公开(公告)号：US20190199052A1

公开(公告)日：2019-06-27

申请号：US16230690

申请日：2018-12-21

Applicant: Nichia Corporation

Inventor： Tomonori MIYOSHI ,  Masanobu TANAKA ,  Hiroaki YUTO ,  Akinori HARA ,  Teruhiko NOGUCHI

IPC: H01S3/08 ,  H01L33/50 ,  F21K9/64 ,  H01S5/024

CPC classification number: H01S3/08086 ,  F21K9/64 ,  H01L33/501 ,  H01S5/02469

Abstract: An optical member includes a conversion member including a first surface that serves as a light-irradiated surface or a light extraction surface, and adapted to convert laser light, which is an excitation light, into light having a wavelength different from a wavelength of the excitation light; a holding member holding the conversion member and including a second surface that is continuous with the first surface of the conversion member; and a wiring having an elongated shape and extending continuously along the first surface of the conversion member and the second surface of the holding member.

公开(公告)号：US20210332475A1

公开(公告)日：2021-10-28

申请号：US17230763

申请日：2021-04-14

Applicant: NICHIA CORPORATION

Inventor： Naoki EBOSHI ,  Hiroaki YUTO ,  Hiroki SAKATA ,  Toshiaki YAMASHITA ,  Akinori HARA

IPC: C23C14/58 ,  H01S5/0225 ,  F21V7/26 ,  C23C14/14

Abstract: A method for manufacturing a wavelength conversion member, includes: providing a wavelength conversion layer having a phosphor-containing portion and a light reflecting portion surrounding the phosphor-containing portion, and the wavelength conversion layer having an upper surface, a bottom surface and at least one side surface; forming a light-blocking film on the upper surface of the wavelength conversion layer; and removing a part of the light-blocking film by laser processing to expose at least a part of the phosphor-containing portion from the light-blocking film.

公开(公告)号：US20170363269A1

公开(公告)日：2017-12-21

申请号：US15621166

申请日：2017-06-13

Applicant: NICHIA CORPORATION

Inventor： Masahiko SANO ,  Hiroaki YUTO ,  Naoki EBOSHI ,  Toru TAKASONE

IPC: F21V9/16 ,  F21V5/04 ,  F21V7/00 ,  F21V29/70 ,  F21Y2115/30

CPC classification number: F21V9/30 ,  F21K9/64 ,  F21V5/04 ,  F21V7/00 ,  F21V7/26 ,  F21V9/32 ,  F21V13/14 ,  F21V29/70 ,  F21Y2115/30 ,  H01L33/50 ,  H01S5/005 ,  H01S5/02216 ,  H01S5/02248 ,  H01S5/02292 ,  H05B33/145

Abstract: A light emitting device includes a laser light, a wavelength conversion member, a base member and a lid. The wavelength conversion member includes a plurality of projected portions each extending along a first direction on an upper surface side thereof and arranged side by side in a second direction. Each of the plurality of projected portions has a first surface extending along the first direction. The first surface is inclined with respect to a reference surface. The laser light source and the wavelength conversion member are arranged so that an optical axis of first light from the laser light source extends along the second direction when viewed from above and is inclined with respect to the reference surface, and light directly incident to the first surface along a direction parallel to the optical axis of the first light is regularly reflected toward an upward direction.

公开(公告)号：US20250096519A1

公开(公告)日：2025-03-20

申请号：US18882322

申请日：2024-09-11

Applicant: NICHIA CORPORATION

Inventor： Hiroaki YUTO

IPC: H01S5/02208 ,  H01S5/02255 ,  H01S5/0236 ,  H01S5/042

Abstract: A light-emitting device according to an embodiment of the present disclosure includes: a light-emitting element; a base having an upper surface opposite to a lower surface of the light-emitting element, the base directly or indirectly supporting the light-emitting element; a lid body having a flat plate-like shape and having a lower surface opposite to an upper surface of the light-emitting element; and a first frame portion located on the upper surface of the base and surrounding the light-emitting element, in which the base includes a first conductor portion bonded to the lower surface of the light-emitting element, the lid body includes a second conductor portion bonded to the upper surface of the light-emitting element, and the first frame portion is directly or indirectly bonded to the lid body.

公开(公告)号：US20240255679A1

公开(公告)日：2024-08-01

申请号：US18419139

申请日：2024-01-22

Applicant: NICHIA CORPORATION

Inventor： Hiroaki YUTO

IPC: G02B5/08 ,  G02B1/02 ,  G02B1/10 ,  H01S5/00

CPC classification number: G02B5/0808 ,  G02B1/02 ,  G02B1/10 ,  H01S5/0071

Abstract: A method of manufacturing a silicon optical member includes: providing a silicon substrate having a first primary surface and a second primary surface; forming a mask pattern on the first primary surface; forming one or more inclined surfaces by wet etching the silicon substrate from the first primary surface using the mask pattern as a mask; forming a third primary surface at a location closer to the first primary surface than to the second primary surface by partially removing the silicon substrate from the second primary surface toward the first primary surface without reaching the one or more inclined surfaces while the silicon substrate is supported at the first primary surface; and singulating the silicon substrate into a plurality of silicon optical members such that each of the plurality of silicon optical members includes the third primary surface and at least one of the one or more inclined surfaces.

公开(公告)号：US20180316157A1

公开(公告)日：2018-11-01

申请号：US16031683

申请日：2018-07-10

Applicant: NICHIA CORPORATION

Inventor： Akinori YONEDA ,  Shinya SONOBE ,  Hiroaki YUTO

IPC: H01S5/022 ,  C25D5/02 ,  C25D7/12 ,  C23C14/18 ,  C25D3/38 ,  C23C14/34

Abstract: The method includes the steps of: preparing a single crystal SiC including an upper surface 10a and a lower surface 10b and provided with a micropipe 11 penetrating from the upper surface 10a to the lower surface 10b; forming a first seed layer 21 made of a metal material on the upper surface 10a of the single crystal SiC; and forming a first plated layer 31 on the first seed layer 21 so as to close an upper end of the micropipe 11, using an electroplating method.

公开(公告)号：US20180021889A1

公开(公告)日：2018-01-25

申请号：US15648780

申请日：2017-07-13

Applicant: NICHIA CORPORATION

Inventor： Naoki EBOSHI ,  Hiroaki YUTO

IPC: B23K26/364 ,  F21K9/90 ,  F21K9/64

CPC classification number: B23K26/364 ,  B23K26/0006 ,  B23K26/0624 ,  B23K26/083 ,  B23K26/359 ,  B23K26/402 ,  B23K2101/36 ,  B23K2103/52 ,  F21K9/64 ,  F21K9/90 ,  F21Y2115/30

Abstract: A wavelength conversion member manufacturing method includes providing a wavelength conversion member having an upper surface, and forming, in the wavelength conversion member, at least one depressed portion having an inclined surface inclined with respect to the upper surface by irradiating the wavelength conversion member with a pulsed laser beam from above. The forming of the at least one depressed portion includes performing a set of scanning more than once at different processing depths in regions overlapping each other in a top view, the set of scanning includes performing scanning with the pulsed laser beam along a first direction more than once at irradiation positions shifted in a second direction perpendicular to the first direction in the top view, and the performing of the scanning includes applying the pulsed laser beam at a fixed processing depth.

公开(公告)号：US20160118767A1

公开(公告)日：2016-04-28

申请号：US14920134

申请日：2015-10-22

Applicant: NICHIA CORPORATION

Inventor： Akinori YONEDA ,  Shinya SONOBE ,  Hiroaki YUTO

IPC: H01S5/022 ,  H05K1/09 ,  H05K3/18 ,  H05K3/06 ,  C23C14/18 ,  C25D3/38 ,  C25D7/12 ,  C25D5/02 ,  C23C14/34 ,  H05K1/03 ,  H05K3/16

CPC classification number: H01S5/02272 ,  C23C14/185 ,  C23C14/34 ,  C25D3/38 ,  C25D5/022 ,  C25D7/123 ,  H01S5/02212

Abstract: The method includes the steps of: preparing a single crystal SiC including an upper surface 10a and a lower surface 10b and provided with a micropipe 11 penetrating from the upper surface 10a to the lower surface 10b; forming a first seed layer 21 made of a metal material on the upper surface 10a of the single crystal SiC; and forming a first plated layer 31 on the first seed layer 21 so as to close an upper end of the micropipe 11, using an electroplating method.

Abstract translation: 该方法包括以下步骤：制备包括上表面10a和下表面10b的单晶SiC，并且具有从上表面10a穿透到下表面10b的微管11; 在单晶SiC的上表面10a上形成由金属材料制成的第一晶种层21; 并且在第一晶种层21上形成第一镀层31，以便使用电镀方法封闭微管11的上端。

公开(公告)号：US20230216268A1

公开(公告)日：2023-07-06

申请号：US18181150

申请日：2023-03-09

Applicant: NICHIA CORPORATION

Inventor： Tomonori MIYOSHI ,  Hiroaki YUTO

IPC: H01S5/00 ,  H01S5/068 ,  H01S5/042 ,  H01S5/02257

CPC classification number: H01S5/0087 ,  H01S5/06825 ,  H01S5/042 ,  H01S5/02257 ,  H01S5/02469

Abstract: An optical member includes: a conversion member including a fluorescent material; a light reflecting ceramic holding the conversion member, the conversion member and the light reflecting ceramic having a continuous surface; a light-transmissive film on the continuous surface; and a wiring on the light-transmissive film.

公开(公告)号：US20210359489A1

公开(公告)日：2021-11-18

申请号：US17388728

申请日：2021-07-29

Applicant: NICHIA CORPORATION

Inventor： Tomonori MIYOSHI ,  Hiroaki YUTO ,  Teruhiko NOGUCHI

IPC: H01S5/00 ,  H01S5/068 ,  H01S5/042 ,  H01S5/02257

Abstract: A method of manufacturing an optical member includes: providing a conversion member and a holding member connected to the conversion member; removing a portion of the conversion member and a portion of the holding member to obtain a first surface of the conversion member and a second surface of the holding member; and heat-treating the first surface of the conversion member and the second surface of the holding member.