公开(公告)号：US20160148966A1

公开(公告)日：2016-05-26

申请号：US14554970

申请日：2014-11-26

Applicant: OmniVision Technologies, Inc.

Inventor： Wei-Feng Lin ,  Chi-Chih Huang

IPC: H01L27/146

CPC classification number: H01L27/14636 ,  H01L27/14698 ,  H01L2224/05554 ,  H01L2224/24 ,  H01L2224/49175 ,  H01L2924/10156

Abstract: A space-efficient PCB-mountable image sensor includes a semiconductor substrate having a top surface and a side surface, a bond pad on the top surface, and a conductive layer formed on the side surface and electrically connected to the bond pad. A camera module includes a PCB and a space-efficient PCB-mountable image sensor. A conductive layer of the PCB-mountable image sensor is electrically connected between the bond pad and a contact pad of the PCB. A method for fabricating a space-efficient PCB-mountable image sensor includes forming a trench next to an image sensor on a first side of an image sensor wafer, the image sensor including a bond pad. The method also includes forming a conductive layer spanning the bond pad and at least part of a side wall of the trench, and singulating the image sensor wafer along the trench.

Abstract translation: 空间高效的可安装PCB的图像传感器包括具有顶表面和侧表面的半导体衬底，顶表面上的接合焊盘以及形成在侧表面上并电连接到接合焊盘的导电层。 相机模块包括PCB和节省空间的PCB安装图像传感器。 PCB可安装图像传感器的导电层电连接在接合焊盘和PCB的接触焊盘之间。 一种用于制造节省空间的PCB安装图像传感器的方法，包括在图像传感器晶片的第一侧上形成与图像传感器相邻的沟槽，所述图像传感器包括接合焊盘。 该方法还包括形成横跨接合焊盘和沟槽的侧壁的至少一部分的导电层，以及沿沟槽分离图像传感器晶片。

公开(公告)号：US12064090B2

公开(公告)日：2024-08-20

申请号：US17504105

申请日：2021-10-18

Applicant: OmniVision Technologies, Inc.

Inventor： Teng-Sheng Chen ,  Wei-Ping Chen ,  Jau-Jan Deng ,  Wei-Feng Lin ,  Chun-Sheng Fan

IPC: A61B1/00 ,  A61B1/05 ,  A61B1/06

CPC classification number: A61B1/051 ,  A61B1/00096 ,  A61B1/0638 ,  A61B1/0684

Abstract: A cavity interposer has a cavity, first bondpads adapted to couple to a chip-type camera cube disposed within a base of the cavity at a first level, the first bondpads coupled through feedthroughs to second bondpads at a base of the interposer at a second level; and third bondpads adapted to couple to a light-emitting diode (LED), the third bondpads at a third level. The third bondpads coupled to fourth bondpads at the base of the interposer at the second level; and the second and fourth bondpads couple to conductors of a cable with the first, second, and third level different. An endoscope optical includes the cavity interposer an LED, and a chip-type camera cube electrically bonded to the first bondpads; the LED is bonded to the third bondpads; and a top of the chip-type camera cube and a top of the LED are at a same level.

公开(公告)号：US11973098B2

公开(公告)日：2024-04-30

申请号：US18049668

申请日：2022-10-26

Applicant: OmniVision Technologies, Inc.

Inventor： Wei-Feng Lin ,  En-Chi Li ,  Chi-Chih Huang

IPC: H01L27/146

CPC classification number: H01L27/14623 ,  H01L27/14618 ,  H01L27/14632 ,  H01L27/14636 ,  H01L27/14685 ,  H01L27/14687

Abstract: An image sensor module comprises an image sensor having a light sensing area, a cover glass for covering the light sensing area, a dam between the image sensor and the cover glass, which surrounds the light sensing area, and has an outer wall and an inner wall, where a cross-section of the inner wall parallel to the surface of the light sensing area of the image sensor forms a sawtooth pattern and/or, where a cross-section of the inner wall orthogonal to the surface of the light sensing area of the image sensor forms an inclined surface.

公开(公告)号：US11626434B2

公开(公告)日：2023-04-11

申请号：US17530358

申请日：2021-11-18

Applicant: OMNIVISION TECHNOLOGIES, INC.

Inventor： Wei-Feng Lin ,  Ying-Chih Kuo ,  Ying Chung

IPC: H01L27/146

Abstract: A method of image sensor package fabrication includes forming a recess in a transparent substrate, depositing conductive traces in the recess, inserting an image sensor in the recess so that the image sensor is positioned in the recess to receive light through the transparent substrate, and inserting a circuit board in the recess so that the image sensor is positioned between the transparent substrate and the circuit board.

公开(公告)号：US10312276B2

公开(公告)日：2019-06-04

申请号：US15666901

申请日：2017-08-02

Applicant: OmniVision Technologies, Inc.

Inventor： Wei-Chih Chien ,  Wei-Feng Lin

IPC: H01L27/146 ,  H01L23/48 ,  H01L23/00

Abstract: An image sensor package, comprising a silicon substrate; an image sensor pixel array that is formed on the silicon substrate; a peripheral circuit region that is formed around the image sensor pixel array on the silicon substrate; a redistribution layer (RDL) that is electrically coupled to the peripheral circuit region; at least one solder ball that is electrically coupled to the RDL; and a cover glass that is coupled to the RDL. No part of the RDL is located directly above or below the image sensor pixel array. No part of the at least one solder ball is located directly above or below the silicon substrate. A dark material layer is implemented to prevent an edge flare effect of the image sensor pixel array.

公开(公告)号：US20180219034A1

公开(公告)日：2018-08-02

申请号：US15421879

申请日：2017-02-01

Applicant: OmniVision Technologies, Inc.

Inventor： Chun-Sheng Fan ,  Chen-Wei Tsai ,  Wei-Feng Lin

IPC: H01L27/146

CPC classification number: H01L27/1462 ,  H01L27/14627

Abstract: An optical element comprising a transparent substrate and an anti-reflective coating, wherein the anti-reflective coating further comprises at least a transparent, high refractive index layer and a transparent, low refractive index layer, wherein the high refractive index layer is in contact with the low refractive index layer; and wherein the high refractive index layer is situated at an interface between the anti-reflective coating and air. Further, the low refractive index layer may be silicon oxide; the high refractive index layer may be tantalum oxide or silicon nitride.

公开(公告)号：US09935144B1

公开(公告)日：2018-04-03

申请号：US15362408

申请日：2016-11-28

Applicant: OMNIVISION TECHNOLOGIES, INC.

Inventor： Wei-Feng Lin ,  Chi-Chih Huang ,  En-Chi Li

IPC: H01L27/146

CPC classification number: H01L27/14618 ,  H01L27/14627 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/1469

Abstract: An image sensor package includes a ceramic substrate with a cavity disposed in the ceramic substrate. A glass layer is adhered to the ceramic substrate and encloses the cavity in the ceramic substrate. An image sensor is disposed in the cavity between the glass layer and the ceramic substrate to electrically isolate the image sensor. An image sensor processor is disposed in the cavity and electrically coupled to the image sensor to receive image data from the image sensor.

公开(公告)号：US09349763B1

公开(公告)日：2016-05-24

申请号：US14618703

申请日：2015-02-10

Applicant: OmniVision Technologies, Inc.

Inventor： Wei-Feng Lin ,  Chi-Chih Huang

IPC: H01L31/0232 ,  H04N5/335 ,  H01L27/146

CPC classification number: H01L27/14618 ,  H01L27/14605 ,  H01L27/14607 ,  H01L27/14612 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14643 ,  H01L27/14687 ,  H01L27/14689 ,  H01L27/14698 ,  H01L2224/11

Abstract: A method for manufacturing one or more curved image sensor systems includes (a) at elevated pressure relative to atmospheric pressure, bonding a light-transmitting substrate to an image sensor wafer having at least one pixel array, to form a composite wafer with a respective hermetically sealed cavity between the light-transmitting substrate and each pixel array, and (b) thinning the image sensor wafer of the composite wafer to induce deformation of the image sensor wafer to form a concavely curved pixel array from each pixel array. A curved image sensor system includes (a) an image sensor substrate having a concave light-receiving surface and a pixel array located along the concave light-receiving surface, (b) a light-transmitting substrate bonded to the image sensor substrate by a bonding layer, and (c) a hermetically sealed cavity, bounded at least by the concave light-receiving surface, the light-transmitting substrate, and the bonding layer.

Abstract translation: 用于制造一个或多个弯曲图像传感器系统的方法包括（a）在相对于大气压力的升高的压力下，将透光衬底粘合到具有至少一个像素阵列的图像传感器晶片，以形成具有相应气密的复合晶片 透光基板和每个像素阵列之间的密封腔，以及（b）使复合晶片的图像传感器晶片变薄以引起图像传感器晶片的变形，从而形成每个像素阵列的凹曲面像素阵列。 弯曲图像传感器系统包括：（a）具有凹面光接收面的图像传感器基板和沿着凹面受光面设置的像素阵列，（b）通过接合将图像传感器基板接合的透光基板 层，以及（c）至少由凹面光接收表面限定的气密密封腔，透光衬底和结合层。

公开(公告)号：US20160141280A1

公开(公告)日：2016-05-19

申请号：US14542195

申请日：2014-11-14

Applicant: OmniVision Technologies, Inc.

Inventor： Wei-Feng Lin ,  Chi-Chih Huang

IPC: H01L25/18 ,  H01L25/00 ,  H01L27/146

CPC classification number: H01L25/18 ,  H01L25/50 ,  H01L27/14618 ,  H01L27/14632 ,  H01L27/14636 ,  H01L27/14687 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2924/00014

Abstract: A device-embedded image sensor includes an image sensor formed in a first semiconductor substrate; a top conductive pad formed on a top surface of the first semiconductor substrate; and a semiconductor device formed in a second semiconductor substrate bonded to a bottom surface of the first semiconductor substrate, the semiconductor device electrically connected to the top conductive pad. A method for fabricating a device-embedded image sensor from a CMOS image sensor wafer assembly that includes an image sensor and a conductive pad. The method includes exposing the conductive pad; forming an isolation layer; exposing a surface of each conductive pad; forming a patterned redistribution layer (RDL) having a plurality of RDL elements on the isolation layer; electrically isolating adjacent RDL elements; and laminating the CMOS image sensor wafer assembly and a semiconductor device wafer to form undiced device-embedded image sensors.

Abstract translation: 装置嵌入式图像传感器包括形成在第一半导体衬底中的图像传感器; 形成在所述第一半导体衬底的顶表面上的顶部导电焊盘; 以及形成在第二半导体衬底中的半导体器件，其接合到第一半导体衬底的底表面，所述半导体器件电连接到顶部导电焊盘。 一种从包括图像传感器和导电焊盘的CMOS图像传感器晶片组件制造装置嵌入式图像传感器的方法。 该方法包括暴露导电垫; 形成隔离层; 暴露每个导电垫的表面; 在所述隔离层上形成具有多个RDL元件的图案化再分配层（RDL）; 电隔离相邻的RDL元件; 并且将CMOS图像传感器晶片组件和半导体器件晶片层叠以形成未开发的器件嵌入式图像传感器。

公开(公告)号：US09111832B2

公开(公告)日：2015-08-18

申请号：US13662640

申请日：2012-10-29

Applicant: OmniVision Technologies, Inc.

Inventor： Wei-Feng Lin ,  Yeh-An Chien ,  Chun-Sheng Fan

IPC: H01L27/146

CPC classification number: H01L27/14649 ,  H01L27/146 ,  H01L27/14607 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14629 ,  H01L27/14636 ,  H01L27/14669 ,  H01L2224/11

Abstract: An image sensor includes a photosensing element for receiving infrared (IR) radiation and detecting the IR radiation and generating an electrical signal indicative of the IR radiation. A redistribution layer (RDL) is disposed under the photosensing element, the RDL comprising pattern of conductors for receiving the electrical signal. An IR reflection layer, an IR absorption layer or an isolation layer is disposed between the photosensing element and the RDL. The IR reflection layer, IR absorption layer or isolation layer provides a barrier to IR radiation such that the IR radiation does not impinge upon the RDL. As a result, a ghost image of the RDL is not generated, resulting in reduced noise and improved sensitivity and performance of the image sensor.