公开(公告)号：US20160372644A1

公开(公告)日：2016-12-22

申请号：US15257067

申请日：2016-09-06

Applicant: NICHIA CORPORATION

Inventor： Takeshi IKEGAMI ,  Suguru BEPPU ,  Tatsuya KANAZAWA ,  Yoichi BANDO

IPC: H01L33/58 ,  H01L33/56 ,  H01L33/50 ,  H01L27/15 ,  H01L33/62

CPC classification number: H01L33/58 ,  H01L27/156 ,  H01L33/486 ,  H01L33/50 ,  H01L33/56 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2924/18161 ,  H01L2933/0041 ,  H01L2933/0058

Abstract: A method of producing a light emitting device includes providing a light emitting element on a base member, the base member including an insulating member and a pair of connection terminals at least on an upper surface thereof. The connection terminals have an exposed portion exposed to outside, with the light emitting element electrically connected to the connection terminals. A covering member is disposed to cover at least a portion of the upper surface of the light emitting element, and a protective layer is disposed to cover at least a portion of the exposed portions of the connection terminals. The covering member is removed, and material from the upper surface side of the base member is supplied to dispose a light-transmissive member on the upper surface of the light emitting element. At least a portion of the light-transmissive member present on the protective layer is then removed.

公开(公告)号：US20210074878A1

公开(公告)日：2021-03-11

申请号：US17016207

申请日：2020-09-09

Applicant: NICHIA CORPORATION

Inventor： Yoichi BANDO

IPC: H01L33/00 ,  H01L25/075

Abstract: A method for manufacturing a light emitting device includes: preparing a substrate having a first region and a second region surrounding the first region; mounting a plurality of light emitting elements in the first region; mounting a reinforcement member on the second region; forming and curing a sealing member in contact with the reinforcement member and with the light emitting elements, the sealing member having a lower rigidity than the reinforcement member; and cutting the substrate, the reinforcement member, and the sealing member to separate into individual light emitting devices each including one or more of the light emitting elements.

公开(公告)号：US20200098964A1

公开(公告)日：2020-03-26

申请号：US16582197

申请日：2019-09-25

Applicant: NICHIA CORPORATION

Inventor： Toru HASHIMOTO ,  Yoichi BANDO ,  Tadaaki IKEDA ,  Gensui TAMURA

IPC: H01L33/62 ,  H01L25/075 ,  H01L33/40

Abstract: The method of manufacturing a light emitting device includes: providing a first intermediate body, the first intermediate body including a temporary substrate including a base and a pair of first wirings, and a light emitting element including a pair of element electrodes, each of the pair of element electrodes connected to a respective one of the first wirings via a respective one of a plurality of solders; removing a portion of the temporary substrate to form a second intermediate body having a second lower surface in which a lower surface of each of the element electrodes and a lower surface of each of the plurality of solders are located; and forming a pair of external connection electrodes on the second lower surface such that each of the pair of external connection electrodes cover a respective one of the element electrodes and a respective one of the plurality of solders.

公开(公告)号：US20170229624A1

公开(公告)日：2017-08-10

申请号：US15495822

申请日：2017-04-24

Applicant: NICHIA CORPORATION

Inventor： Suguru BEPPU ,  Yoichi BANDO ,  Hiroto TAMAKI ,  Takuya NAKABAYASHI

IPC: H01L33/60 ,  H01L33/50

CPC classification number: H01L33/60 ,  H01L33/50 ,  H01L2224/73253 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/0058

Abstract: A light emitting device includes a semiconductor light emitting element; and a light reflective member having a multilayer structure and covering the side faces of the semiconductor light emitting element. The light reflective member includes: a first layer disposed on an inner, semiconductor light emitting element side, the first layer comprising a light-transmissive resin containing a light reflective substance, and a second layer disposed in contact with an outer side of the first layer, the second layer comprising a light-transmissive resin containing the light reflective substance at a lower content than that of the first layer.

公开(公告)号：US20150340550A1

公开(公告)日：2015-11-26

申请号：US14718292

申请日：2015-05-21

Applicant: NICHIA CORPORATION

Inventor： Takeshi IKEGAMI ,  Suguru BEPPU ,  Tatsuya KANAZAWA ,  Yoichi BANDO

IPC: H01L33/00 ,  H01L33/62 ,  H01L33/58 ,  H01L33/56

CPC classification number: H01L33/58 ,  H01L27/156 ,  H01L33/486 ,  H01L33/50 ,  H01L33/56 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2924/18161 ,  H01L2933/0041 ,  H01L2933/0058

Abstract: A method of producing a light emitting device includes providing a light emitting element on a base member, the base member including an insulating member and a pair of connection terminals at least on an upper surface thereof. The connection terminals have an exposed portion exposed to outside, with the light emitting element electrically connected to the connection terminals. A covering member is disposed to cover at least a portion of the upper surface of the light emitting element, and a protective layer is disposed to cover at least a portion of the exposed portions of the connection terminals. The covering member is removed, and material from the upper surface side of the base member is supplied to dispose a light-transmissive member on the upper surface of the light emitting element. At least a portion of the light-transmissive member present on the protective layer is then removed.

Abstract translation: 一种制造发光器件的方法包括在基底构件上设置发光元件，所述基底构件至少在其上表面上包括绝缘构件和一对连接端子。 连接端子具有暴露于外部的暴露部分，其中发光元件电连接到连接端子。 覆盖构件设置成覆盖发光元件的上表面的至少一部分，并且设置保护层以覆盖连接端子的暴露部分的至少一部分。 除去覆盖部件，从基材的上表面侧供给材料，在发光元件的上表面设置透光性部件。 然后去除保护层上存在的透光部件的至少一部分。