-
公开(公告)号:US20240258351A1
公开(公告)日:2024-08-01
申请号:US18631933
申请日:2024-04-10
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Taesung LEE , Dongmin KEUM , Bumsuk KIM , Jinho KIM , Junsung PARK , Kwanghee LEE , Dongkyu LEE , Yunki LEE
IPC: H01L27/146 , H04N23/67
CPC classification number: H01L27/14627 , H01L27/14621 , H01L27/14643 , H04N23/672
Abstract: An image sensor includes a normal pixel, a first auto-focus (AF) pixel, and a second AF pixel, each of the normal pixel, the first AF pixel and the second AF pixel including a photodiode. The image sensor further includes a normal microlens disposed on the normal pixel, and a first AF microlens disposed on the first AF pixel and the second AF pixel. The photodiode of the normal pixel, the photodiode of the first AF pixel, and the photodiode of the second AF pixel are respectively disposed in photo-detecting areas of a semiconductor substrate. A height of the first AF microlens in a vertical direction from a top surface of the semiconductor substrate is greater than a height of the normal microlens in the vertical direction from the top surface of the semiconductor substrate.
-
12.
公开(公告)号:US20240215215A1
公开(公告)日:2024-06-27
申请号:US18534220
申请日:2023-12-08
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sangwook KIM , Kwanghee LEE , Jeeeun YANG , Moonil JUNG , Euntae KIM , Youngkwan CHA
IPC: H10B12/00
CPC classification number: H10B12/00
Abstract: A memory device includes a read word line on a substrate, a first channel extending along a plane perpendicular to an upper surface of the substrate, a second channel facing the first channel in parallel, a first gate insulation layer adjacent to the first channel between the first channel and the second channel, a second gate insulation layer adjacent to the second channel between the first channel and the second channel, a gate electrode adjacent to the first gate insulation layer between the first gate insulation layer and the second gate insulation layer, a write word line adjacent to the second gate insulation layer between the first gate insulation layer and the second gate insulation layer, a read bit line electrically connected to the first channel, and a write bit line electrically connected to the second channel.
-
公开(公告)号:US20240120421A1
公开(公告)日:2024-04-11
申请号:US18479428
申请日:2023-10-02
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jeeeun YANG , Sangwook KIM , Euntae KIM , Kwanghee LEE , Moonil JUNG
IPC: H01L29/786 , H01L29/423 , H01L29/66
CPC classification number: H01L29/7869 , H01L29/42384 , H01L29/66742
Abstract: A semiconductor device and a method of manufacturing the same are provided. The semiconductor device includes a lower electrode provided on a substrate, a buffer layer provided on the lower electrode and including first indium, an oxide semiconductor layer provided on the buffer layer and including second indium, a gate electrode provided apart from the oxide semiconductor layer, and an upper electrode provided on the oxide semiconductor layer, wherein a content of the first indium is greater than a content of the second indium.
-
公开(公告)号:US20230122283A1
公开(公告)日:2023-04-20
申请号:US17812487
申请日:2022-07-14
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Taehan KIM , Yunki LEE , Dongmin KEUM , Bumsuk KIM , Kwanghee LEE , Yeaju JANG
IPC: H04N5/369 , H01L27/146 , H04N5/3745
Abstract: An image sensor includes a pixel array in which a plurality of normal pixels and a plurality of autofocus (AF) pixels are disposed, and a logic circuit. The logic circuit provides an autofocus function using a phase difference between pixel signals obtained from each of the plurality of AF pixels. Each of the AF pixels includes a single AF lens disposed on a pair of pixel areas. An AF lens of the AF pixel spaced apart from a center of the pixel array may have an area larger than an area of the AF lens of the AF pixel adjacent to the center.
-
公开(公告)号:US20210367080A1
公开(公告)日:2021-11-25
申请号:US17308543
申请日:2021-05-05
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kwanghee LEE , Sangwook KIM , Jinseong HEO
Abstract: An oxide semiconductor transistor includes: an insulating substrate including a trench; a gate electrode in the trench; an oxide semiconductor layer on a surface of the insulating substrate, the surface exposed through the trench; and a ferroelectric layer between the gate electrode and the oxide semiconductor layer, wherein the oxide semiconductor layer may include a source region and a drain region which are on the insulating substrate outside the trench and are apart from each other with the gate electrode therebetween.
-
公开(公告)号:US20180158856A1
公开(公告)日:2018-06-07
申请号:US15830166
申请日:2017-12-04
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Seunghoon HAN , Lilong SHI , Kwanghee LEE , Changgyun SHIN
IPC: H01L27/146 , H01L51/42 , H01L31/103 , H01L27/30
CPC classification number: H01L27/14621 , H01L27/14629 , H01L27/14647 , H01L27/307 , H01L31/02327 , H01L31/1013 , H01L31/103 , H01L51/42
Abstract: A stack-type image sensor may include a photodiode and a meta-filter. The photodiode may include a first photodiode configured to absorb first light of a first wavelength band and a second photodiode disposed on the first photodiode and configured to absorb second light of a second wavelength band. The meta-filter may include a first meta-filter disposed in a lower portion of the first photodiode and configured to reflect the first light of the first wavelength band to the first photodiode.
-
公开(公告)号:US20240321921A1
公开(公告)日:2024-09-26
申请号:US18610413
申请日:2024-03-20
Applicant: Samsung Electronics Co., Ltd.
Inventor: Seounghyun KIM , Changhyo KOO , Sangchun PARK , Kwanghee LEE , Wook LEE , Haeyeon CHUNG
IPC: H01L27/146
CPC classification number: H01L27/1463 , H01L27/14627 , H01L27/14634 , H01L27/14645
Abstract: Provided is an image sensor including a device isolation structure. The image sensor includes a semiconductor substrate including a pixel array including a plurality of pixels, a first photoelectric conversion device and a second photoelectric conversion device inside the semiconductor substrate and included in each of the plurality of pixels, microlenses on the first photoelectric conversion device and the second photoelectric conversion device and a device isolation structure between the plurality of pixels and between the first photoelectric conversion device and the second photoelectric conversion device, the device isolation structure opening a part between the first photoelectric conversion device and the second photoelectric conversion device, including an open region at each edge of the plurality of pixels, and may be continuous in the pixel array.
-
公开(公告)号:US20240266445A1
公开(公告)日:2024-08-08
申请号:US18638923
申请日:2024-04-18
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jinseong HEO , Taehwan MOON , Hagyoul BAE , Seunggeol NAM , Sangwook KIM , Kwanghee LEE
CPC classification number: H01L29/86 , H10B69/00 , H10K10/50 , H10K19/00 , H10K19/201
Abstract: A semiconductor apparatus includes a plurality of semiconductor devices. The semiconductor devices each include a ferroelectric layer, a conductive metal oxide layer, and a semiconductor layer, between two electrodes. The conductive metal oxide layer may be between the ferroelectric layer and the semiconductor layer. The ferroelectric layer, the conductive metal oxide layer, and the semiconductor layer may all include a metal oxide. The conductive metal oxide layer may include one or more materials selected from the group consisting of an indium oxide, a zinc oxide, a tin oxide, and any combination thereof.
-
公开(公告)号:US20240178324A1
公开(公告)日:2024-05-30
申请号:US18518735
申请日:2023-11-24
Applicant: Samsung Electronics Co., Ltd. , IUCF-HYU (Industry-University Cooperation Foundation Hanyang University)
Inventor: Kwanghee LEE , Jinseong PARK , Sangwook KIM , Hyemi KIM , Seonghwan RYU
IPC: H01L29/786 , H01L29/417 , H01L29/423 , H01L29/66
CPC classification number: H01L29/7869 , H01L29/41733 , H01L29/42384 , H01L29/6675 , H01L29/78696
Abstract: Provided are a crystalline InZnO oxide semiconductor, a method of forming the same, and a semiconductor device including the crystalline InZnO oxide semiconductor. The crystalline InZnO oxide semiconductor includes an oxide including In and Zn, wherein in Inductively Coupled Plasma-Mass Spectrometry (ICP-MS) analysis, a content of In among In and Zn is about 30 at % or more and about 75 at % or less, and the crystalline InZnO oxide semiconductor has a peak showing crystallinity at a 2-theta value between about 32.3 degrees and about 33.3 degrees in X-ray diffraction (XRD) analysis.
-
公开(公告)号:US20240021638A1
公开(公告)日:2024-01-18
申请号:US18221736
申请日:2023-07-13
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Yeaju JANG , Dongmin KEUM , Kwanghee LEE , Bumsuk KIM , Jinho KIM , Yun Ki LEE
IPC: H01L27/146
CPC classification number: H01L27/14623 , H01L27/14645
Abstract: An image sensor includes a first pixel group on a substrate and including a plurality of first pixels, a second pixel group on the substrate and including a plurality of second pixels, where at least one of the plurality of first pixels and at least one of the plurality of second pixels are adjacent in a first direction, a first autofocus pixel group between the first pixel group and the second pixel group, the first autofocus pixel group including a first autofocus pixel adjacent to the first pixel group and a second autofocus pixel adjacent to the second pixel group, a first color filter on the first autofocus pixel and the second autofocus pixel, a second color filter on the plurality of second pixels, and a light-shield pattern that separates the first color filter and the second color filter.
-
-
-
-
-
-
-
-
-