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    Light emitting diode package with optical element
    18.
    发明授权
    Light emitting diode package with optical element 有权
    具有光学元件的发光二极管封装

    公开(公告)号：US08735920B2

    公开(公告)日：2014-05-27

    申请号：US11496922

    申请日：2006-07-31

    申请人： James Ibbetson ,  Eric Tarsa ,  Michael Leung ,  Maryanne Becerra ,  Bernd Keller

    发明人： James Ibbetson ,  Eric Tarsa ,  Michael Leung ,  Maryanne Becerra ,  Bernd Keller

    IPC分类号： H01L33/00

    CPC分类号： H01L33/486 ,  H01L33/56 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2933/005 ,  H01L2924/00014

    摘要： A light emitting diode (LED) package comprising a substrate with an LED chip mounted to the substrate and in electrical contact with it. An inner material covers the LED chip, and a lens covers the inner material with the lens material being harder than the inner material. An adhesive is arranged between the substrate and the lens to hold the lens to the substrate and to compensate for different coefficients of thermal expansion (CTE) between the lens and the remainder of the package. A method for forming an LED package comprises providing a substrate with a first meniscus ring on a surface of the substrate. An LED chip is mounted to the substrate, within the meniscus ring. An inner material is deposited over the LED chip, and a lens material in liquid form is deposited over the inner material. The lens material held in a hemispheric shape by the first meniscus feature and the lens material is cured making it harder than the inner material.

    摘要翻译： 一种发光二极管（LED）封装，其包括具有安装到所述衬底并与其电接触的LED芯片的衬底。 内部材料覆盖LED芯片，透镜覆盖内部材料，透镜材料比内部材料硬。 在基板和透镜之间布置粘合剂以将透镜保持在基板上并补偿透镜与封装的其余部分之间的不同热膨胀系数（CTE）。 一种用于形成LED封装的方法，包括在基板的表面上提供具有第一弯液面环的基板。 LED芯片安装在弯液面环内的基板上。 内部材料沉积在LED芯片上，液体形式的透镜材料沉积在内部材料上。 通过第一弯液面特征和透镜材料保持半球形状的透镜材料固化使其比内部材料更硬。

    Light emitting diode package with optical element
    19.
    发明申请
    Light emitting diode package with optical element 有权
    具有光学元件的发光二极管封装

    公开(公告)号：US20080023711A1

    公开(公告)日：2008-01-31

    申请号：US11496922

    申请日：2006-07-31

    申请人： Eric Tarsa ,  Michael Leung ,  Maryanne Becerra ,  Bernd Keller ,  James Ibbetson

    发明人： Eric Tarsa ,  Michael Leung ,  Maryanne Becerra ,  Bernd Keller ,  James Ibbetson

    IPC分类号： H01L33/00

    CPC分类号： H01L33/486 ,  H01L33/56 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2933/005 ,  H01L2924/00014

    摘要： A light emitting diode (LED) package comprising a substrate with an LED chip mounted to the substrate and in electrical contact with it. An inner material covers the LED chip, and a lens covers the inner material with the lens material being harder than the inner material. An adhesive is arranged between the substrate and the lens to hold the lens to the substrate and to compensate for different coefficients of thermal expansion (CTE) between the lens and the remainder of the package. A method for forming an LED package comprises providing a substrate with a first meniscus ring on a surface of the substrate. An LED chip is mounted to the substrate, within the meniscus ring. An inner material is deposited over the LED chip, and a lens material in liquid form is deposited over the inner material. The lens material held in a hemispheric shape by the first meniscus feature and the lens material is cured making it harder than the inner material.

    摘要翻译： 一种发光二极管（LED）封装，其包括具有安装到所述衬底并与其电接触的LED芯片的衬底。 内部材料覆盖LED芯片，透镜覆盖内部材料，透镜材料比内部材料硬。 在基板和透镜之间布置粘合剂以将透镜保持在基板上并且补偿透镜与封装的其余部分之间的不同的热膨胀系数（CTE）。 一种用于形成LED封装的方法，包括在基板的表面上提供具有第一弯液面环的基板。 LED芯片安装在弯液面环内的基板上。 内部材料沉积在LED芯片上，液体形式的透镜材料沉积在内部材料上。 通过第一弯液面特征和透镜材料保持半球形状的透镜材料固化使其比内部材料更硬。

    Molded chip fabrication method and apparatus
    20.
    发明申请
    Molded chip fabrication method and apparatus 有权
    成型芯片制造方法和装置

    公开(公告)号：US20050062140A1

    公开(公告)日：2005-03-24

    申请号：US10666399

    申请日：2003-09-18

    申请人： Michael Leung ,  Eric Tarsa ,  James Ibbetson

    发明人： Michael Leung ,  Eric Tarsa ,  James Ibbetson

    IPC分类号： H01L21/56 ,  H01L33/50 ,  H01L23/02

    CPC分类号： H01L33/504 ,  H01L21/565 ,  H01L24/96 ,  H01L27/15 ,  H01L33/50 ,  H01L2224/2518 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2933/0041 ,  H01L2924/00

    摘要： A method and apparatus for coating a plurality of semiconductor devices that is particularly adapted to coating LEDs with a coating material containing conversion particles. One method according to the invention comprises providing a mold with a formation cavity. A plurality of semiconductor devices are mounted within the mold formation cavity and a curable coating material is injected or otherwise introduced into the mold to fill the mold formation cavity and at least partially cover the semiconductor devices. The coating material is cured so that the semiconductor devices are at least partially embedded in the cured coating material. The cured coating material with the embedded semiconductor devices is removed from the formation cavity. The semiconductor devices are separated so that each is at least partially covered by a layer of the cured coating material. One embodiment of an apparatus according to the invention for coating a plurality of semiconductor devices comprises a mold housing having a formation cavity arranged to hold semiconductor devices. The formation cavity is also arranged so that a curable coating material can be injected into and fills the formation cavity to at least partially covering the semiconductor devices.

    摘要翻译： 一种用于涂覆多个半导体器件的方法和设备，其特别适用于涂覆含有转化颗粒的涂层材料的LED。 根据本发明的一种方法包括提供具有地层腔的模具。 多个半导体器件安装在模具形成腔内，并且可固化涂层材料被注入或以其它方式被引入到模具中以填充模具形成腔并且至少部分地覆盖半导体器件。 固化涂层材料，使得半导体器件至少部分地嵌入固化的涂层材料中。 具有嵌入式半导体器件的固化的涂层材料从形成腔中移除。 半导体器件被分离成使得每个半导体器件至少部分被固化的涂层材料层覆盖。 根据本发明的用于涂覆多个半导体器件的设备的一个实施例包括具有布置成保持半导体器件的形成空腔的模具外壳。 形成空腔也被布置成使得可固化的涂层材料可以注入并填充地层腔以至少部分地覆盖半导体器件。