Abstract:
Provided are a semiconductor device and a method of manufacturing the same. The semiconductor device includes a lower electrode on a substrate, a metal oxide on the lower electrode, a buffer on the metal oxide, an oxide channel in the buffer, a gate insulating layer in the oxide channel, a gate electrode in the gate insulating layer, and an upper electrode on the gate electrode, and the buffer may include a silicide material.
Abstract:
A semiconductor device includes an oxide semiconductor layer, a first electrode and a second electrode, which are arranged apart from each other on the oxide semiconductor layer, a metal oxide layer arranged between the oxide semiconductor layer and at least one of the first electrode and the second electrode, and a metal nitride layer arranged between the metal oxide layer and the oxide semiconductor layer.
Abstract:
A water-soluble partially lithiated polyamic acid having an acid equivalent of less than 300 grams per equivalent and a degree of lithium ion substitution of from about 0.2 equivalents to about 1.0 equivalent with respect to carboxylic acid groups, which is a product of a polyamic acid and lithium hydroxide.
Abstract:
A memory device includes a read word line on a substrate, a first channel extending along a plane perpendicular to an upper surface of the substrate, a second channel facing the first channel in parallel, a first gate insulation layer adjacent to the first channel between the first channel and the second channel, a second gate insulation layer adjacent to the second channel between the first channel and the second channel, a gate electrode adjacent to the first gate insulation layer between the first gate insulation layer and the second gate insulation layer, a write word line adjacent to the second gate insulation layer between the first gate insulation layer and the second gate insulation layer, a read bit line electrically connected to the first channel, and a write bit line electrically connected to the second channel.
Abstract:
A semiconductor device and a method of manufacturing the same are provided. The semiconductor device includes a lower electrode provided on a substrate, a buffer layer provided on the lower electrode and including first indium, an oxide semiconductor layer provided on the buffer layer and including second indium, a gate electrode provided apart from the oxide semiconductor layer, and an upper electrode provided on the oxide semiconductor layer, wherein a content of the first indium is greater than a content of the second indium.
Abstract:
A composite anode active material includes a metal silicide core, a silicon shell, and a metal nitride and a carbon material that are dispersed in at least one surface of the silicon shell.
Abstract:
A capacitor includes a first electrode, a second electrode spaced apart from the first electrode, a dielectric layer arranged between the first electrode and the second electrode, and an interface layer arranged between the second electrode and the dielectric layer, wherein the interface layer includes a first element, a second element, and a third element, the first element includes aluminum (Al), the second element includes gallium (Ga), and the third element includes oxygen (O).
Abstract:
A binder includes a third polymer including a cross-linked product of a first polymer and a second polymer, wherein the first polymer includes a first functional group and is at least one selected from a polyamic acid and a polyimide, wherein the second polymer includes a second functional group and is water-soluble, and wherein the first polymer and the second polymer are cross-linked by an ester bond formed by a reaction of the first functional group and the second functional.
Abstract:
A composite anode active material including: a silicon material and a coating layer formed on at least a portion of a surface of the silicon material, wherein the coating layer is chemically bonded to the silicon material, and wherein the coating layer includes a hydrosilylation product of a C4-C30 alkene having a terminal —C(═O)OR group, wherein R is a hydrogen, a C1-C5 alkyl group, a C2-C6 heteroalkyl group, a C6-C12 aryl group, or a C7-C13 arylalkyl group, each of which except hydrogen is substituted or unsubstituted.
Abstract:
Disclosed are a semiconductor device, a method of manufacturing the same, and an electronic element and an electronic apparatus each including the semiconductor device. The semiconductor device may include a substrate, a channel layer on the substrate, a first electrode and a second electrode on two opposite ends of the channel layer, respectively, and spaced apart from each other, a gate electrode on the channel layer and spaced apart from the first electrode and the second electrode, a gate dielectric material provided between the channel layer and the gate electrode, and a chalcogen compound layer being at least one of between the gate dielectric material and the channel layer, between the first electrode and the channel layer, and between the second electrode and the channel layer.