SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD

    公开(公告)号:US20230213866A1

    公开(公告)日:2023-07-06

    申请号:US18147473

    申请日:2022-12-28

    CPC classification number: G03F7/70158 G03F1/60 G03F7/70025

    Abstract: The present disclosure relates to an apparatus for treating a substrate. The substrate treatment apparatus includes a support unit that supports a substrate, a liquid supply unit that supplies a liquid to the substrate supported by the support unit, and a laser unit that heats the substrate supported by the support unit, wherein the laser unit includes an oscillation unit that emits a light, and a diffraction unit that separates the light into a plurality of light bundles and irradiates the substrate supported by the support unit with an adjustment light having a profile changed from a profile of the light.

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