting member having a through-hole that allows light emitted from the semiconductor laser element to pass therethrough; a fluorescent member located in the through-hole, the fluorescent member containing a fluorescent material that is excitable by light emitted from the semiconductor laser element so as to emit light having a wavelength different from a wavelength of the light emitted from the semiconductor laser element; and a light-transmissive heat dissipating member including: a base portion, and a projecting portion projecting from the base portion into the through-hole. An upper surface of the projecting portion of the heat dissipating member is bonded to a lower surface of the fluorescent member. An upper surface of the base portion of the heat dissipating member is bonded to a lower surface of the supporting member.

公开(公告)号：US20170184254A1

公开(公告)日：2017-06-29

申请号：US15384519

申请日：2016-12-20

Applicant: NICHIA CORPORATION

Inventor： Toshiaki YAMASHITA

IPC: F21K9/64 ,  F21V29/70 ,  F21V29/502 ,  F21V13/08

CPC classification number: F21V29/502 ,  F21S41/14 ,  F21S41/16 ,  F21V9/30 ,  F21Y2115/30 ,  G02F2001/133614 ,  G03B21/204 ,  H04N9/31

Abstract: A wavelength conversion member includes a light-reflecting member configured to reflect laser light, and a phosphor-containing layer disposed on the light-reflecting member. The phosphor-containing layer includes one or more projecting portions each configured to be irradiated with laser light. An area of each projecting portion is larger than an area of a spot of the laser light in a plan view. A light source device includes the wavelength-converting member and one or more laser elements. The wavelength-converting member is arranged at a position so that laser light emitted from the one or more laser elements are irradiated on a corresponding one of the one or more projecting portions.