公开(公告)号：US20130243370A1

公开(公告)日：2013-09-19

申请号：US13775445

申请日：2013-02-25

Applicant: NITTO DENKO CORPORATION

Inventor： Yuichi Tsujita ,  Yasuto Ishimaru ,  Hiroyuki Hanazono ,  Naoyuki Tanaka ,  Yasufumi Yamamoto ,  Shotaro Masuda ,  Mayu Ozaki

IPC: G02B6/136

CPC classification number: G02B6/136 ,  G02B6/1221 ,  G02B6/138 ,  G02B6/43

Abstract: An opto-electric hybrid board which is capable of suppressing the increase in light propagation losses and which is excellent in flexibility, and a method of manufacturing the same are provided. The opto-electric hybrid board includes an electric circuit board, an optical waveguide, and a metal layer. The electric circuit board includes an insulative layer having front and back surfaces, and electrical interconnect lines formed on the front surface of the insulative layer. The optical waveguide is formed on the back surface of the insulative layer of the electric circuit board. The metal layer is formed between the optical waveguide and the back surface of the insulative layer of the electric circuit board. The metal layer is patterned to have a plurality of strips. Cores of the optical waveguide are disposed in a position corresponding to a site where the metal layer is removed by the patterning.

Abstract translation: 提供了能够抑制光传播损失增加并且柔性优异的光电混合板及其制造方法。 光电混合基板包括电路板，光波导和金属层。 电路板包括具有前表面和后表面的绝缘层，以及形成在绝缘层的前表面上的电互连线。 光波导形成在电路板的绝缘层的背面上。 金属层形成在光波导与电路板的绝缘层的背面之间。 图案化金属层以具有多个条带。 光波导的芯设置在与通过图案化去除金属层的位置相对应的位置。

公开(公告)号：US12263662B2

公开(公告)日：2025-04-01

申请号：US17432345

申请日：2020-02-14

Applicant: NITTO DENKO CORPORATION ,  KYUSHU UNIVERSITY, NATIONAL UNIVERSITY CORPORATION

Inventor： Satoshi Honda ,  Naofumi Kosaka ,  Shotaro Masuda ,  Atsushi Yasui ,  Hiroki Ago ,  Kenji Kawahara ,  Shun Oyama

IPC: B32B37/12 ,  B32B7/12

Abstract: The present invention relates to a laminate including a two-dimensional material and an adhesive sheet having a base material and an adhesive layer whose adhesive force decreases due to ultraviolet rays or heat, in which an adhesive force A at 25° C. of the adhesive layer before the ultraviolet rays or heat applies, to a silicon wafer is 1.0 N/20 mm to 20.0 N/20 mm when the adhesive layer is subjected to 180° peeling at a tensile speed of 300 mm/min, and a surface roughness of an adhesive surface of the adhesive layer after the ultraviolet rays or heat has been applied is 0.01 μm to 8.00 μm.

公开(公告)号：US10120146B2

公开(公告)日：2018-11-06

申请号：US14784384

申请日：2014-03-07

Applicant: NITTO DENKO CORPORATION

Inventor： Yuichi Tsujita ,  Naoki Shibata ,  Naoyuki Tanaka ,  Shotaro Masuda

IPC: G02B6/36 ,  G02B6/42

Abstract: There is provided an opto-electric hybrid module in which an optical element of an optical element unit and a core of an optical waveguide of an opto-electric hybrid unit are aligned with each other simply and precisely. This opto-electric hybrid module includes: a connector including an optical element; and an opto-electric hybrid unit including an electric circuit board and an optical waveguide which are stacked together. The connector includes aligning protrusions positioned and formed in a predetermined position with respect to the optical element. The opto-electric hybrid unit 2 includes recesses for fitting engagement with the aligning protrusion, the recesses being positioned and formed in a predetermined position with respect to an end surface of a core of the optical waveguide.

公开(公告)号：US09843216B2

公开(公告)日：2017-12-12

申请号：US14891106

申请日：2014-04-03

Applicant: Nitto Denko Corporation

Inventor： Tadao Ookawa ,  Emiko Tani ,  Akihito Matsutomi ,  Shotaro Masuda

IPC: H02J17/00 ,  H02J7/02 ,  H01F38/14 ,  H01F27/28 ,  H01F27/29 ,  H02J50/10

CPC classification number: H02J50/12 ,  H01F27/2804 ,  H01F27/29 ,  H01F38/14 ,  H01F2027/2809 ,  H01M10/425 ,  H01M10/46 ,  H02J7/025 ,  H02J17/00 ,  H02J50/10 ,  H02J50/70

Abstract: A first coil portion is formed in a first coil region of an upper surface of an insulating layer, and a second coil portion is formed on a lower surface of the insulating layer. A second terminal is formed at a position outside the first coil region. One or more intersection regions, in which a path, extending from an inner end of the first coil portion to the second terminal, intersects the first coil portion, are provided on the upper surface. The first coil portion is parted in each intersection region. A second lead portion passes between one portion and another portion of the first coil portion parted in said each intersection region and extends from the inner end of the first coil portion to the second terminal. The first coil portion and the second coil portion are connected together in parallel via through holes formed in the insulating layer.

公开(公告)号：US20160116690A1

公开(公告)日：2016-04-28

申请号：US14895031

申请日：2014-03-31

Applicant: NITTO DENKO CORPORATION

Inventor： Naoyuki Tanaka ,  Naoki Shibata ,  Yuichi Tsujita ,  Shotaro Masuda

IPC: G02B6/42 ,  G02B6/122 ,  G02B6/12

CPC classification number: G02B6/4239 ,  G02B6/12002 ,  G02B6/122 ,  G02B6/1221 ,  G02B6/138 ,  G02B6/4214 ,  G02B6/4274 ,  G02B2006/12097

Abstract: An opto-electric hybrid module is provided, which is configured so that no air bubbles are present in a sealing resin which seals a space defined between an optical waveguide and an optical element. In the opto-electric hybrid module, an electric circuit is provided directly on an over-cladding layer of the optical waveguide, and the optical element is provided on predetermined portions (mounting pads) of the electric circuit. The over-cladding layer has a projection which covers a core, and a center portion of the optical element is positioned above the projection with the intervention of a sealing resin.

Abstract translation: 提供了一种光电混合模块，其被构造成在密封树脂中不存在密封在光波导和光学元件之间限定的空间的气泡。 在光电混合模块中，在光波导的上敷层上直接设置电路，在电路的规定部（安装焊盘）上设置光学元件。 上包层具有覆盖芯的突出部，并且通过密封树脂的介入，光学元件的中心部分位于突起的上方。

公开(公告)号：US20140126857A1

公开(公告)日：2014-05-08

申请号：US13951633

申请日：2013-07-26

Applicant: NITTO DENKO CORPORATION

Inventor： Shotaro Masuda ,  Toshikazu Baba ,  Yasuto Ishimaru

IPC: G02B6/12

CPC classification number: G02B6/12002 ,  G02B6/138 ,  H05K1/0274 ,  H05K1/028 ,  H05K2201/09236 ,  H05K2201/09909 ,  H05K2201/09972 ,  H05K2203/1572

Abstract: An opto-electric hybrid board which is capable of significantly reducing stresses applied to a bent portion thereof is provided. The opto-electric hybrid board includes a stacked electric circuit board and an optical waveguide. The electric circuit board includes an insulative layer having front and back surfaces, electrical interconnect lines formed on the front surface of the insulative layer, and an insulative coverlay formed on the front surface of the insulative layer and for covering and protecting the electrical interconnect lines. The optical waveguide includes a first cladding layer having a front surface, cores formed in a pattern on the front surface of the first cladding layer, and a second cladding layer covering the cores. Part of the opto-electric hybrid board is defined as a to-be-bent portion in which the coverlay and the optical waveguide are disposed in non-overlapping relation.

Abstract translation: 提供能够显着降低施加到其弯曲部分的应力的光电混合板。 光电混合基板包括堆叠电路板和光波导。 该电路板包括具有前表面和后表面的绝缘层，形成在绝缘层的前表面上的电互连线，以及形成在绝缘层的前表面上并用于覆盖和保护电互连线的绝缘覆盖层。 光波导包括具有前表面的第一包层，在第一包层的表面上以图案形成的芯和覆盖芯的第二包覆层。 光电混合板的一部分被定义为其中覆盖层和光波导以非重叠关系设置的弯曲部分。

公开(公告)号：US11006530B2

公开(公告)日：2021-05-11

申请号：US15741940

申请日：2016-06-01

Applicant: NITTO DENKO CORPORATION

Inventor： Keisuke Okumura ,  Eiji Toyoda ,  Shotaro Masuda

IPC: H05K3/20 ,  H05K3/22 ,  H05K1/02 ,  H05K3/00 ,  H05K3/10

Abstract: A method for producing a wired circuit board includes a step (1) of forming a seed layer on one surface in a thickness direction of a peeling layer, a step (2) of forming a conductive pattern on one surface in the thickness direction of the seed layer, a step (3) of covering the seed layer and the conductive pattern with an insulating layer, a step (4) of peeling the peeling layer from the seed layer, and a step (5) of removing the seed layer. The insulating layer has the number of times of folding endurance measured in conformity with JIS P8115 (2001) of 10 times or more.

公开(公告)号：US10796941B2

公开(公告)日：2020-10-06

申请号：US16069923

申请日：2017-01-10

Applicant: NITTO DENKO CORPORATION

Inventor： Shotaro Masuda ,  Tomoaki Ichikawa ,  Yohei Maeno

IPC: C01B32/158 ,  H01L21/687 ,  B82Y30/00 ,  H01L21/677 ,  H01L21/683 ,  C01B32/152 ,  C01B32/16

Abstract: Provided is a mounting member that is excellent in low dusting property and hardly contaminates an object to be mounted while being excellent in gripping force and heat resistance. In one embodiment of the present invention, the mounting member includes an aggregate of carbon nanotubes for forming amounting surface, wherein a standard deviation of diameters of the carbon nanotubes is 3 nm or less. In one embodiment of the present invention, the mounting member includes an aggregate of carbon nanotubes for forming a mounting surface, wherein the aggregate of the carbon nanotubes includes carbon nanotubes each having a multi-walled structure, and wherein a standard deviation of wall numbers of the carbon nanotubes is 3 or less.

公开(公告)号：US09297958B2

公开(公告)日：2016-03-29

申请号：US14045353

申请日：2013-10-03

Applicant: NITTO DENKO CORPORATION

Inventor： Yuichi Tsujita ,  Toshikazu Baba ,  Shotaro Masuda

IPC: G02B6/12 ,  G02B6/10 ,  G03F7/00 ,  G02B6/13 ,  H05K1/02 ,  G02B6/43

CPC classification number: G02B6/13 ,  G02B6/43 ,  H05K1/0274

Abstract: An opto-electric hybrid board includes: an electric circuit board including an insulative layer, and an element mounting electrode formed on the front surface of the insulative layer; an optical element mounted on the element mounting electrode by contact frictional heat; and an optical waveguide including a first cladding layer in contact with the back surface of the insulative layer of the electric circuit board. Between the insulative layer and the first cladding layer, a reinforcing layer is provided at the portion corresponding to the element mounting electrode. A reinforcing layer is provided at the portion corresponding to the element mounting electrode, in the surface of the first cladding layer, which is on the side opposite to the insulative layer. The resin-made reinforcing layer is greater than the first cladding layer in storage modulus at the temperature of the board when the element is being mounted.

Abstract translation: 光电混合基板包括：绝缘层的电路板和形成在绝缘层的前表面上的元件安装电极; 通过接触摩擦热安装在元件安装电极上的光学元件; 以及包括与电路板的绝缘层的背面接触的第一包层的光波导。 在绝缘层和第一覆层之间，在与元件安装电极对应的部分设置有加强层。 在第一包层的与绝缘层相反的一侧的表面中，在与元件安装电极对应的部分处设置加强层。 当安装元件时，在板的温度下，树脂制增强层大于第一包覆层的储能模量。

公开(公告)号：US20160070075A1

公开(公告)日：2016-03-10

申请号：US14784384

申请日：2014-03-07

Applicant: NITTO DENKO CORPORATION

Inventor： Yuichi Tsujita ,  Naoki Shibata ,  Naoyuki Tanaka ,  Shotaro Masuda

IPC: G02B6/42

CPC classification number: G02B6/423 ,  G02B6/4214 ,  G02B6/428 ,  G02B6/4283 ,  G02B6/4293

Abstract: There is provided an opto-electric hybrid module in which an optical element of an optical element unit and a core of an optical waveguide of an opto-electric hybrid unit are aligned with each other simply and precisely. This opto-electric hybrid module includes: a connector including an optical element; and an opto-electric hybrid unit including an electric circuit board and an optical waveguide which are stacked together. The connector includes aligning protrusions positioned and formed in a predetermined position with respect to the optical element. The opto-electric hybrid unit 2 includes recesses for fitting engagement with the aligning protrusion, the recesses being positioned and formed in a predetermined position with respect to an end surface of a core of the optical waveguide.

Abstract translation: 提供了一种光电混合模块，其中光电元件单元的光学元件和光电混合单元的光波导的核心简单且精确地彼此对准。 该光电混合模块包括：包括光学元件的连接器; 以及包括层叠在一起的包括电路板和光波导的光电混合单元。 连接器包括相对于光学元件定位和形成在预定位置的对准凸起。 光电混合单元2包括用于与对准突起配合接合的凹槽，凹槽相对于光波导的芯的端表面定位并形成在预定位置。