Abstract:
An embodiment of an integrated electronic device having a body, made at least partially of semiconductor material and having a top surface, a bottom surface, and a side surface, and a first antenna, which is integrated in the body and enables magnetic or electromagnetic coupling of the integrated electronic device with a further antenna. The integrated electronic device moreover has a coupling region made of magnetic material, which provides, in use, a communication channel between the first antenna and the further antenna.
Abstract:
An embodiment of an integrated electronic device having a body, made at least partially of semiconductor material and having a top surface, a bottom surface, and a side surface, and a first antenna, which is integrated in the body and enables magnetic or electromagnetic coupling of the integrated electronic device with a further antenna. The integrated electronic device moreover has a coupling region made of magnetic material, which provides, in use, a communication channel between the first antenna and the further antenna.
Abstract:
A monitoring device includes an electric supply line to be buried in the block of building material, to convey signals and to be AC supplied so as to generate voltage and current stationary waveforms. The device also includes primary inductors coupled to the electric supply line at positions corresponding to peaks of at least one of the voltage and current stationary waveforms. The device also includes integrated monitoring circuits to be buried in the block of building material, with each integrated monitoring circuit including an integrated sensor to sense at least one physical characteristic, and a secondary inductor magnetically coupled to a respective primary inductor to supply the integrated sensor, and communicate through the electric supply line.
Abstract:
A monitoring device is for the inner pressure distribution of building material in a building structure. The device may include planar sensing capacitors to be buried in contact with the building material, with each sensing capacitor including a pair of plates and a dielectric material layer therebetween adapted to undergo elastic deformation under pressure without deforming plastically. The device may also include a protection box to be buried in the building material, a dielectric material enclosed in the protection box, and connection terminals protruding from the protection box. Pairs of metal vias are buried in the dielectric material enclosed within the protection box, with each pair connecting the plates of a respective planar sensing capacitor to respective connection terminals.