公开(公告)号：US09230939B2

公开(公告)日：2016-01-05

申请号：US14808054

申请日：2015-07-24

Applicant: OLYMPUS CORPORATION

Inventor： Kazuhiro Yoshida ,  Noriyuki Fujimori ,  Takatoshi Igarashi

IPC: H01L21/00 ,  H01L25/04 ,  H01L25/00

CPC classification number: H01L25/042 ,  H01L21/56 ,  H01L21/76898 ,  H01L21/78 ,  H01L22/10 ,  H01L22/20 ,  H01L25/50 ,  H01L27/14618 ,  H01L27/14632 ,  H01L27/14636 ,  H01L27/14683 ,  H01L27/14687 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method for producing an image pickup apparatus includes: a process of fabricating a plurality of image pickup chips by cutting an image pickup chip substrate where light receiving sections and electrode pads are formed; a process of fabricating a joined wafer by bonding the image pickup chips to a glass wafer; a process of filling a gap between the plurality of image pickup chips with a sealing member made of a BCB resin or polyimide; a process of machining the joined wafer to reduce a thickness; a process of forming through-hole vias; a process of forming an insulating layer that covers the image pickup chips; a process of forming through-hole interconnections; a process of forming external connection electrodes, each of which is connected to each of the through-hole interconnections; and a process of cutting the joined wafer.

Abstract translation: 一种用于制造图像拾取装置的方法包括：通过切割形成光接收部分和电极焊盘的图像拾取芯片基板来制造多个图像拾取芯片的处理; 通过将图像拾取芯片接合到玻璃晶片来制造接合晶片的工艺; 用BCB树脂或聚酰亚胺制成的密封件填充多个图像拾取芯片之间的间隙的过程; 加工接合的晶片以减小厚度的过程; 形成通孔过孔的过程; 形成覆盖图像拾取芯片的绝缘层的工艺; 形成通孔互连的过程; 形成外部连接电极的工艺，每个连接电极连接到每个通孔互连件; 以及切割接合的晶片的过程。

公开(公告)号：US11876107B2

公开(公告)日：2024-01-16

申请号：US17238299

申请日：2021-04-23

Applicant: OLYMPUS CORPORATION

Inventor： Takatoshi Igarashi

IPC: H01L27/146 ,  A61B1/05 ,  A61B1/00

CPC classification number: H01L27/14618 ,  A61B1/00009 ,  A61B1/05 ,  H01L27/14636

Abstract: An image pickup apparatus for endoscope includes a resin member in which an outer dimension of a third main surface is equal to an outer dimension of a second main surface, an image pickup member having a light receiving surface smaller than the second main surface, and having a first external electrode on a back surface covered by the resin member, a fan-out wiring provided to extend between an inside and an outside of an extension space, the extension space being an extension of the image pickup member in an optical axis direction, a first through wiring penetrating through the resin member, and provided in the inside of the extension space, a first bonding electrode connected with the external electrode through the first through wiring and the fan-out wiring and forming the fan-out wiring provided on the third main surface, and an electric cable bonded to the first bonding electrode.

公开(公告)号：US11776902B2

公开(公告)日：2023-10-03

申请号：US17375314

申请日：2021-07-14

Applicant: OLYMPUS CORPORATION

Inventor： Katsumi Hosogai ,  Satoru Adachi ,  Takatoshi Igarashi ,  Satoshi Nasuno

IPC: H01L23/522 ,  H01L27/146 ,  A61B1/05

CPC classification number: H01L23/5226 ,  A61B1/05 ,  H01L23/5223 ,  H01L27/14603

Abstract: A semiconductor device includes a semiconductor substrate, a trench capacitor arranged on the semiconductor substrate, a first wiring layer, a second wiring layer, a first TSV penetrating the semiconductor substrate outside the trench capacitor, a second TSV penetrating the semiconductor substrate outside the trench capacitor, a first connecting terminal connected to the first TSV, a second connecting terminal connected to the first TSV, a third connecting terminal connected to the second TSV, and a fourth connecting terminal connected to the second TSV. A plurality of connecting terminals including the first through fourth connecting terminals are arranged dispersively over an entire area of the first wiring layer and the second wiring layer of the semiconductor device, thereby stabilizing voltage supplied to an image unit and achieving a stable image signal.

公开(公告)号：US11323598B2

公开(公告)日：2022-05-03

申请号：US16924280

申请日：2020-07-09

Applicant: OLYMPUS CORPORATION

Inventor： Ken Yamamoto ,  Takatoshi Igarashi ,  Takuro Suyama ,  Kazuhiro Yoshida ,  Kensuke Suga

IPC: H04N5/225 ,  A61B1/00 ,  A61B1/05 ,  G02B23/24 ,  H01L27/146

Abstract: An image pickup apparatus disposed in an endoscope includes an optical unit in which a plurality of optical members are stacked, an image pickup unit including an image pickup device and a plurality of semiconductor devices, mold resin covering the optical unit and the image pickup unit, and a wiring board bonded to the image pickup unit, in which a recess is provided on an outer peripheral surface of the mold resin.

公开(公告)号：US10571680B2

公开(公告)日：2020-02-25

申请号：US15654133

申请日：2017-07-19

Applicant: OLYMPUS CORPORATION

Inventor： Takatoshi Igarashi

IPC: A61B1/06 ,  G02B23/24 ,  A61B1/00 ,  A61B1/05 ,  A61B1/005 ,  H04N5/374

Abstract: An image pickup apparatus includes an optical unit in which a plurality of lenses have relative positions fixed by a transparent resin that fills spaces among the plurality of lenses, and an image pickup substrate in which a light receiving section configured to receive light that is caused to be incident from the optical unit is formed on a principal surface, the optical unit being bonded to the principal surface via an adhesive, and the optical system includes an objective optical system including a plurality of lenses, and inter-lens distances of the plurality of lenses are defined by a spacer, a diaphragm, or the transparent resin.

公开(公告)号：US09895053B2

公开(公告)日：2018-02-20

申请号：US14191677

申请日：2014-02-27

Applicant: OLYMPUS CORPORATION

Inventor： Noriyuki Fujimori ,  Takatoshi Igarashi ,  Yukiharu Makino

IPC: A61B5/07 ,  A61B1/04 ,  A61B1/00 ,  A61B5/00 ,  A61B1/05

CPC classification number: A61B1/041 ,  A61B1/00016 ,  A61B1/051 ,  A61B5/073 ,  A61B5/6861 ,  A61B2562/162

Abstract: In a capsule endoscope, on an inside of a capsule type housing including a cylindrical main body section and two semispherical end cover sections and having a rotationally symmetrical shape with respect to a center axis of the housing, an image pickup board section, a transmission board section, and a reception board section are housed such that principal planes of the image pickup board section, the transmission board section, and the reception board section are orthogonal to the center axis. A coil wire of at least one of a transmission coil formed by a transmission coil wire and a reception coil formed by a reception coil wire, respective principal planes of which are orthogonal to the center axis, is disposed on the end cover section side of the housing.

公开(公告)号：US20160126286A1

公开(公告)日：2016-05-05

申请号：US14994581

申请日：2016-01-13

Applicant: OLYMPUS CORPORATION

Inventor： Takatoshi Igarashi ,  Noriyuki Fujimori ,  Kazuhiro Yoshida

IPC: H01L27/146

CPC classification number: H01L27/14698 ,  H01L23/3121 ,  H01L25/042 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14685 ,  H01L27/14687 ,  H01L27/1469 ,  H01L2924/0002 ,  H04N5/2254 ,  H04N5/335 ,  H01L2924/00

Abstract: A method for producing an image pickup apparatus includes: a process of cutting an image pickup chip substrate where electrode pads are formed around each of the light receiving sections to fabricate image pickup chips; a process of bonding image pickup chips determined as non-defective products to a glass wafer to fabricate a joined wafer; a process of filling a sealing member among the image pickup chips on the joined wafer; a machining process including a thinning a thickness of the joined wafer to flatten a machining surface and a forming through-hole interconnections, each of which is connected to each of the electrode pads; a process of forming a plurality of external connection electrodes, each of which is connected to each of the electrode pads via each of the through-hole interconnections; and a process of cutting the joined wafer.

公开(公告)号：US09282261B2

公开(公告)日：2016-03-08

申请号：US14557271

申请日：2014-12-01

Applicant: OLYMPUS CORPORATION

Inventor： Takatoshi Igarashi ,  Noriyuki Fujimori ,  Kazuhiro Yoshida

IPC: H01L21/00 ,  H04N5/335 ,  H01L25/04 ,  H01L27/146 ,  H04N5/225 ,  H01L23/31

CPC classification number: H01L27/14698 ,  H01L23/3121 ,  H01L25/042 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14685 ,  H01L27/14687 ,  H01L27/1469 ,  H01L2924/0002 ,  H04N5/2254 ,  H04N5/335 ,  H01L2924/00

Abstract: A method for producing an image pickup apparatus includes: a process of cutting an image pickup chip substrate where electrode pads are formed around each of the light receiving sections to fabricate image pickup chips; a process of bonding image pickup chips determined as non-defective products to a glass wafer to fabricate a joined wafer; a process of filling a sealing member among the image pickup chips on the joined wafer; a machining process including a thinning a thickness of the joined wafer to flatten a machining surface and a forming through-hole interconnections, each of which is connected to each of the electrode pads; a process of forming a plurality of external connection electrodes, each of which is connected to each of the electrode pads via each of the through-hole interconnections; and a process of cutting the joined wafer.

Abstract translation: 一种图像拾取装置的制造方法，其特征在于，包括以下步骤：切割摄像芯片基板，在每个所述光接收部分周围形成电极焊盘，制作摄像芯片; 将作为无缺陷产品确定的图像拾取芯片接合到玻璃晶片以制造接合晶片的工艺; 在接合晶片上的图像拾取芯片之间填充密封构件的过程; 一种加工工艺，其包括使连接的晶片的厚度变薄以使加工表面变平且形成通孔互连，每个连接到每个电极焊盘; 形成多个外部连接电极的过程，每个外部连接电极通过每个通孔互连连接到每个电极焊盘; 以及切割接合的晶片的过程。

公开(公告)号：US12028597B2

公开(公告)日：2024-07-02

申请号：US17868929

申请日：2022-07-20

Applicant: OLYMPUS CORPORATION

Inventor： Takuro Suyama ,  Ken Yamamoto ,  Takatoshi Igarashi

IPC: H04N23/54 ,  A61B1/04 ,  A61B1/05 ,  H04N23/50

CPC classification number: H04N23/54 ,  A61B1/04 ,  A61B1/051 ,  H04N23/555

Abstract: An image pickup apparatus includes a stacked device in which a plurality of semiconductor devices respectively including a plurality of through electrodes are stacked, a first semiconductor device, among the plurality of semiconductor devices, in which thermal resistance of a through electrode is highest among the plurality of through electrodes, is disposed in front of a first surface on which a first circuit that is one of the semiconductor circuits having a largest heat generation amount is formed, the plurality of through electrodes of the first semiconductor device are conformal vias, and the plurality of through electrodes of semiconductor devices other than the first semiconductor device are filled vias.

公开(公告)号：US11627240B2

公开(公告)日：2023-04-11

申请号：US16921236

申请日：2020-07-06

Applicant: OLYMPUS CORPORATION

Inventor： Hiroshi Kobayashi ,  Takatoshi Igarashi

IPC: H04N5/225 ,  G02B23/24 ,  A61B1/04

Abstract: An image pickup apparatus for endoscope includes: an optical unit having an incident surface and an emitting surface; an image pickup unit adhering to the emitting surface; an interposer where the image pickup unit is bonded to a first electrode of a first main surface; and an electric cable bonded to the interposer. The image pickup unit is smaller than the optical unit and the interposer in an outer size in a direction orthogonal to an optical axis. The image pickup apparatus for endoscope further includes a heat conductive resin with which a portion among the emitting surface, the first main surface, and a side surface of the image pickup unit is filled. The first electrode extends to a position where the first electrode is brought into contact with the heat conductive resin.