公开(公告)号：US20250093768A1

公开(公告)日：2025-03-20

申请号：US18770090

申请日：2024-07-11

Applicant: SEMES CO., LTD. ,  SAMSUNG ELECTRONICS CO. LTD.

Inventor： Jin Yeong SUNG ,  Ki Hoon CHOI ,  Seung Un OH ,  Young Ho PARK ,  Sang Hyeon RYU ,  Jang Jin LEE ,  Hyun YOON ,  Sang Gun LEE ,  Yu Jin CHO ,  Ho Jong HWANG ,  Jong Ju PARK ,  Jong Keun OH ,  Yong Woo KIM

IPC: G03F1/72 ,  G03F1/84 ,  G06T7/20 ,  G06T7/66

Abstract: A substrate processing apparatus is provided and includes: a support unit including a spin chuck and a centering jig that is on the spin chuck, the spin chuck configured to support and rotate a substrate; a spraying unit configured to spray processing liquid onto the substrate; a swing arm including a correction unit that includes a sensor and an emitter, the swing arm configured to move such that the correction unit moves to a target point on the substrate, and the emitter configured to irradiate a beam towards the substrate; and a controller configured to: control the spin chuck and the swing arm; and determine whether a movement trajectory of the swing arm is aligned with a rotation center of the spin chuck based on information acquired by the sensor about the centering jig.

公开(公告)号：US20230307260A1

公开(公告)日：2023-09-28

申请号：US17703255

申请日：2022-03-24

Applicant: SEMES CO., LTD.

Inventor： Ho Jong HWANG ,  Do Yeon KIM ,  Hyun YOON

IPC: H01L21/67 ,  H01L21/687 ,  B08B3/08 ,  B08B3/04 ,  B08B3/02

CPC classification number: H01L21/67051 ,  H01L21/68764 ,  B08B3/08 ,  B08B3/041 ,  B08B3/022

Abstract: The present invention provides a substrate treating apparatus. The substrate treating apparatus includes: a cup having a treatment space therein; a support unit configured to support a substrate within the treatment space, and including a rotatable support plate; and a liquid discharge unit configured to discharge a chemical liquid to the substrate supported by the support unit, in which the support unit includes: a plurality of pin members provided to the support plate to support the substrate placed on the support plate; and a discharge member coupled to the pin member to discharge charges to the air according to a rotation of the support plate, and the discharge member is provided as a conductive member.

公开(公告)号：US20230207341A1

公开(公告)日：2023-06-29

申请号：US18146723

申请日：2022-12-27

Applicant: SEMES CO., LTD.

Inventor： Do Yeon KIM ,  Young Jun SON ,  Tae Hoon LEE ,  Sung-gyu LEE ,  Hyun YOON

IPC: H01L21/67

CPC classification number: H01L21/67051 ,  H01L21/67242 ,  H01L21/6715

Abstract: Provided is an apparatus for treating a substrate. The substrate treating apparatus may include: a substrate support unit supporting a substrate; a nozzle supplying a liquid to the substrate supported on the substrate support unit; a home port in which the nozzle waits; and an electrostatic measurement member measuring an electrostatic amount of a liquid dispensed from the nozzle in the home port.

公开(公告)号：US20230185206A1

公开(公告)日：2023-06-15

申请号：US17901103

申请日：2022-09-01

Applicant: SEMES CO., LTD.

Inventor： Tae Hee KIM ,  Ki Hoon CHOI ,  Hyun YOON ,  Won Sik SON ,  Hyo Won YANG ,  In Ki JUNG

IPC: G03F7/20

CPC classification number: G03F7/70875 ,  G03F7/70025

Abstract: The inventive concept provides a mask treating apparatus. The mask treating apparatus includes a support unit configured to support and rotate a mask, the mask having a first pattern within a plurality of cells thereof and a second pattern outside regions of the plurality of cells; a heating unit including a laser irradiation module and a moving module, the laser irradiation module having a laser irradiator for irradiating a laser light to the second pattern, the moving module configured to change a position of the laser irradiation module; and a controller configured to control the support unit and the heating unit, and wherein when a treating position is divided into four equal parts from a first quadrant to a fourth quadrant based on a center of the mask, the laser irradiator is positioned at the fourth quadrant and the first quadrant in a direction linearly moving from a standby position to the treating position, positioned at the third quadrant in a direction which is perpendicular to the fourth quadrant, and positioned at the second quadrant in a direction which is perpendicular to the first quadrant, and wherein the controller controls a rotation of the support unit so the second pattern is positioned at the fourth quadrant.

公开(公告)号：US20210134617A1

公开(公告)日：2021-05-06

申请号：US17079439

申请日：2020-10-24

Applicant: SEMES CO., LTD.

Inventor： Yong Jun SEO ,  Ye Rim YEON ,  Pil Kyun HEO ,  Byeong Geun KIM ,  Yoon Ki SA ,  Jung Suk GOH ,  Do Yeon KIM ,  Hyun YOON ,  Young Je UM ,  Dong Ok AHN

IPC: H01L21/67 ,  G03F7/30 ,  H01L21/687

Abstract: According to an exemplary embodiment of the present invention, a substrate treatment apparatus includes a chamber member including a treatment space in which a substrate is to be treated, a substrate support unit installed in the treatment space and supporting a substrate, a chemical ejection unit connected to the chamber member and ejecting a chemical fluid to the substrate support unit, and a steam supply unit connected to the chamber member and supplying steam to the chamber member.

公开(公告)号：US20240153791A1

公开(公告)日：2024-05-09

申请号：US18502531

申请日：2023-11-06

Applicant: SEMES CO., LTD.

Inventor： Jin Yeong SUNG ,  Ki Hoon CHOI ,  Hyun YOON ,  Sang Hyeon RYU ,  Young Ho PARK

IPC: H01L21/67 ,  H01L21/687

CPC classification number: H01L21/67069 ,  H01L21/67115 ,  H01L21/68764

Abstract: The inventive concept provides a substrate treating method for etching a specific region on a substrate. The substrate treating method includes supplying a treating liquid to the substrate; and irradiating a laser to the specific region to locally heat the specific region; and wherein at the irradiating the laser, the laser is irradiated a plurality of times within the specific region, and the laser is irradiated to a region which does not overlap on the substrate, but which overlaps within the specific region.

公开(公告)号：US20230215742A1

公开(公告)日：2023-07-06

申请号：US17986894

申请日：2022-11-15

Applicant: SEMES CO., LTD.

Inventor： Young Jun SON ,  Tae Hoon LEE ,  Sung Gyu LEE ,  Hyun YOON ,  Do Yeon KIM

IPC: H01L21/67 ,  B01D35/02

CPC classification number: H01L21/67051 ,  B01D35/02

Abstract: A substrate processing apparatus includes: a nozzle unit configured to discharge a processing liquid to a substrate; a pipe connected to the nozzle unit and a processing liquid supply unit supplying the processing liquid; a charge amount control unit disposed at the pipe, including a filter unit charged with positive charges or negative charges, and including at least one of a control valve, controlling a flow rate of the processing liquid passing through an inside of the filter unit, and a power supply unit, applying a voltage to the filter unit, to control a charge amount of the processing liquid; and a control unit connected to the charge amount control unit.

公开(公告)号：US20230213866A1

公开(公告)日：2023-07-06

申请号：US18147473

申请日：2022-12-28

Applicant: SEMES CO., LTD.

Inventor： Hyun YOON ,  Ji Hoon Jeong ,  Young Dae Chung ,  Ki Hoon Choi

IPC: G03F7/20 ,  G03F1/60

CPC classification number: G03F7/70158 ,  G03F1/60 ,  G03F7/70025

Abstract: The present disclosure relates to an apparatus for treating a substrate. The substrate treatment apparatus includes a support unit that supports a substrate, a liquid supply unit that supplies a liquid to the substrate supported by the support unit, and a laser unit that heats the substrate supported by the support unit, wherein the laser unit includes an oscillation unit that emits a light, and a diffraction unit that separates the light into a plurality of light bundles and irradiates the substrate supported by the support unit with an adjustment light having a profile changed from a profile of the light.

公开(公告)号：US20230205100A1

公开(公告)日：2023-06-29

申请号：US17864506

申请日：2022-07-14

Applicant: SEMES CO., LTD.

Inventor： Won Sik SON ,  Hyun YOON ,  Ki Hoon CHOI ,  Hyo Won YANG ,  Tae Hee KIM ,  In Ki JUNG

IPC: G03F7/20

CPC classification number: G03F7/70891

Abstract: The present invention provides a substrate treating apparatus including: a support unit supporting and rotating the substrate in a treatment space; a liquid supply unit supplying a liquid to the substrate supported by the support unit; and an irradiating module irradiating light to the substrate supported by the support unit, in which the irradiating module includes: a housing having an accommodation space; a laser unit located in the accommodation space, and including a laser irradiation unit irradiating laser light, and an irradiation end having one end protruding from the housing and irradiating the laser light irradiated from the laser irradiation unit to the substrate supported by the support unit; and a cooling unit located in the accommodation space and cooling the laser irradiation unit.

公开(公告)号：US20230195030A1

公开(公告)日：2023-06-22

申请号：US18084381

申请日：2022-12-19

Applicant: SEMES CO., LTD.

Inventor： Young Jun SON ,  Tae Hoon LEE ,  Hyun YOON ,  Do Yeon KIM

IPC: G03G21/18 ,  G03G15/02 ,  G03G15/00

CPC classification number: G03G21/1842 ,  G03G15/0233 ,  G03G15/60 ,  G03G15/80 ,  G03G2215/0872 ,  G03G2221/0084 ,  G03G2221/1651

Abstract: Proposed are a home port and a substrate processing apparatus using the same. The home port is installed in the substrate processing apparatus to temporarily mount a nozzle for discharging a process liquid to a substrate, and includes a main body having a space therein, a nozzle holder provided at an upper portion of the main body and configured to mount the nozzle, an inclined surface formed below the nozzle holder in the space, a first supply pipe configured to discharge a rinse liquid to a tip of the nozzle, a second supply pipe configured to inject the rinse liquid into the main body, a conductive wire configured to electrically connect the inclined surface and the first supply pipe, and a first switch installed on the conductive wire.