公开(公告)号：US07633735B2

公开(公告)日：2009-12-15

申请号：US12274391

申请日：2008-11-20

申请人： Jun Urakawa

发明人： Jun Urakawa

IPC分类号： H02H9/00

CPC分类号： H01T4/12

摘要： An ESD protection device includes a ceramic multilayer board, a cavity disposed in the ceramic multilayer board, at least one pair of discharge electrodes having ends, edges of the ends being opposed to each other at a predetermined distance in the cavity, and external electrodes disposed on outer surfaces the ceramic multilayer board and connected to the discharge electrodes. The ceramic multilayer board includes a composite portion, which is disposed in the vicinity of the surface on which the discharge electrodes are disposed and is at least disposed adjacent to the opposed ends of the discharge electrodes and to a space between the opposed ends. The composite portion includes a metal material and a ceramic material.

摘要翻译： ESD保护装置包括陶瓷多层板，设置在陶瓷多层板中的空腔，至少一对放电电极具有端部，端部的边缘在空腔中以预定距离彼此相对，并且设置的外部电极 在陶瓷多层板的外表面上并连接到放电电极。 陶瓷多层基板包括复合部，该复合部配置在配置有放电电极的表面附近，并且至少配置成与放电电极的相对端相邻并且位于相对端之间的空间。 复合部分包括金属材料和陶瓷材料。

公开(公告)号：US20100139957A1

公开(公告)日：2010-06-10

申请号：US12706291

申请日：2010-02-16

申请人： Machiko MOTOYA ,  Tsutomu Tatekawa ,  Jun Urakawa ,  Tsuyoshi Katsube ,  Yoichi Moriya

发明人： Machiko MOTOYA ,  Tsutomu Tatekawa ,  Jun Urakawa ,  Tsuyoshi Katsube ,  Yoichi Moriya

IPC分类号： H05K1/09 ,  C04B35/10 ,  C04B35/46 ,  B32B7/02 ,  H05K1/00

CPC分类号： H05K1/0306 ,  C04B35/16 ,  C04B35/195 ,  C04B35/62675 ,  C04B2235/3206 ,  C04B2235/3215 ,  C04B2235/3229 ,  C04B2235/3232 ,  C04B2235/3239 ,  C04B2235/3244 ,  C04B2235/3251 ,  C04B2235/3262 ,  C04B2235/3272 ,  C04B2235/3275 ,  C04B2235/3284 ,  C04B2235/5436 ,  C04B2235/5445 ,  C04B2235/6025 ,  C04B2235/72 ,  C04B2235/96 ,  H05K1/024 ,  Y10T428/24926 ,  Y10T428/24942

摘要： To provide a ceramic composition not only having little compositional variation after burning, but a high flexural strength of the sintered body, and a high Q value in a microwave band, a ceramic composition used for forming a ceramic layer of a multi-layer ceramic substrate contains 47.0 to 67.0 wt. % of SiO2, 21.0 to 41.0 wt. % of BaO, and 10.0 to 18.0 wt. % of Al2O3, and contains as a first additive, 1.0 to 5.0 parts by weight of CeO2, relative to a total of 100 parts of SiO2, BaO and Al2O3, and as a second additive, 2.5 to 5.5 parts by weight of MnO, relative to a total of 100 parts by weight of SiO2, BaO, Al2O3 and CeO2, and is substantially free of Cr. As a third additive, at least one of Zr, Ti, Zn, Nb, Mg and Fe, and as a fourth additive, a Co component and/or a V component, may be contained.

摘要翻译： 为了提供陶瓷组合物，其不仅在燃烧后具有很小的组成变化，而且烧结体的高弯曲强度和微波带中的高Q值，用于形成多层陶瓷基板的陶瓷层的陶瓷组合物 含有47.0〜67.0重量％ ％的SiO 2，21.0〜41.0重量％ ％的BaO和10.0〜18.0wt。 ％的Al 2 O 3，并且作为第一添加剂含有1.0至5.0重量份的CeO 2，相对于总计为100重量份的SiO 2，BaO和Al 2 O 3，作为第二添加剂，2.5至5.5重量份的MnO相对 至100重量份的SiO 2，BaO，Al 2 O 3和CeO 2，并且基本上不含Cr。 作为第三添加剂，可以包含Zr，Ti，Zn，Nb，Mg和Fe中的至少一种，以及作为第四添加剂的Co成分和/或V成分。

公开(公告)号：US20090272566A1

公开(公告)日：2009-11-05

申请号：US12501884

申请日：2009-07-13

申请人： Masato Nomiya ,  Jun Urakawa

发明人： Masato Nomiya ,  Jun Urakawa

IPC分类号： H05K1/09 ,  H01B1/22

CPC分类号： H01B1/16 ,  H01L23/49883 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/092 ,  H05K3/4061 ,  Y10T428/24917 ,  H01L2924/00

摘要： An electrically conductive paste used for forming wiring conductors, such as via holes disposed on a multilayer ceramic substrate, is provided, wherein the temperature range, in which sintering is effected in a firing step can be controlled relatively optimally. The electrically conductive paste contains a metal powder, a glass frit, and an organic vehicle. An inorganic component, which is not sintered at a sintering temperature capable of sintering the ceramic layers (included in the multilayer ceramic substrate in the firing step, is disposed on particle surfaces of the metal powder. The glass frit has a softening point 150° C. to 300° C. lower than the above-described sintering temperature.

摘要翻译： 提供了用于形成配线导体（例如设置在多层陶瓷基板上的通孔）的导电浆料，其中可以相对最佳地控制在烧制步骤中进行烧结的温度范围。 导电糊包含金属粉末，玻璃料和有机载体。 在能够烧结陶瓷层（烧成工序中包含在多层陶瓷基板中的烧结温度）下未烧结的无机成分配置在金属粉末的粒子表面上，玻璃料的软化点为150℃ 比上述烧结温度低300℃。

公开(公告)号：US08426889B2

公开(公告)日：2013-04-23

申请号：US13113111

申请日：2011-05-23

申请人： Jun Adachi ,  Jun Urakawa ,  Issei Yamamoto

发明人： Jun Adachi ,  Jun Urakawa ,  Issei Yamamoto

IPC分类号： H01L29/66

CPC分类号： H02H9/04 ,  H01B1/20 ,  H01T4/10 ,  H01T4/12 ,  H01T21/00 ,  H02H9/044 ,  H05K9/0067 ,  H05K9/0069 ,  H05K9/0079 ,  Y10T29/49002

摘要： An ESD protection device is manufactured such that its ESD characteristics are easily adjusted and stabilized. The ESD protection device includes an insulating substrate, a cavity provided in the insulating substrate, at least one pair of discharge electrodes each including a portion exposed in the cavity, the exposed portions being arranged to face each other, and external electrodes provided on a surface of the insulating substrate and connected to the at least one pair of discharge electrodes. A particulate supporting electrode material having conductivity is dispersed between the exposed portions of the at least one pair of discharge electrodes in the cavity.

公开(公告)号：US20100309595A1

公开(公告)日：2010-12-09

申请号：US12846878

申请日：2010-07-30

申请人： Jun ADACHI ,  Jun Urakawa ,  Takahiro Sumi ,  Takahiro Kitazume

发明人： Jun ADACHI ,  Jun Urakawa ,  Takahiro Sumi ,  Takahiro Kitazume

IPC分类号： H02H9/00

CPC分类号： H01T1/20 ,  H01T4/10 ,  H01T4/12

摘要： An ESD protection device has a structure that allows ESD characteristics to be easily adjusted and stabilized. The ESD protection device includes a ceramic multilayer substrate, at least a pair of discharge electrodes located in the ceramic multilayer substrate and facing each other with a space disposed therebetween, and external electrodes located on a surface of the ceramic multilayer substrate and connected to the discharge electrodes. The ESD protection device includes a supporting electrode disposed in a region that connects the pair of discharge electrodes. The supporting electrode is made of a conductive material coated with an inorganic material having no conductivity.

摘要翻译： ESD保护器件具有允许ESD特性容易调节和稳定的结构。 ESD保护装置包括：陶瓷多层基板，位于陶瓷多层基板中的至少一对放电电极，并且彼此面对，并且位于陶瓷多层基板的表面上并与该放电 电极。 ESD保护装置包括设置在连接该对放电电极的区域中的支撑电极。 辅助电极由涂覆有无导电性的无机材料的导电材料制成。

公开(公告)号：US06452264B2

公开(公告)日：2002-09-17

申请号：US09798758

申请日：2001-03-02

申请人： Mitsuyoshi Nishide ,  Jun Urakawa ,  Yukinobu Sato

发明人： Mitsuyoshi Nishide ,  Jun Urakawa ,  Yukinobu Sato

IPC分类号： H01L2310

CPC分类号： C04B35/195 ,  H01L2224/16225 ,  H05K1/0306 ,  H05K3/3452 ,  H05K3/4629 ,  H05K2201/017

摘要： An insulating thick film composition for forming a solder resist layer having a high degree of positional accuracy is provided, which can suppress warping and undulation of a multilayer ceramic substrate and can maintain the superior electrical characteristics thereof. The insulating thick film composition is primarily composed of a powdered ceramic having the same composition system as that of a powdered ceramic contained in a green ceramic sheet, and the mean particle diameter of the powdered ceramic of the insulating thick film composition is smaller than that of the powdered ceramic contained in the green ceramic body.

摘要翻译： 提供了一种用于形成具有高位置精度的阻焊层的绝缘厚膜组合物，其可以抑制多层陶瓷基板的翘曲和起伏，并且可以保持其优异的电气特性。 绝缘厚膜组合物主要由具有与生陶瓷片中所含的粉末状陶瓷相同组成体系的粉末陶瓷组成，绝缘厚膜组合物的粉末状陶瓷的平均粒径小于 包含在绿色陶瓷体中的粉末状陶瓷。

公开(公告)号：US08693157B2

公开(公告)日：2014-04-08

申请号：US12915119

申请日：2010-10-29

申请人： Takashi Noma ,  Jun Urakawa

发明人： Takashi Noma ,  Jun Urakawa

IPC分类号： H02H7/20

CPC分类号： H05K1/0259 ,  H01L2224/16225 ,  H01L2924/15192 ,  H01L2924/19105 ,  H01T4/08 ,  H05K1/026 ,  H05K1/0272

摘要： A substrate including an ESD protection function includes an insulating substrate, at least one of circuit elements or a wiring pattern and an ESD protection portion. In the ESD protection portion, facing portions of at least one pair of discharge electrodes are disposed in a cavity provided in the insulating substrate so that the ends face each other. The discharge electrodes are electrically connected to the circuit elements and or the wiring pattern.

摘要翻译： 包括ESD保护功能的基板包括绝缘基板，电路元件或布线图案和ESD保护部分中的至少一个。 在ESD保护部中，至少一对放电电极的相对部分设置在设置在绝缘基板中的空腔中，使得端部彼此面对。 放电电极电连接到电路元件和/或布线图案。

公开(公告)号：US07569162B2

公开(公告)日：2009-08-04

申请号：US10576801

申请日：2004-11-10

申请人： Masato Nomiya ,  Jun Urakawa

发明人： Masato Nomiya ,  Jun Urakawa

IPC分类号： H01B1/02

CPC分类号： H01B1/16 ,  H01L23/49883 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/092 ,  H05K3/4061 ,  Y10T428/24917 ,  H01L2924/00

摘要： An electrically conductive paste used for forming wiring conductors, such as via holes disposed on a multilayer ceramic substrate, is provided, wherein the temperature range in which sintering is effected in a firing step can be controlled relatively optimally. The electrically conductive paste contains a metal powder, a glass frit, and an organic vehicle. An inorganic component, which is not sintered at a sintering temperature capable of sintering the ceramic layers included in the multilayer ceramic substrate in the firing step, is disposed on particle surfaces of the metal powder. The glass frit has a softening point 150° C. to 300° C. lower than the above-described sintering temperature.

摘要翻译： 提供了用于形成布线导体（例如设置在多层陶瓷基板上的通孔）的导电糊，其中可以相对最佳地控制在烧制步骤中进行烧结的温度范围。 导电糊包含金属粉末，玻璃料和有机载体。 在烧成工序中包含在多层陶瓷基板中的陶瓷层的烧结温度下不烧结的无机成分配置在金属粉末的粒子表面。 玻璃料的软化点比上述烧结温度低150℃〜300℃。

公开(公告)号：US07009114B2

公开(公告)日：2006-03-07

申请号：US09789454

申请日：2001-02-21

申请人： Jun Urakawa ,  Mitsuyoshi Nishide ,  Isao Kato ,  Norio Yoshida ,  Tomonori Ito

发明人： Jun Urakawa ,  Mitsuyoshi Nishide ,  Isao Kato ,  Norio Yoshida ,  Tomonori Ito

IPC分类号： H05K1/00

CPC分类号： H01L24/16 ,  H01L23/49838 ,  H01L24/81 ,  H01L2224/10165 ,  H01L2224/10175 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/81136 ,  H01L2224/8114 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01084 ,  H01L2924/01094 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H05K1/0306 ,  H05K3/3452 ,  H05K3/4629 ,  H05K2201/017 ,  H05K2201/09909 ,  Y10T29/49155 ,  H01L2924/00

摘要： A ceramic multi-layer wiring substrate includes a line-shaped insulation pattern arranged to extend over a plurality of surface wiring patterns and to intersect the respective surface wiring patterns, in which soldering land electrodes are defined by the insulation patterns.

公开(公告)号：US08455918B2

公开(公告)日：2013-06-04

申请号：US13115221

申请日：2011-05-25

申请人： Jun Adachi ,  Jun Urakawa

发明人： Jun Adachi ,  Jun Urakawa

IPC分类号： H01L29/66

CPC分类号： H01T4/12 ,  H01T1/20 ,  H01T21/00

摘要： An ESD protection device is manufactured such that its ESD characteristics are easily adjusted and stabilized. The ESD protection device includes an insulating substrate, a cavity provided in the insulating substrate, at least one pair of discharge electrodes each including an exposed portion that is exposed in the cavity, and external electrodes provided on a surface of the insulating substrate and connected to the discharge electrodes. Supporting electrodes obtained by dispersing conductive powder in an insulating material defining the insulating substrate are provided along a bottom surface and a top surface that define the cavity between the exposed portions of the at least one pair of discharge electrodes.

摘要翻译： 制造ESD保护装置，使其ESD特性容易调节和稳定。 ESD保护装置包括绝缘基板，设置在绝缘基板中的空腔，至少一对放电电极，每个放电电极包括暴露在空腔中的暴露部分，以及设置在绝缘基板的表面上的外部电极， 放电电极。 通过将导电粉末分散在限定绝缘基板的绝缘材料中而获得的支撑电极沿着限定在至少一对放电电极的暴露部分之间的空腔的底表面和顶表面设置。