公开(公告)号：US20150060925A1

公开(公告)日：2015-03-05

申请号：US14532866

申请日：2014-11-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hak Hwan KIM ,  Ho Sun PAEK ,  Hyung Kun KIM ,  Sung Kyong OH ,  Jong In YANG

IPC: H01L33/58

CPC classification number: H01L33/58 ,  H01L33/0095 ,  H01L33/382 ,  H01L33/385

Abstract: Disclosed are a light emitting device and a method of manufacturing the same. The light emitting device includes a substrate; a light emitting structure disposed on the substrate and having a stack structure in which a first conductivity type semiconductor layer, an active layer and a second conductivity type semiconductor layer are stacked; a lens disposed on the light emitting structure; and a first terminal portion and a second terminal portion electrically connected to the first conductivity type semiconductor layer and the second conductivity type semiconductor layer, respectively. At least one of the first and second terminal portions extends from a top surface of the light emitting structure along respective side surfaces of the light emitting structure and the substrate.

Abstract translation: 公开了一种发光器件及其制造方法。 发光装置包括：基板; 发光结构，其设置在所述基板上，并具有其中层叠有第一导电类型半导体层，有源层和第二导电类型半导体层的堆叠结构; 设置在所述发光结构上的透镜; 以及分别电连接到第一导电类型半导体层和第二导电类型半导体层的第一端子部分和第二端子部分。 第一和第二端子部分中的至少一个从发光结构的顶表面沿着发光结构和基板的相应侧表面延伸。

公开(公告)号：US20140299898A1

公开(公告)日：2014-10-09

申请号：US14310885

申请日：2014-06-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hak Hwan KIM ,  Kyung Mi MOON ,  Ho Sun PAEK ,  Young Hee SONG

IPC: H01L33/50 ,  H01L33/58 ,  H01L27/15

CPC classification number: H01L33/502 ,  H01L25/0753 ,  H01L27/15 ,  H01L33/50 ,  H01L33/54 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2933/005 ,  H01L2924/00

Abstract: A light emitting device (LED) module, and manufacturing method of the same, which may be applied to various applications is provided. The LED module may be miniaturized by directly mounting an LED and a lens unit on a substrate, and price competitiveness may be enhanced by lowering a fraction defective and increasing yield of the LED module. In a method of manufacturing an LED module, an operation may be minimized and simplified by directly mounting LEDs and a plurality of lens units having various shapes, collectively forming the plurality of lens units, and by performing the operation on a wafer level. A heat radiation characteristic may be enhanced through use of a metallic material as a substrate and a bump.

Abstract translation: 提供了可应用于各种应用的发光器件（LED）模块及其制造方法。 通过将LED和透镜单元直接安装在基板上，LED模块可以小型化，并且通过降低LED模块的不合格率和增加的产量，可以提高价格竞争力。 在制造LED模块的方法中，通过直接安装LED和具有各种形状的多个透镜单元，共同形成多个透镜单元，以及通过在晶片级上执行操作，可以最小化和简化操作。 可以通过使用金属材料作为基板和凸块来增强散热特性。

公开(公告)号：US20190326480A1

公开(公告)日：2019-10-24

申请号：US16223990

申请日：2018-12-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jae Sung YOU ,  Ho Sun PAEK ,  Ho Young SONG ,  Jun Bum LEE

IPC: H01L33/50 ,  H01L33/40 ,  H05B33/08 ,  H01L33/10 ,  H01L33/26

Abstract: A light emitting diode (LED) module includes: a flexible substrate having a first surface on which a circuit pattern is disposed, and a second surface opposite the first surface; a plurality of light emitting diode (LED) chips mounted on the first surface of the flexible substrate, and electrically connected to the circuit pattern; an insulating reflective layer disposed on the first surface of the flexible substrate, and covering a portion of the circuit pattern; first and second connection terminals disposed at both ends of the flexible substrate, and connected to the circuit pattern; and a wavelength conversion layer covering the plurality of LED chips and surrounding the flexible substrate in a cross-sectional view.

公开(公告)号：US20140120641A1

公开(公告)日：2014-05-01

申请号：US14148365

申请日：2014-01-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kwon Joong KIM ,  Ho Sun PAEK ,  Hak Hwan KIM

IPC: H01L33/48

CPC classification number: H01L33/486 ,  H01L33/36 ,  H01L33/62 ,  H01L2224/16245 ,  H01L2933/0016

Abstract: A flip chip light emitting device (LED) package and a manufacturing method thereof are provided. The flip chip LED package includes a package substrate including a cavity that exposes a circuit pattern, and a chip mounting portion disposed on a bottom surface of the cavity; a solder layer disposed on the circuit pattern; a bonding tape layer disposed on the chip mounting portion; and an LED including a bonding object region and a plurality of electrode pads disposed on one surface, being mounted on the package substrate such that the plurality of electrode pads are bonded to the solder layer and the bonding object region is bonded to the bonding tape layer

Abstract translation: 提供了一种倒装芯片发光器件（LED）封装及其制造方法。 倒装芯片LED封装包括包括暴露电路图案的空腔的封装基板和设置在空腔的底表面上的芯片安装部分; 设置在电路图案上的焊料层; 粘合带层，设置在所述芯片安装部分上; 以及包括粘合对象区域和设置在一个表面上的多个电极焊盘的LED，安装在封装基板上，使得多个电极焊盘接合到焊料层，并且焊接对象区域接合到接合带层

公开(公告)号：US20130149858A1

公开(公告)日：2013-06-13

申请号：US13710586

申请日：2012-12-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jung Tae OK ,  Hak Hwan KIM ,  Ho Sun PAEK ,  Kwon Joong KIM

IPC: H01L21/768

CPC classification number: H01L21/76892 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05023 ,  H01L2224/05171 ,  H01L2224/05568 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05664 ,  H01L2224/05669 ,  H01L2224/1132 ,  H01L2224/11849 ,  H01L2224/13006 ,  H01L2224/13007 ,  H01L2224/13012 ,  H01L2224/13016 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/05552

Abstract: A bump manufacturing method may be provided. The bump manufacturing method may include forming a bump on an electrode pad included in a semiconductor device, and controlling a shape of the bump by reflowing the bump formed on the semiconductor device under an oxygen atmosphere.

Abstract translation: 可以提供凸块制造方法。 凸块制造方法可以包括在包括在半导体器件中的电极焊盘上形成凸块，并且通过在氧气氛下回流形成在半导体器件上的凸块来控制凸块的形状。