公开(公告)号：US20240038805A1

公开(公告)日：2024-02-01

申请号：US18487611

申请日：2023-10-16

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Yu-Te HSIEH

IPC: H01L27/146

CPC classification number: H01L27/14625 ,  H01L27/14614 ,  H01L27/14634

Abstract: According to an aspect, an image sensor package includes a substrate, an image sensor die coupled to the substrate, a light transmitting member, and a plurality of pillar members disposed between and contacting the image sensor die and the light transmitting member. A height of the plurality of pillar members defines a gap height between an active region of the image sensor die and the light transmitting member. The image sensor package including a bonding material that couples the light transmitting member to the image sensor. The bonding material contacts a side of a pillar member, of the plurality of pillar members, that extends between a first end contacting the light transmitting member and a second end contacting the image sensor die.

公开(公告)号：US20220216255A1

公开(公告)日：2022-07-07

申请号：US17143341

申请日：2021-01-07

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Yu-Te HSIEH

IPC: H01L27/146

Abstract: According to an aspect, an image sensor package includes a substrate, an image sensor die coupled to the substrate, a light-transmitting member, an inner joint member disposed between the light-transmitting member and the image sensor die, and an outer joint member disposed between the light-transmitting member and the substrate.

公开(公告)号：US20210305301A1

公开(公告)日：2021-09-30

申请号：US17344082

申请日：2021-06-10

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Yu-Te HSIEH

IPC: H01L27/146

Abstract: Implementations of semiconductor packages may include: a substrate having a first side and a second side and a die having an active area on a second side of the die. A first side of the die may be coupled to the second side of the substrate. The semiconductor package may also include a glass lid having a first side and a second side. The glass lid may be coupled over a second side of the die. The semiconductor package may include a first and a second molding compound and one or more cushions positioned between a first side of the glass lid and a portion of the first molding compound. The second molding compound may be coupled to the substrate and the around the die and the glass lid.

公开(公告)号：US20200335544A1

公开(公告)日：2020-10-22

申请号：US16946768

申请日：2020-07-06

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Yu-Te HSIEH

IPC: H01L27/146 ,  H01L23/31 ,  H01L23/00 ,  H01L23/498

Abstract: According to an aspect, a multi-chip packaging structure includes a first substrate having a first surface and a second surface, where the first substrate has a conductive layer portion. The multi-chip packaging structure includes an image sensor device coupled to the first surface of the first substrate, a first device coupled to the second surface of the first substrate, and a second substrate disposed apart from the first substrate, where the second substrate has a conductive layer portion. The conductive layer portion of the first substrate is communicatively connected to the conductive layer portion of the second substrate. The first device is disposed between the first substrate and the second substrate. The multi-chip packaging structure includes a second device coupled to the second substrate, and a third device coupled to the first substrate or the second substrate.

公开(公告)号：US20190096938A1

公开(公告)日：2019-03-28

申请号：US16204097

申请日：2018-11-29

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Yu-Te HSIEH

IPC: H01L27/146 ,  H01L25/16 ,  H01L23/00

Abstract: Implementations of semiconductor packages may include: a substrate coupled to one or more die and to one or more connectors, a glass lid coupled over one or more die by an adhesive and a housing comprising one or more sides and a bottom opening and a top opening. The substrate may be coupled to the housing at the bottom opening and the glass lid may be coupled under the housing at the top opening.

公开(公告)号：US20170345859A1

公开(公告)日：2017-11-30

申请号：US15679373

申请日：2017-08-17

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Yu-Te HSIEH

IPC: H01L27/146 ,  H01L25/16

CPC classification number: H01L27/14618 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/167 ,  H01L27/14625 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/14643 ,  H01L27/14678 ,  H01L27/14685 ,  H01L27/1469 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2924/00014 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/16151 ,  H01L2924/16152 ,  H01L2924/16235 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: Implementations of semiconductor packages may include: a substrate coupled to one or more die and to one or more connectors, a glass lid coupled over one or more die by an adhesive and a housing comprising one or more sides and a bottom opening and a top opening. The substrate may be coupled to the housing at the bottom opening and the glass lid may be coupled under the housing at the top opening.

公开(公告)号：US20240405043A1

公开(公告)日：2024-12-05

申请号：US18799472

申请日：2024-08-09

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Yu-Te HSIEH ,  I-Lin CHU

IPC: H01L27/146 ,  H01L31/0203

Abstract: According to an aspect, an image sensor package includes a substrate, an image sensor die coupled to the substrate, and a transparent member including a first surface and a second surface, where the second surface of the transparent member is coupled to the image sensor die via one or more dam members such that an empty space exists between an active area of the image sensor die and the second surface of the transparent member. The image sensor package includes a light blocking member coupled to or defined by the transparent member.

公开(公告)号：US20240304639A1

公开(公告)日：2024-09-12

申请号：US18179744

申请日：2023-03-07

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Yu-Te HSIEH

IPC: H01L27/146 ,  H01L23/00

CPC classification number: H01L27/14618 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L24/05 ,  H01L27/14636 ,  H01L2224/05624 ,  H01L2224/27416 ,  H01L2224/27436 ,  H01L2224/27618 ,  H01L2224/27848 ,  H01L2224/27901 ,  H01L2224/29011 ,  H01L2224/29013 ,  H01L2224/29082 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/83192 ,  H01L2224/83201 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2924/0665

Abstract: An optical sensor module includes a transparent lid spaced apart from the optical sensor die by a protective dam. The dam can be formed by photosensitive epoxy materials that can be patterned using a photolithography process. The epoxy materials can change between liquid and solid phases during assembly, and then can be fully hardened by curing. The protective dam can be formed as a single layer, or as a multi-layer stack of epoxy materials, in which the layers may have different properties. In some implementations, the epoxy dam acts as a spacer that provides a substantially uniform gap to minimize a tilt angle of the transparent lid with respect to the optical sensor.

公开(公告)号：US20240234456A1

公开(公告)日：2024-07-11

申请号：US18153267

申请日：2023-01-11

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Yu-Te HSIEH ,  Yusheng LIN

IPC: H01L27/146

CPC classification number: H01L27/14623 ,  H01L27/14618 ,  H01L27/14685

Abstract: In a general aspect, a package includes a semiconductor die including an optical device having an optically active area on a first side of the semiconductor die. The package also includes a glass cover having an antireflective coating disposed on a central portion of a first side of the glass cover. A perimeter portion of the first side of the glass cover excludes the antireflective coating. The package further includes an adhesive resin coupling the perimeter portion of the first side of the glass cover with the first side of the semiconductor die, such that the glass cover is disposed above and spaced from the optically active area.

公开(公告)号：US20230378209A1

公开(公告)日：2023-11-23

申请号：US17664133

申请日：2022-05-19

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Chee Peng NEO ,  Yu-Te HSIEH

IPC: H01L27/146 ,  H01L23/00

CPC classification number: H01L27/14625 ,  H01L27/14618 ,  H01L27/14685 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/92 ,  H01L24/73 ,  H01L27/14643 ,  H01L24/05 ,  H01L2224/05573 ,  H01L24/48 ,  H01L2224/48225 ,  H01L24/45 ,  H01L2224/45144 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45155 ,  H01L2224/45147 ,  H01L2224/05644 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05655 ,  H01L2224/05647 ,  H01L2224/2732 ,  H01L24/27 ,  H01L2224/29011 ,  H01L2224/29013 ,  H01L2224/29393 ,  H01L2224/32225 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/73215 ,  H01L2224/92165

Abstract: Implementations of an image sensor package may include an image sensor die including at least one bond pad thereon; a bond wire wirebonded to the at least one bond pad; and an optically transmissive lid coupled to the image sensor die with an optically opaque film adhesive over the at least one bond pad. The bond wire may extend through the optically opaque film adhesive to the at least one bond pad.