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公开(公告)号：US20170213941A1
公开(公告)日：2017-07-27
申请号：US15483269
申请日：2017-04-10
Applicant: NICHIA CORPORATION
Inventor： Takeshi IKEGAMI , Tadao HAYASHI , Hiroto TAMAKI
CPC classification number: H01L33/502 , H01L33/486 , H01L33/501 , H01L33/505 , H01L33/508 , H01L2224/16225 , H01L2933/0033 , H01L2933/0041
Abstract: A method of manufacturing a light emitting device including: forming a supporting body on a mounting surface of each of semiconductor light emitting elements; arranging the semiconductor light emitting elements to be spaced apart from each other by a predetermined distance; and forming a wavelength conversion layer to continuously cover an upper surface and side surfaces of at least one of the semiconductor light emitting elements. The forming the wavelength conversion layer includes spraying a slurry provided by mixing particles of a wavelength conversion member and a thermosetting resin in a solvent onto the upper surface and the side surfaces of the semiconductor light emitting element, so that a thickness of the wavelength conversion layer at a lower portion of the side surfaces of the supporting body is smaller than the thickness on the upper surface and the side surfaces of the semiconductor light emitting element.
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2.发明申请公开(公告)号：US20200103095A1
公开(公告)日：2020-04-02
申请号：US16577202
申请日：2019-09-20
Applicant: NICHIA CORPORATION
Inventor： Takuya SUGIMURA , Naoki EBOSHI , Takeshi IKEGAMI
IPC: F21V9/30 , H01L33/50 , H01L33/48 , F21V29/502 , F21V29/85 , F21V29/70 , B32B7/12 , B32B3/26 , B32B18/00 , B32B37/12 , B32B37/18 , B32B38/00
Abstract: A wavelength conversion member complex includes a wavelength conversion member, a joining material, and a heat dissipation member. The wavelength conversion member includes a support and a phosphor member. The support defines a through-hole extending from an upper surface to a lower surface. The support has a concave portion on the lower surface around the through-hole. The concave portion is spaced apart from the through-hole. The phosphor member is disposed in the through-hole and includes a phosphor. The lower surface of the phosphor member is continuous with the lower surface of the support. The joining material is disposed in the concave portion, and has a lower surface that is flush with the lower surface of the support. The heat dissipation member is disposed under the joining material and the phosphor member, and has an upper surface in contact with the lower surface of the joining material.
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公开(公告)号：US20170200868A1
公开(公告)日：2017-07-13
申请号：US15468540
申请日：2017-03-24
Applicant: NICHIA CORPORATION
Inventor： Takuya NAKABAYASHI , Takeshi IKEGAMI , Tadaaki IKEDA , Tadao HAYASHI , Hiroto TAMAKI
CPC classification number: H01L33/486 , H01L24/97 , H01L25/13 , H01L33/387 , H01L33/502 , H01L33/54 , H01L33/62 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/12035 , H01L2924/12041 , H01L2924/12042 , H01L2924/00
Abstract: A light emitting device includes a base body, a light emitting element and a sealing member. The base body includes a base material and a pair of connection terminals on at least a first main surface of the base material. The light emitting element is connected to the connection terminals. The sealing member seals the light emitting element. The sealing member includes a light transmissive member disposed on an upper surface of the light emitting element, and a light shielding member sealing an end surface of the light emitting element and an end surface of the light transmissive member. The base material has a linear expansion coefficient within ±10 ppm/° C. of a linear expansion coefficient of the light emitting element.
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公开(公告)号：US20160372644A1
公开(公告)日：2016-12-22
申请号：US15257067
申请日：2016-09-06
Applicant: NICHIA CORPORATION
Inventor： Takeshi IKEGAMI , Suguru BEPPU , Tatsuya KANAZAWA , Yoichi BANDO
CPC classification number: H01L33/58 , H01L27/156 , H01L33/486 , H01L33/50 , H01L33/56 , H01L33/62 , H01L2224/16225 , H01L2924/18161 , H01L2933/0041 , H01L2933/0058
Abstract: A method of producing a light emitting device includes providing a light emitting element on a base member, the base member including an insulating member and a pair of connection terminals at least on an upper surface thereof. The connection terminals have an exposed portion exposed to outside, with the light emitting element electrically connected to the connection terminals. A covering member is disposed to cover at least a portion of the upper surface of the light emitting element, and a protective layer is disposed to cover at least a portion of the exposed portions of the connection terminals. The covering member is removed, and material from the upper surface side of the base member is supplied to dispose a light-transmissive member on the upper surface of the light emitting element. At least a portion of the light-transmissive member present on the protective layer is then removed.
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公开(公告)号：US20150171281A1
公开(公告)日：2015-06-18
申请号：US14568256
申请日：2014-12-12
Applicant: NICHIA CORPORATION
Inventor： Takuya NAKABAYASHI , Takeshi IKEGAMI , Tadaaki IKEDA , Tadao HAYASHI , Hiroto TAMAKI
CPC classification number: H01L33/486 , H01L24/97 , H01L25/13 , H01L33/387 , H01L33/502 , H01L33/54 , H01L33/62 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/12035 , H01L2924/12041 , H01L2924/12042 , H01L2924/00
Abstract: Provided is a small and thin light emitting device which has no connection failure, a high life, high performance and good light extraction efficiency. The light emitting device includes a base body comprising a base material having a pair of connection terminals on at least a first main surface, a light emitting element connected to the connection terminals, and a sealing member that seals the light emitting element, wherein the base material has a linear expansion coefficient within ±10 ppm/° C. of the linear expansion coefficient of the light emitting element.
Abstract translation: 提供了一种小而薄的发光装置，其没有连接故障，高寿命，高性能和良好的光提取效率。 发光器件包括：基体，其包括在至少第一主表面上具有一对连接端子的基底材料，连接到连接端子的发光元件和密封发光元件的密封构件，其中基底 材料的线性膨胀系数在发光元件的线性膨胀系数的±10ppm /℃以内。
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Patent Agency Ranking
公开(公告)号：US20170098742A1
公开(公告)日：2017-04-06
申请号：US15383711
申请日：2016-12-19
Applicant: NICHIA CORPORATION
Inventor： Takeshi IKEGAMI , Hiroto TAMAKI
CPC classification number: H01L33/502 , H01L25/0753 , H01L27/153 , H01L33/20 , H01L33/32 , H01L33/46 , H01L33/486 , H01L33/505 , H01L33/507 , H01L33/54 , H01L33/60 , H01L33/62 , H01L2224/16225 , H01L2924/01078 , H01L2933/0041
Abstract: A light emitting device includes at least one semiconductor light emitting element, and a wavelength conversion layer which is formed on a surface of the semiconductor light emitting element and which includes a resin layer containing a wavelength conversion member for converting a wavelength of light emitted from the semiconductor light emitting element. The wavelength conversion layer covers an upper surface or the upper surface and a side surface of the semiconductor light emitting element. A content of an inorganic material including the wavelength conversion member, or a content of an inorganic material including the wavelength conversion member and an inorganic filler, in the resin layer is 30% by mass or more and 99% by mass or less.
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公开(公告)号：US20150340550A1
公开(公告)日：2015-11-26
申请号：US14718292
申请日：2015-05-21
Applicant: NICHIA CORPORATION
Inventor： Takeshi IKEGAMI , Suguru BEPPU , Tatsuya KANAZAWA , Yoichi BANDO
CPC classification number: H01L33/58 , H01L27/156 , H01L33/486 , H01L33/50 , H01L33/56 , H01L33/62 , H01L2224/16225 , H01L2924/18161 , H01L2933/0041 , H01L2933/0058
Abstract: A method of producing a light emitting device includes providing a light emitting element on a base member, the base member including an insulating member and a pair of connection terminals at least on an upper surface thereof. The connection terminals have an exposed portion exposed to outside, with the light emitting element electrically connected to the connection terminals. A covering member is disposed to cover at least a portion of the upper surface of the light emitting element, and a protective layer is disposed to cover at least a portion of the exposed portions of the connection terminals. The covering member is removed, and material from the upper surface side of the base member is supplied to dispose a light-transmissive member on the upper surface of the light emitting element. At least a portion of the light-transmissive member present on the protective layer is then removed.
Abstract translation: 一种制造发光器件的方法包括在基底构件上设置发光元件，所述基底构件至少在其上表面上包括绝缘构件和一对连接端子。 连接端子具有暴露于外部的暴露部分，其中发光元件电连接到连接端子。 覆盖构件设置成覆盖发光元件的上表面的至少一部分，并且设置保护层以覆盖连接端子的暴露部分的至少一部分。 除去覆盖部件，从基材的上表面侧供给材料，在发光元件的上表面设置透光性部件。 然后去除保护层上存在的透光部件的至少一部分。
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公开(公告)号：US20150129918A1
公开(公告)日：2015-05-14
申请号：US14537947
申请日：2014-11-11
Applicant: NICHIA CORPORATION
Inventor： Takeshi IKEGAMI , Hiroto TAMAKI
CPC classification number: H01L33/502 , H01L25/0753 , H01L27/153 , H01L33/20 , H01L33/32 , H01L33/46 , H01L33/486 , H01L33/505 , H01L33/507 , H01L33/54 , H01L33/60 , H01L33/62 , H01L2224/16225 , H01L2924/01078 , H01L2933/0041
Abstract: Provided is a light emitting device having a phosphor layer on a surface of a semiconductor light emitting element and achieving an even light distribution color, and a method of manufacturing the same. A method of manufacturing a light emitting device includes arranging a plurality of semiconductor light emitting elements spaced apart from each other on an expandable sheet, spraying a slurry containing a solvent, a thermosetting resin, and phosphor particles, onto an entire surface of the sheet having the arranged semiconductor light emitting elements to form a resin layer, pre-curing the resin layer, disuniting the resin layer formed on the surface of the semiconductor light emitting element from the resin layer formed on the sheet by expanding the sheet, and main curing the resin layer, which steps are performed in this order.
Abstract translation: 提供一种在半导体发光元件的表面上具有荧光体层并实现均匀的发光颜色的发光器件及其制造方法。 一种制造发光器件的方法包括在可膨胀片材上彼此间隔开的多个半导体发光元件布置，将含有溶剂，热固性树脂和荧光体颗粒的浆料喷射到具有 布置的半导体发光元件以形成树脂层，对树脂层进行预固化，通过使片材膨胀从由形成在片材上的树脂层分离形成在半导体发光元件的表面上的树脂层，并且主固化 树脂层，其顺序按此顺序进行。
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公开(公告)号：US20150295146A1
公开(公告)日：2015-10-15
申请号：US14747640
申请日：2015-06-23
Applicant: NICHIA CORPORATION
Inventor： Takeshi IKEGAMI , Hiroto TAMAKI
CPC classification number: H01L33/502 , H01L25/0753 , H01L27/153 , H01L33/20 , H01L33/32 , H01L33/46 , H01L33/486 , H01L33/505 , H01L33/507 , H01L33/54 , H01L33/60 , H01L33/62 , H01L2224/16225 , H01L2924/01078 , H01L2933/0041
Abstract: A light emitting device includes at least one semiconductor light emitting element, and a wavelength conversion layer which is formed on a surface of the semiconductor light emitting element and which includes a resin layer containing a wavelength conversion member for converting a wavelength of light emitted from the semiconductor light emitting element. The wavelength conversion layer covers an upper surface or the upper surface and a side surface of the semiconductor light emitting element. A content of an inorganic material including the wavelength conversion member, or a content of an inorganic material including the wavelength conversion member and an inorganic filler, in the resin layer is 30% by mass or more and 99% by mass or less.
Abstract translation: 发光器件包括至少一个半导体发光元件和形成在半导体发光元件的表面上的波长转换层，该波长转换层包括含有波长转换元件的树脂层，该波长转换元件用于转换从 半导体发光元件。 波长转换层覆盖半导体发光元件的上表面或上表面和侧表面。 树脂层中包含波长转换构件的无机材料或包含波长转换构件和无机填料的无机材料的含量为30质量％以上且99质量％以下。
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公开(公告)号：US20150207046A1
公开(公告)日：2015-07-23
申请号：US14561626
申请日：2014-12-05
Applicant: NICHIA CORPORATION
Inventor： Takeshi IKEGAMI , Tadao HAYASHI , Hiroto TAMAKI
CPC classification number: H01L33/502 , H01L33/486 , H01L33/501 , H01L33/505 , H01L33/508 , H01L2224/16225 , H01L2933/0033 , H01L2933/0041
Abstract: Provided is a light emitting device having a phosphor layer on a surface of a semiconductor light emitting element and reducing unevenness in light distribution color, and a method of manufacturing the same. A light emitting device 100 includes a light emitting element 20 with a supporting body which is composed of a semiconductor light emitting element 1 and a supporting body 10, and a phosphor layer 7 which continuously covers an upper surface and side surfaces of the semiconductor light emitting element 1, and side surfaces of the supporting body 10. The phosphor layer 7 is configured such that at least a lower portion of the side surface of the supporting body 10 is thinner than the upper surface and the side surface of the semiconductor light emitting element 1. Such a configuration of the phosphor layer can be formed by applying a spray-coating of a slurry containing phosphor particles and a thermosetting resin in a solvent on the semiconductor light emitting element 1 side of the light emitting element 20 which has the supporting body.
Abstract translation: 提供一种在半导体发光元件的表面上具有荧光体层并减少分布颜色不均匀的发光器件及其制造方法。 发光器件100包括具有由半导体发光元件1和支撑体10构成的支撑体的发光元件20和连续地覆盖半导体发光元件1和支撑体10的上表面的发光元件20和发射 元件1和支撑体10的侧表面。荧光体层7被构造成使得支撑体10的侧表面的至少下部比半导体发光元件的上表面和侧表面更薄 荧光体层的这种构造可以通过在具有支撑体的发光元件20的半导体发光元件1侧上施加含有荧光体颗粒和热固性树脂的浆料的喷涂而形成 。
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