公开(公告)号：US20170092825A1

公开(公告)日：2017-03-30

申请号：US15280535

申请日：2016-09-29

Applicant: NICHIA CORPORATION

Inventor： Yoichi BANDO

IPC: H01L33/60 ,  H01L33/38 ,  H01L33/50 ,  H01L33/62

CPC classification number: H01L33/60 ,  H01L33/38 ,  H01L33/50 ,  H01L33/507 ,  H01L33/56 ,  H01L33/62 ,  H01L2933/0041 ,  H01L2933/0058

Abstract: A method of manufacturing a light emitting device includes providing a reflecting sheet having a first surface and a second surface and defining through-holes; placing a wavelength-converting sheet on a first surface side of the reflecting sheet to cover openings of the through-holes at the first surface side; disposing a light-transmissive adhesive in the through-holes; disposing a light emitting element in each of the through-holes so that a light emitting surface of the light emitting element faces the wavelength converting sheet; fixing the light emitting element in the through-hole via the adhesive; and covering the second surface of the reflecting sheet and an outer surface of the adhesive with a reflecting material.

公开(公告)号：US20190140152A1

公开(公告)日：2019-05-09

申请号：US16218292

申请日：2018-12-12

Applicant: NICHIA CORPORATION

Inventor： Suguru BEPPU ,  Yoichi BANDO ,  Hiroto TAMAKI ,  Takuya NAKABAYASHI

IPC: H01L33/60 ,  H01L33/50

Abstract: A light emitting device includes a semiconductor light emitting element; and a light reflective member having a multilayer structure and covering the side faces of the semiconductor light emitting element. The light reflective member includes: a first layer disposed on an inner, semiconductor light emitting element side, the first layer comprising a light-transmissive resin containing a light reflective substance, and a second layer disposed in contact with an outer side of the first layer, the second layer comprising a light-transmissive resin containing the light reflective substance at a lower content than that of the first layer.

公开(公告)号：US20170033267A1

公开(公告)日：2017-02-02

申请号：US15220681

申请日：2016-07-27

Applicant: NICHIA CORPORATION

Inventor： Hiroto TAMAKI ,  Yoshiki SATO ,  Yoichi BANDO

IPC: H01L33/52 ,  H01L33/60 ,  H01L33/50

CPC classification number: H01L33/52 ,  H01L33/46 ,  H01L33/50 ,  H01L33/502 ,  H01L33/505 ,  H01L33/507 ,  H01L33/508 ,  H01L33/56 ,  H01L33/60 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2933/0025 ,  H01L2933/0041 ,  H01L2933/005

Abstract: A light emitting device is provided. The light emitting device includes a light emitting element, a wavelength converting member, a light transmissive member, an adhesive member, and a light reflective member. The wavelength converting member has an upper surface and lateral surfaces, contains a fluorescent substance, and is placed on the light emitting element. The light transmissive member covers the upper surface of the wavelength converting member. The adhesive member is interposed between the light emitting element and the wavelength converting member, and covers the lateral surfaces of the wavelength converting member. The light reflective member covers the lateral surfaces of the wavelength converting member via the adhesive member.

Abstract translation: 提供了一种发光器件。 发光装置包括发光元件，波长转换构件，透光构件，粘合构件和光反射构件。 波长转换构件具有上表面和侧表面，包含荧光物质，并且被放置在发光元件上。 透光构件覆盖波长转换构件的上表面。 粘合剂构件插入在发光元件和波长转换构件之间，并且覆盖波长转换构件的侧表面。 光反射构件通过粘合构件覆盖波长转换构件的侧表面。

公开(公告)号：US20160093780A1

公开(公告)日：2016-03-31

申请号：US14866317

申请日：2015-09-25

Applicant: Nichia Corporation

Inventor： Suguru BEPPU ,  Yoichi BANDO ,  Hiroto TAMAKI ,  Takuya NAKABAYASHI

IPC: H01L33/60 ,  H01L33/50

CPC classification number: H01L33/60 ,  H01L33/50 ,  H01L2224/73253 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/0058

Abstract: A light emitting device includes a semiconductor light emitting element; and a light reflective member having a multilayer structure and covering the side faces of the semiconductor light emitting element. The light reflective member includes: a first layer disposed on an inner, semiconductor light emitting element side, the first layer comprising a light-transmissive resin containing a light reflective substance, and a second layer disposed in contact with an outer side of the first layer, the second layer comprising a light-transmissive resin containing the light reflective substance at a lower content than that of the first layer.

Abstract translation: 发光器件包括半导体发光元件; 以及具有多层结构并覆盖半导体发光元件的侧面的光反射构件。 光反射构件包括：设置在内部半导体发光元件侧的第一层，第一层包括含有光反射物质的透光树脂，以及设置成与第一层的外侧接触的第二层 第二层包括含有比第一层低的含量的光反射物质的透光树脂。

公开(公告)号：US20230013159A1

公开(公告)日：2023-01-19

申请号：US17864066

申请日：2022-07-13

Applicant: NICHIA CORPORATION

Inventor： Satoshi YOSHINAGA ,  Takuya NAKABAYASHI ,  Yuki SHIBUTANI ,  Yoichi BANDO ,  Yasushi OKAMOTO

IPC: F21V8/00

Abstract: A planar light source includes: a light guide member, a light source including a light-emitting element and a first light adjustment member and being disposed in a first hole of the light guide member, a first light-transmissive member disposed in the first hole between a lateral surface of the light source and the light guide member and on the light source, and a second light adjustment member disposed on the first light-transmissive member. A transmittance of the first light-transmissive member is higher than a transmittance of the first light adjustment member and a transmittance of the second light adjustment member with respect to light emitted from the light source. The first light-transmissive member includes a first light-transmissive portion 1ocated between the first light adjustment member and the second light adjustment member, and a second light-transmissive portion 1ocated between the lateral surface of the light source and the light guide member.

公开(公告)号：US20200176652A1

公开(公告)日：2020-06-04

申请号：US16784387

申请日：2020-02-07

Applicant: NICHIA CORPORATION

Inventor： Suguru BEPPU ,  Yoichi BANDO ,  Hiroto TAMAKI ,  Takuya NAKABAYASHI

IPC: H01L33/60 ,  H01L33/50 ,  H01L21/3213

Abstract: A light emitting device includes: a light emitting element; a wavelength conversion member disposed on or above an upper surface of the light emitting element; a light-transmissive member disposed on an upper surface of the wavelength conversion member; and a light reflective member disposed on each side surface of the light emitting element, the wavelength conversion member, and the light-transmissive member, wherein an upper surface of the light reflective member is coplanar with an upper surface of the light-transmissive member, and wherein each of the upper surface of the light reflective member and the upper surface of the light-transmissive member is a cut surface.

公开(公告)号：US20170125654A1

公开(公告)日：2017-05-04

申请号：US15337318

申请日：2016-10-28

Applicant: NICHIA CORPORATION

Inventor： Yoichi BANDO

IPC: H01L33/60

CPC classification number: H01L33/60 ,  H01L33/46 ,  H01L2933/0058

Abstract: A method for manufacturing a light emitting device, includes: providing a reflective film; providing a light emitting element having a semiconductor stacked layer and electrodes formed at a first main surface side of the light emitting element; pressing the reflective film on the first main surface side to deform the reflective film, and disposing the reflective film on at least a side surface of the light emitting element; and exposing the electrodes of the light emitting element from the

公开(公告)号：US20240387480A1

公开(公告)日：2024-11-21

申请号：US18663022

申请日：2024-05-13

Applicant: NICHIA CORPORATION

Inventor： Yoichi BANDO

IPC: H01L25/075

Abstract: A method for manufacturing a substrate includes: preparing a substrate intermediate including a plurality of bases each having an upper surface and an outer lateral surface, and a support member supporting the bases such that the outer lateral surfaces of the bases are spaced apart from each other; preparing a plate-shaped member defining a plurality of openings; disposing the plate-shaped member on the support member such that at least a portion of an inner lateral surface of each of the openings and at least a portion of the outer lateral surface of a corresponding one of the bases face each other via a gap; supplying a resin member to the gap such that the resin member covers the outer lateral surface of each of the bases; and curing the resin member to form a covering layer covering the outer lateral surface of each of the bases.

公开(公告)号：US20230116946A1

公开(公告)日：2023-04-20

申请号：US18046907

申请日：2022-10-14

Applicant: NICHIA CORPORATION

Inventor： Takuya NAKABAYASHI ,  Daisuke IWAKURA ,  Yoichi BANDO ,  Yasunori SHINOMIYA ,  Satoshi YOSHINAGA

IPC: F21V8/00

Abstract: A light emitting module includes a light source, a light guide member, and first and second light reflective members. The light guide member is configured to transmit light from the light source. The light guide member having an upper surface and a lower surface opposite to the upper surface. The first light reflective member is arranged on a lower surface side of the light guide member. The first light reflective member has a lower surface. The first light reflective member includes a first resin, and a first reflective body having a refractive index higher than a refractive index of the first resin. The second light reflective member is arranged on a lower surface side of the first light reflective member. The second light reflective member includes a second resin, and a second reflective body having a refractive index lower than a refractive index of the second resin.

公开(公告)号：US20180151786A1

公开(公告)日：2018-05-31

申请号：US15879812

申请日：2018-01-25

Applicant: NICHIA CORPORATION

Inventor： Suguru BEPPU ,  Yoichi BANDO ,  Hiroto TAMAKI ,  Takuya NAKABAYASHI

IPC: H01L33/60 ,  H01L33/50

CPC classification number: H01L33/60 ,  H01L33/50 ,  H01L2224/73253 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/0058

Abstract: A light emitting device includes a semiconductor light emitting element; and a light reflective member having a multilayer structure and covering the side faces of the semiconductor light emitting element. The light reflective member includes: a first layer disposed on an inner, semiconductor light emitting element side, the first layer comprising a light-transmissive resin containing a light reflective substance, and a second layer disposed in contact with an outer side of the first layer, the second layer comprising a light-transmissive resin containing the light reflective substance at a lower content than that of the first layer.