公开(公告)号：US20170365739A1

公开(公告)日：2017-12-21

申请号：US15410033

申请日：2017-01-19

申请人： Samsung Electronics Co., Ltd.

发明人： Ki Won PARK ,  Yong Min KWON ,  Hyung Kun KIM ,  Dong Kuk LEE ,  Dae Yeop HAN

IPC分类号： H01L33/22 ,  H01L33/06 ,  H01L33/32 ,  H01L27/15 ,  H01L33/62 ,  H01L33/54 ,  H01L33/50 ,  H01L33/38 ,  H01L33/00

CPC分类号： H01L33/22 ,  H01L27/153 ,  H01L33/0025 ,  H01L33/0075 ,  H01L33/06 ,  H01L33/325 ,  H01L33/38 ,  H01L33/505 ,  H01L33/54 ,  H01L33/62 ,  H01L2933/0016 ,  H01L2933/0041 ,  H01L2933/005

摘要： A semiconductor light emitting device package includes a light emitting structure having a first conductive semiconductor layer, an active layer, a second conductive semiconductor layer, a first surface, and a second surface, a first electrode and a second electrode disposed on the second surface of the light emitting structure; an insulating layer, a first metal pad and a second metal pad disposed on the insulating layer, and each having a surface with a first fine uneven pattern so as to have a first surface roughness, a first bonding pad and a second bonding pad disposed on the first metal pad and the second metal pad, respectively, and each having a surface with a second fine uneven pattern so as to have a second surface roughness, and an encapsulant encapsulating the first bonding pad, the second bonding pad, the first metal pad, and the second metal pad.

公开(公告)号：US20150060925A1

公开(公告)日：2015-03-05

申请号：US14532866

申请日：2014-11-04

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Hak Hwan KIM ,  Ho Sun PAEK ,  Hyung Kun KIM ,  Sung Kyong OH ,  Jong In YANG

IPC分类号： H01L33/58

CPC分类号： H01L33/58 ,  H01L33/0095 ,  H01L33/382 ,  H01L33/385

摘要： Disclosed are a light emitting device and a method of manufacturing the same. The light emitting device includes a substrate; a light emitting structure disposed on the substrate and having a stack structure in which a first conductivity type semiconductor layer, an active layer and a second conductivity type semiconductor layer are stacked; a lens disposed on the light emitting structure; and a first terminal portion and a second terminal portion electrically connected to the first conductivity type semiconductor layer and the second conductivity type semiconductor layer, respectively. At least one of the first and second terminal portions extends from a top surface of the light emitting structure along respective side surfaces of the light emitting structure and the substrate.

摘要翻译： 公开了一种发光器件及其制造方法。 发光装置包括：基板; 发光结构，其设置在所述基板上，并具有其中层叠有第一导电类型半导体层，有源层和第二导电类型半导体层的堆叠结构; 设置在所述发光结构上的透镜; 以及分别电连接到第一导电类型半导体层和第二导电类型半导体层的第一端子部分和第二端子部分。 第一和第二端子部分中的至少一个从发光结构的顶表面沿着发光结构和基板的相应侧表面延伸。