中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

34 records (took 0.021 seconds)

    Touch sensor
    11.
    发明授权
    Touch sensor 有权
    触摸传感器

    公开(公告)号：US09189105B2

    公开(公告)日：2015-11-17

    申请号：US13831704

    申请日：2013-03-15

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Hee Jin Park ,  Ji Hyuk Lim ,  Seung Mi Lee ,  Suk Jin Ham

    IPC: G06F3/042 ,  G06F3/041 ,  H01H1/10 ,  G02F1/1333

    CPC classification number: G06F3/042 ,  G02F1/13338 ,  G06F3/041 ,  G06F2203/04103

    Abstract: Disclosed herein is a touch sensor, including: a window; a transparent substrate having a first electrode part formed on one surface thereof; and a first adhesive layer allowing the window and one surface of the transparent substrate to adhere to each other, wherein a first protrusion part is formed on an edge of one surface of the transparent substrate.

    Abstract translation: 这里公开了一种触摸传感器，包括：窗口; 透明基板，具有形成在其一个表面上的第一电极部分; 以及允许所述窗口和所述透明基板的一个表面彼此粘合的第一粘合层，其中在所述透明基板的一个表面的边缘上形成有第一突起部。

    BONDING FORCE TEST DEVICE
    12.
    发明申请
    BONDING FORCE TEST DEVICE 审中-公开
    绑定力测试装置

    公开(公告)号：US20150114131A1

    公开(公告)日：2015-04-30

    申请号：US14188183

    申请日：2014-02-24

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Jin Uk Cha ,  Gyu Seok Kim ,  Eun Ju Yang ,  Mi Yang Kim ,  Suk Jin Ham

    IPC: G01N3/24 ,  H02N2/10 ,  G01N3/04

    CPC classification number: G01N3/24 ,  G01N3/04 ,  G01N19/04 ,  G01N2203/0037

    Abstract: Disclosed herein is a bonding force test device, including: a holder mounted with a sample to which a plurality of subjects to be tested are bonded; a rotating part rotating the holder; and a fixing tip disposed in a direction in which the fixing tip faces the holder, wherein at the time of rotating the holder, the fixing tip contacts any one of the subjects to be tested in the sample and a shearing stress is applied to a bonded portion between the fixing tip and any one subject to be tested.

    Abstract translation: 这里公开了一种接合力测试装置，包括：安装有待测试的多个被检体的样品的保持器; 旋转所述保持器的旋转部分; 以及设置在所述固定末端面向所述保持器的方向上的固定末端，其中在所述保持器旋转时，所述固定末端与所述待测试对象中的任何一个接触，并且将粘合 固定头和被测试对象之间的部分。

    TOUCH PANEL
    15.
    发明申请
    TOUCH PANEL 审中-公开
    触控面板

    公开(公告)号：US20140176828A1

    公开(公告)日：2014-06-26

    申请号：US14136181

    申请日：2013-12-20

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Jung Eun Noh ,  Seung Heon Han ,  Suk Jin Ham ,  Jung Tae Park ,  Sung Yeol Park

    IPC: G06F3/041

    CPC classification number: G06F3/041

    Abstract: Disclosed herein is a touch panel including a transparent substrate, a plurality of magnets positioned in both sides of the transparent substrate, ferromagnetic cores formed in one surface of the transparent substrate, and electrodes formed in one surface of the transparent substrate such that the electrodes are positioned in an outer side of the ferromagnetic cores, respectively.

    Abstract translation: 这里公开了一种触摸面板，其包括透明基板，位于透明基板的两侧的多个磁体，形成在透明基板的一个表面中的铁磁芯，以及形成在透明基板的一个表面中的电极， 分别位于铁磁芯的外侧。

    METHOD OF ANALYZING ALDEHYDE COMPOUND IN METAL PLATING SOLUTION
    16.
    发明申请
    METHOD OF ANALYZING ALDEHYDE COMPOUND IN METAL PLATING SOLUTION 审中-公开
    金属化学溶液中分析醛类化合物的方法

    公开(公告)号：US20140147926A1

    公开(公告)日：2014-05-29

    申请号：US13829617

    申请日：2013-03-14

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Ji Eun Jeon ,  Se Kyung Lee ,  Hyo Jin Yoon ,  Suk Jin Ham

    IPC: G01N33/20

    CPC classification number: G01N33/20 ,  G01N30/06 ,  G01N30/7233 ,  G01N2030/067 ,  G01N2030/884 ,  Y10T436/200833 ,  Y10T436/202499

    Abstract: This invention relates to a method of analyzing an aldehyde compound in a metal plating solution, including adding a pH control solution to an aldehyde derivative, thus preparing an oversaturated aldehyde derivative solution in which the aldehyde derivative is dissolved to be oversaturated while the pH of the aldehyde derivative solution is adjusted to be the same as that of the metal plating solution; adding the oversaturated aldehyde derivative solution to the metal plating solution, so that the aldehyde compound which is present in the metal plating solution undergoes derivation, thus obtaining an aldehyde derivative compound; extracting the aldehyde derivative compound; and analyzing the aldehyde compound from the extracted aldehyde derivative compound.

    Abstract translation: 本发明涉及一种分析金属电镀液中的醛化合物的方法，包括向醛衍生物中加入pH对照溶液，从而制备过饱和醛衍生物溶液，其中醛衍生物被溶解以过饱和， 将醛衍生物溶液调节至与金属电镀溶液相同; 将过饱和醛衍生物溶液加入到金属电镀溶液中，使得存在于金属电镀溶液中的醛化合物经过衍生，得到醛衍生物化合物; 提取醛衍生物化合物; 并从提取的醛衍生物化合物中分析醛化合物。

    APPARATUS AND METHOD OF TESTING SEMICONDUCTOR MODULE
    18.
    发明申请
    APPARATUS AND METHOD OF TESTING SEMICONDUCTOR MODULE 审中-公开
    装置和测试半导体模块的方法

    公开(公告)号：US20140140373A1

    公开(公告)日：2014-05-22

    申请号：US14022893

    申请日：2013-09-10

    Applicant: c/o SAMSUNG ELECTRO-MECHANICS CO., LTD

    Inventor： Shang Hoon Seo ,  Seung Hwan Kim ,  Suk Jin Ham

    IPC: G01K7/01

    CPC classification number: G01K1/026 ,  G01K1/14 ,  G01K7/04

    Abstract: There are provided an apparatus and a method of testing a semiconductor module capable of easily testing a power semiconductor module including a plurality of switching devices. The apparatus for testing a semiconductor module includes: a main substrate disposed within a case; a jig substrate detachably coupled to the main substrate; and a socket substrate detachably coupled to the jig substrate and having the semiconductor module mounted thereon.

    Abstract translation: 提供一种能够容易地测试包括多个开关器件的功率半导体模块的半导体模块的测试装置和方法。 用于测试半导体模块的装置包括：设置在壳体内的主基板; 可拆卸地联接到主基板的夹具基板; 以及可拆卸地联接到所述夹具基板并且安装有所述半导体模块的插座基板。

    PRINTED CIRCUIT BOARD HAVING ELECTRONIC COMPONENT EMBEDDED THEREIN
    19.
    发明申请
    PRINTED CIRCUIT BOARD HAVING ELECTRONIC COMPONENT EMBEDDED THEREIN 审中-公开
    具有嵌入式电子元件的印刷电路板

    公开(公告)号：US20140138138A1

    公开(公告)日：2014-05-22

    申请号：US13830786

    申请日：2013-03-14

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Sung Yeol Park ,  Suk Jin Ham ,  Seung Heon Han

    IPC: H05K1/18

    CPC classification number: H05K1/183 ,  H01G2/06 ,  H01G2/106 ,  H01G4/224 ,  H01G4/228 ,  H05K3/30 ,  H05K3/325

    Abstract: Disclosed herein is a printed circuit board having an electronic component embedded therein, the printed circuit board including: the electronic component having an external electrode formed on one side surface or both side surfaces thereof; a base substrate having a cavity into which the electronic component is inserted; and at least one connection member inserted between the external electrode of the electronic component and an inner wall of the cavity to electrically connect the electronic component and the base substrate to each other.

    Abstract translation: 本发明公开了一种具有嵌入其中的电子部件的印刷电路板，印刷电路板包括：电子部件，其具有形成在一个侧面或其两个侧面上的外部电极; 具有空腔的基底基板，电子部件插入其中; 以及插入在电子部件的外部电极和空腔的内壁之间的至少一个连接部件，以将电子部件和基材彼此电连接。

    SEMICONDUCTOR CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
    20.
    发明申请
    SEMICONDUCTOR CHIP PACKAGE AND MANUFACTURING METHOD THEREOF 审中-公开
    半导体芯片封装及其制造方法

    公开(公告)号：US20140061891A1

    公开(公告)日：2014-03-06

    申请号：US13800662

    申请日：2013-03-13

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Po Chul KIM ,  Kyung Ho Lee ,  Seung Wan Woo ,  Young Nam Hwang ,  Suk Jin Ham

    IPC: H01L23/00 ,  H01L21/56

    CPC classification number: H01L23/562 ,  H01L21/56 ,  H01L21/565 ,  H01L23/3121 ,  H01L2224/48227 ,  H01L2924/3511

    Abstract: Disclosed herein are a semiconductor chip package and a manufacturing method thereof. The manufacturing method of the semiconductor chip package includes: a) mounting a semiconductor chip on a printed circuit board (PCB); b) inserting a warpage suppressing reinforcement member into an inner ceiling of a mold manufactured in order to package the PCB having the semiconductor chip mounted thereon; c) combining the mold having the warpage suppressing reinforcement member inserted into the ceiling thereof with the upper surface of the PCB so as to surround the PCB having the semiconductor chip mounted thereon; d) injection-molding and filling a molding material in the mold, and hardening the molding material by applying heat, and e) hardening the molding material and then removing the mold to complete the semiconductor chip package.

    Abstract translation: 本文公开了一种半导体芯片封装及其制造方法。 半导体芯片封装的制造方法包括：a）将半导体芯片安装在印刷电路板（PCB）上; b）将翘曲抑制加强构件插入制造的模具的内部天花板中，以便封装其上安装有半导体芯片的PCB; c）将插入其天花板的具有翘曲抑制加强件的模具与PCB的上表面结合，以便围绕安装有半导体芯片的PCB; d）在模具中注射成型并填充模塑材料，并通过加热来硬化模塑材料，以及e）硬化模制材料，然后移除模具以完成半导体芯片封装。

Patent Agency Ranking