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    Integrated cooling system
    11.
    发明授权
    Integrated cooling system 有权

    公开(公告)号：US06529377B1

    公开(公告)日：2003-03-04

    申请号：US09946798

    申请日：2001-09-05

    Applicant: Richard D. Nelson ,  Anjan Somadder

    Inventor： Richard D. Nelson ,  Anjan Somadder

    IPC: H05K720

    CPC classification number: H01L23/473 ,  A61K31/00 ,  F28F2250/08 ,  G06F1/20 ,  G06F1/203 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

    Abstract: Systems and methods are described for integrated cooling system. A method includes: circulating a liquid inside a flexible multi-layer tape; and transporting heat between a heat source that is coupled to the flexible multi-layer tape and a heat sink that is coupled to the flexible multi-layer tape. A method includes installing a flexible multi-layer tape in an electrical system, wherein the flexible multi-layer tape includes a top layer; an intermediate, layer coupled to the top layer; and a bottom layer coupled to the intermediate layer, the intermediate layer defining a closed loop circuit for a circulating fluid. An apparatus includes a flexible multi-layer tape, including: a top layer; an intermediate layer coupled to the top layer; and a bottom layer coupled to the intermediate layer, wherein the intermediate layer defines a closed loop circuit for a circulating fluid.

    Ink jet printhead with improved adhesive bonding between channel and heater substrates
    12.
    发明授权
    Ink jet printhead with improved adhesive bonding between channel and heater substrates 失效
    喷墨打印头具有改善的通道和加热器基板之间的粘合剂粘合

    公开(公告)号：US5871657A

    公开(公告)日：1999-02-16

    申请号：US4255

    申请日：1998-01-08

    Applicant: Richard D. Nelson

    Inventor： Richard D. Nelson

    IPC: B41J2/05 ,  B41J2/16 ,  B11B5/27

    CPC classification number: B41J2/1603 ,  B41J2/1623 ,  B41J2/1626 ,  B41J2/1631

    Abstract: An improved process is provided for aligning and bonding channel and heater substrates together to form a thermal ink jet printhead. A thick film polyimide layer is formed over the heater substrate and is patterned to provide a plurality of tacking pits. The channel substrate has alignment holes formed in peripheral edge areas. A UV curable adhesive is deposited into the alignment hole and UV irradiated to produce a cured tacking column in the underlying pits formed in the thick film layer. Due to the sloping walls of the etched alignment recess, some portion of the adhesive is not fully cured and, during a subsequent curing process, tends to initiate a capillary flow along the interface between channel substrate and the thin film layer. This flow, in prior art designs, sometimes proceeds to the point where the adhesive is squeezed out onto electrode connections formed on an adjacent heater substrate. The formation of the pits serves to interrupt and trap the flow of the uncured adhesive, thus, preventing further flow and eliminating subsequent contamination.

    Abstract translation: 提供了一种改进的方法，用于将通道和加热器基板对准和粘合在一起以形成热喷墨打印头。 在加热器基板上方形成厚膜聚酰亚胺层，并对其进行图案化以提供多个固定凹坑。 通道基板具有形成在周边边缘区域中的对准孔。 将UV可固化粘合剂沉积到对准孔中并进行UV照射，以在形成在厚膜层中的下面的凹坑中产生固化的固定柱。 由于蚀刻的对准凹槽的倾斜壁，粘合剂的一些部分没有完全固化，并且在随后的固化过程中，倾向于引发沿着通道基底和薄膜层之间的界面的毛细管流动。 在现有技术设计中，该流程有时进行到粘合剂被挤出到形成在相邻的加热器基板上的电极连接点上。 凹坑的形成用于中断和捕获未固化的粘合剂的流动，从而防止进一步的流动并消除随后的污染。

    Low pressure high heat transfer fluid heat exchanger
    15.
    发明授权
    Low pressure high heat transfer fluid heat exchanger 失效
    低压高传热流体换热器

    公开(公告)号：US4953634A

    公开(公告)日：1990-09-04

    申请号：US341006

    申请日：1989-04-20

    Applicant: Richard D. Nelson ,  Dennis J. Herrell

    Inventor： Richard D. Nelson ,  Dennis J. Herrell

    IPC: F28F3/02 ,  H01L23/473

    CPC classification number: F28F3/02 ,  H01L23/473 ,  H01L2924/0002

    Abstract: A fluid heat exchanger for cooling an electronic component having a housing for receiving heat from the electronic component in which the housing has a fluid inlet and an outlet at opposite ends of the housing. The cross-sectional area of the housing for conveying fluid from the inlet to the outlet decreases from the inlet to the outlet thereby reducing pressure drop without sacrificing thermal performance. The cross-sectional area may be decreased by tilting a top of the housing relative to a bottom, or providing a plurality of fins separated by channels in which the cross-sectional area of the channels decreases from the inlet to the outlet.

    Abstract translation: 一种用于冷却电子部件的流体热交换器，所述电子部件具有用于从所述电子部件接收热量的壳体，其中所述壳体具有流体入口和在所述壳体的相对端处的出口。 用于将流体从入口输送到出口的壳体的横截面面积从入口到出口减小，从而在不牺牲热性能的情况下降低压降。 可以通过使壳体的顶部相对于底部倾斜来减小横截面面积，或者提供由通道分隔开的多个翅片，在该通道中通道的横截面积从入口到出口减小。

    COMPRESSIBLE CARBONACEOUS PARTICULATE MATERIAL AND METHOD OF MAKING SAME
    17.
    发明申请
    COMPRESSIBLE CARBONACEOUS PARTICULATE MATERIAL AND METHOD OF MAKING SAME 有权
    可压制的碳质材料及其制备方法

    公开(公告)号：US20150184495A1

    公开(公告)日：2015-07-02

    申请号：US14140730

    申请日：2013-12-26

    Applicant: Changjun Zhou ,  Richard D. Nelson

    Inventor： Changjun Zhou ,  Richard D. Nelson

    IPC: E21B43/12 ,  C01B31/08

    CPC classification number: E21B43/12 ,  C01B31/00 ,  C01B31/02 ,  C01B31/08 ,  C01B32/00 ,  C01B32/05 ,  C01B32/30 ,  C04B28/02 ,  C04B38/009 ,  C09K8/032 ,  C09K8/487 ,  C09K8/516 ,  C04B14/022 ,  C04B35/52

    Abstract: A carbonaceous particulate material is provided that is characterized by having a reversible volumetric expansion/contraction in fluid media (“VR”) of greater than or equal to (≧)3% between 4,000 psi and 10,000 psi. The porous carbonaceous particulate material of the present disclosure is also characterized by having a true density, (“PT”), of 1.2 g/cc≦PT≦2.0 g/cc, when milled to−-200 mesh and has a d50 particle size distribution of about 15 μm. This is the consequence of the instant material exhibiting a high level of closed porosity with very small pores, in contrast with prior art materials that would have a wider range pore sizes for the closed pores.

    Abstract translation: 提供了一种碳质颗粒材料，其特征在于在4000psi至10,000psi之间具有大于或等于（≥3％）的流体介质（“VR”）的可逆容积膨胀/收缩。 本公开的多孔碳质颗粒材料的特征还在于，当研磨至200目并具有d50粒径时，其真密度（“PT”）为1.2g / cc和nlE; 2.0g / cc 分布约15μm。 这是现有材料表现出具有非常小孔隙的高水平闭孔率的结果，与现有技术的材料相比，该材料对于闭孔具有更宽的孔径。

    Device adapted to pull a cantilever away from a contact structure
    18.
    发明授权
    Device adapted to pull a cantilever away from a contact structure 失效
    适于将悬臂从接触结构拉出的装置

    公开(公告)号：US06646215B1

    公开(公告)日：2003-11-11

    申请号：US09895455

    申请日：2001-06-29

    Applicant: Richard D. Nelson

    Inventor： Richard D. Nelson

    IPC: B81B700

    CPC classification number: B81B3/0008 ,  B81B2201/014 ,  G11C23/00 ,  H01H59/0009 ,  H01H2001/0089 ,  H01H2059/0063

    Abstract: A device is provided which is adapted to electrostatically pull a cantilever away from a conductive pad. In particular, a microelectromechanical device is provided which includes a fulcrum contact structure interposed between two electrodes spaced under a cantilever and a conductive pad arranged laterally adjacent to one of the electrodes. The cantilever may be brought into contact with the conductive pad by residual forces within the cantilever and/or an application of a closing voltage to one of the electrodes. Such a device may be adapted bring the cantilever in contact with the fulcrum contact structure by applying an actuation voltage to the other of the electrodes. In addition, the actuation voltage may deflect the cantilever away from the conductive pad. In some cases, deflecting the cantilever from the conductive pad may include releasing the closing voltage and increasing the actuation voltage subsequent to the release of the closing voltage.

    Abstract translation: 提供了一种适于将悬臂静电拉离导电垫的装置。 特别地，提供了一种微机电装置，其包括插入在悬臂之间间隔开的两个电极之间的支点接触结构和布置成横向邻近其中一个电极的导电焊盘。 悬臂可以通过悬臂内的残余力与导电垫接触和/或向其中一个电极施加闭合电压。 这种装置可以通过向另一个电极施加致动电压而使悬臂与支点接触结构接触。 此外，致动电压可以将悬臂偏离导电焊盘。 在一些情况下，从导电焊盘偏转悬臂可包括释放闭合电压并在释放闭合电压之后增加致动电压。

    Electronic device including multiple capacitance value MEMS capacitor and associated methods
    19.
    发明授权
    Electronic device including multiple capacitance value MEMS capacitor and associated methods 有权
    电子器件包括多电容值MEMS电容器及相关方法

    公开(公告)号：US06437965B1

    公开(公告)日：2002-08-20

    申请号：US09724292

    申请日：2000-11-28

    Applicant: Calvin L. Adkins ,  David John Tammen ,  Michael Alan Gribbons ,  Jason D. Reed ,  Claude Hilbert ,  Richard D. Nelson

    Inventor： Calvin L. Adkins ,  David John Tammen ,  Michael Alan Gribbons ,  Jason D. Reed ,  Claude Hilbert ,  Richard D. Nelson

    IPC: H01G4005

    CPC classification number: H01G5/16 ,  B81B3/0008

    Abstract: An electronic device, such as a filter or phase shifter, for example, includes a substrate, and a MEMS capacitor on the substrate and having a plurality of selectable capacitance values. The MEMS capacitor preferably includes a lower capacitor electrode on the substrate, and a movable bridge including end portions connected to the substrate laterally adjacent the lower capacitor electrode. The movable bridge may also include a conductive medial portion between the end portions defining an upper capacitor electrode suspended above the lower capacitor electrode and being movable between an upper position and a lower position by an electrostatic force generated between the capacitor electrodes. The upper and lower positions provide respective low and high selectable capacitance values. Moreover, the movable bridge may further include at least one travel limiting portion between the end portions for engaging adjacent substrate portions to keep the upper capacitor electrode in a predetermined spaced relation from the lower capacitor electrode when in the lower position. This travel limiting feature of the MEMS capacitor is relatively easy to fabricate and avoids the sticking or stiction problem of some other types of MEMS capacitors.

    Abstract translation: 例如，诸如滤波器或移相器的电子器件包括衬底和衬底上的MEMS电容器，并且具有多个可选择的电容值。 MEMS电容器优选地包括在基板上的下电容器电极和可移动​​桥，该可移动桥包括在与下电容器电极相邻的基板上连接到基板的端部。 可移动桥还可以包括在端部之间的导电中间部分，其限定悬挂在下电容器电极上方的上电容器电极，并且可以通过在电容器电极之间产生的静电力在上位置和下​​位置之间移动。 上部和下部位置提供相应的低和高可选择的电容值。 此外，可移动桥可以还包括在端部之间的至少一个行进限制部分，用于接合相邻的基板部分，以在较低位置时将上电容器电极与下电容器电极保持预定间隔的关系。 MEMS电容器的行程限制特性相对容易制造，避免了其他类型的MEMS电容器的粘附或粘滞问题。

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