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公开(公告)号:US20170229624A1
公开(公告)日:2017-08-10
申请号:US15495822
申请日:2017-04-24
Applicant: NICHIA CORPORATION
Inventor: Suguru BEPPU , Yoichi BANDO , Hiroto TAMAKI , Takuya NAKABAYASHI
CPC classification number: H01L33/60 , H01L33/50 , H01L2224/73253 , H01L2933/0033 , H01L2933/0041 , H01L2933/0058
Abstract: A light emitting device includes a semiconductor light emitting element; and a light reflective member having a multilayer structure and covering the side faces of the semiconductor light emitting element. The light reflective member includes: a first layer disposed on an inner, semiconductor light emitting element side, the first layer comprising a light-transmissive resin containing a light reflective substance, and a second layer disposed in contact with an outer side of the first layer, the second layer comprising a light-transmissive resin containing the light reflective substance at a lower content than that of the first layer.
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公开(公告)号:US20150340550A1
公开(公告)日:2015-11-26
申请号:US14718292
申请日:2015-05-21
Applicant: NICHIA CORPORATION
Inventor: Takeshi IKEGAMI , Suguru BEPPU , Tatsuya KANAZAWA , Yoichi BANDO
CPC classification number: H01L33/58 , H01L27/156 , H01L33/486 , H01L33/50 , H01L33/56 , H01L33/62 , H01L2224/16225 , H01L2924/18161 , H01L2933/0041 , H01L2933/0058
Abstract: A method of producing a light emitting device includes providing a light emitting element on a base member, the base member including an insulating member and a pair of connection terminals at least on an upper surface thereof. The connection terminals have an exposed portion exposed to outside, with the light emitting element electrically connected to the connection terminals. A covering member is disposed to cover at least a portion of the upper surface of the light emitting element, and a protective layer is disposed to cover at least a portion of the exposed portions of the connection terminals. The covering member is removed, and material from the upper surface side of the base member is supplied to dispose a light-transmissive member on the upper surface of the light emitting element. At least a portion of the light-transmissive member present on the protective layer is then removed.
Abstract translation: 一种制造发光器件的方法包括在基底构件上设置发光元件,所述基底构件至少在其上表面上包括绝缘构件和一对连接端子。 连接端子具有暴露于外部的暴露部分,其中发光元件电连接到连接端子。 覆盖构件设置成覆盖发光元件的上表面的至少一部分,并且设置保护层以覆盖连接端子的暴露部分的至少一部分。 除去覆盖部件,从基材的上表面侧供给材料,在发光元件的上表面设置透光性部件。 然后去除保护层上存在的透光部件的至少一部分。
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公开(公告)号:US20190140152A1
公开(公告)日:2019-05-09
申请号:US16218292
申请日:2018-12-12
Applicant: NICHIA CORPORATION
Inventor: Suguru BEPPU , Yoichi BANDO , Hiroto TAMAKI , Takuya NAKABAYASHI
Abstract: A light emitting device includes a semiconductor light emitting element; and a light reflective member having a multilayer structure and covering the side faces of the semiconductor light emitting element. The light reflective member includes: a first layer disposed on an inner, semiconductor light emitting element side, the first layer comprising a light-transmissive resin containing a light reflective substance, and a second layer disposed in contact with an outer side of the first layer, the second layer comprising a light-transmissive resin containing the light reflective substance at a lower content than that of the first layer.
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公开(公告)号:US20160093780A1
公开(公告)日:2016-03-31
申请号:US14866317
申请日:2015-09-25
Applicant: Nichia Corporation
Inventor: Suguru BEPPU , Yoichi BANDO , Hiroto TAMAKI , Takuya NAKABAYASHI
CPC classification number: H01L33/60 , H01L33/50 , H01L2224/73253 , H01L2933/0033 , H01L2933/0041 , H01L2933/0058
Abstract: A light emitting device includes a semiconductor light emitting element; and a light reflective member having a multilayer structure and covering the side faces of the semiconductor light emitting element. The light reflective member includes: a first layer disposed on an inner, semiconductor light emitting element side, the first layer comprising a light-transmissive resin containing a light reflective substance, and a second layer disposed in contact with an outer side of the first layer, the second layer comprising a light-transmissive resin containing the light reflective substance at a lower content than that of the first layer.
Abstract translation: 发光器件包括半导体发光元件; 以及具有多层结构并覆盖半导体发光元件的侧面的光反射构件。 光反射构件包括:设置在内部半导体发光元件侧的第一层,第一层包括含有光反射物质的透光树脂,以及设置成与第一层的外侧接触的第二层 第二层包括含有比第一层低的含量的光反射物质的透光树脂。
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5.
公开(公告)号:US20140346548A1
公开(公告)日:2014-11-27
申请号:US14454492
申请日:2014-08-07
Applicant: Nichia Corporation
Inventor: Suguru BEPPU , Takuya Noichi
CPC classification number: H01L33/505 , H01L33/44 , H01L33/60 , H01L2224/13 , H01L2933/0041
Abstract: A light emitting device includes a light emitting element having electrodes on a lower surface side thereof; a phosphor layer covering a surface of the light emitting element; a transparent covering member disposed on at least one side surface of the light emitting device; and a reflection member that covers the covering member.
Abstract translation: 发光器件包括在其下表面侧具有电极的发光元件; 覆盖所述发光元件的表面的荧光体层; 设置在所述发光装置的至少一个侧表面上的透明覆盖部件; 以及覆盖覆盖部件的反射部件。
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公开(公告)号:US20210013385A1
公开(公告)日:2021-01-14
申请号:US17034899
申请日:2020-09-28
Applicant: NICHIA CORPORATION
Inventor: Tadao HAYASHI , Teruhito AZUMA , Suguru BEPPU , Kunihiro IZUNO , Tsuyoshi OKAHISA
Abstract: A method of manufacturing a covering member includes: providing a first light-reflective member comprising a through-hole, the through-hole having first and second openings; arranging a light-transmissive resin containing a wavelength-conversion material within the through-hole; distributing the wavelength-conversion material predominantly on a side of the first opening of the through-hole within the light-transmissive resin; and after the step of distributing the wavelength-conversion material, removing a portion of the light-transmissive resin from a side of the second opening of the through-hole.
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公开(公告)号:US20200176652A1
公开(公告)日:2020-06-04
申请号:US16784387
申请日:2020-02-07
Applicant: NICHIA CORPORATION
Inventor: Suguru BEPPU , Yoichi BANDO , Hiroto TAMAKI , Takuya NAKABAYASHI
IPC: H01L33/60 , H01L33/50 , H01L21/3213
Abstract: A light emitting device includes: a light emitting element; a wavelength conversion member disposed on or above an upper surface of the light emitting element; a light-transmissive member disposed on an upper surface of the wavelength conversion member; and a light reflective member disposed on each side surface of the light emitting element, the wavelength conversion member, and the light-transmissive member, wherein an upper surface of the light reflective member is coplanar with an upper surface of the light-transmissive member, and wherein each of the upper surface of the light reflective member and the upper surface of the light-transmissive member is a cut surface.
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8.
公开(公告)号:US20190312183A1
公开(公告)日:2019-10-10
申请号:US16447935
申请日:2019-06-20
Applicant: NICHIA CORPORATION
Inventor: Tadao HAYASHI , Teruhito AZUMA , Suguru BEPPU , Kunihiro IZUNO , Tsuyoshi OKAHISA
Abstract: A method of manufacturing a covering member includes: providing a first light-reflective member comprising a through-hole, the through-hole having first and second openings; arranging a light-transmissive resin containing a wavelength-conversion material within the through-hole; distributing the wavelength-conversion material predominantly on a side of the first opening of the through-hole within the light-transmissive resin; and after the step of distributing the wavelength-conversion material, removing a portion of the light-transmissive resin from a side of the second opening of the through-hole.
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公开(公告)号:US20190081217A1
公开(公告)日:2019-03-14
申请号:US16158080
申请日:2018-10-11
Applicant: NICHIA CORPORATION
Inventor: Suguru BEPPU
CPC classification number: H01L33/50 , H01L33/0095 , H01L33/54 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2224/16225 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0058
Abstract: A method of manufacturing a light emitting device includes: mounting a light emitting element on a board; forming a cover layer that contains light reflecting material at a place on the board where the light emitting element is not positioned after the mounting of the light emitting element; and forming a phosphor layer that contains a phosphor by spraying on surfaces of the light emitting element and the cover layer after the forming of the cover layer.
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公开(公告)号:US20180151786A1
公开(公告)日:2018-05-31
申请号:US15879812
申请日:2018-01-25
Applicant: NICHIA CORPORATION
Inventor: Suguru BEPPU , Yoichi BANDO , Hiroto TAMAKI , Takuya NAKABAYASHI
CPC classification number: H01L33/60 , H01L33/50 , H01L2224/73253 , H01L2933/0033 , H01L2933/0041 , H01L2933/0058
Abstract: A light emitting device includes a semiconductor light emitting element; and a light reflective member having a multilayer structure and covering the side faces of the semiconductor light emitting element. The light reflective member includes: a first layer disposed on an inner, semiconductor light emitting element side, the first layer comprising a light-transmissive resin containing a light reflective substance, and a second layer disposed in contact with an outer side of the first layer, the second layer comprising a light-transmissive resin containing the light reflective substance at a lower content than that of the first layer.
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