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公开(公告)号：US08988155B2
公开(公告)日：2015-03-24
申请号：US13689430
申请日：2012-11-29
Applicant: STMicroelectronics S.r.l.
Inventor： Giorgio Allegato , Paolo Ferrari , Laura Maria Castoldi , Benedetto Vigna
IPC: H03B5/32 , H01L41/053 , H01L41/083 , H01L41/23 , H03B1/00 , H01L29/66 , H01L41/29 , H03H3/02 , H03H9/05 , H03H9/10 , H01L41/09 , H03H9/17 , H03H3/007
CPC classification number: H03B1/00 , H01L29/66007 , H01L41/053 , H01L41/083 , H01L41/094 , H01L41/23 , H01L41/29 , H03B5/32 , H03H3/007 , H03H3/02 , H03H9/0538 , H03H9/10 , H03H9/1007 , H03H9/1057 , H03H9/172
Abstract: An oscillator device includes: a structural layer extending over a first side of a semiconductor substrate; a semiconductor cap set on the structural layer; a coupling region extending between and hermetically sealing the structural layer and the cap and forming a cavity within the oscillator device; first and second conductive paths extending between the substrate and the structural layer; first and second conductive pads housed in the cavity and electrically coupled to first terminal portions of the first and second conductive paths by first and second connection regions, respectively, which extend through and are insulated from the structural layer; a piezoelectric resonator having first and second ends electrically coupled, respectively, to the first and second conductive pads, and extending in the cavity; and third and fourth conductive pads positioned outside the cavity and electrically coupled to second terminal portions of the first and second conductive paths.
Abstract translation: 振荡器装置包括：在半导体衬底的第一侧上延伸的结构层; 设置在结构层上的半导体盖; 耦合区域，其在所述结构层和所述盖之间延伸并且密封所述结构层和所述盖并在所述振荡器装置内形成空腔; 在基板和结构层之间延伸的第一和第二导电路径; 第一和第二导电焊盘，其容纳在所述空腔中，并且分别通过延伸穿过所述第一和第二导电路径并与所述结构层绝缘的第一和第二连接区域电连接到所述第一和第二导电路径的第一端子部分; 压电谐振器，其具有分别电耦合到第一和第二导电焊盘并且在空腔中延伸的第一和第二端; 以及第三和第四导电焊盘，其位于腔的外部并电耦合到第一和第二导电路径的第二端子部分。
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公开(公告)号：US09921405B2
公开(公告)日：2018-03-20
申请号：US15401681
申请日：2017-01-09
Inventor： Benedetto Vigna , Marco Ferrera , Sonia Costantini , Marco Salina
CPC classification number: G02B26/0841 , B81B3/0045 , B81B2201/042 , B81B2203/0154 , B81C1/00198 , G02B27/1006 , H02N1/002 , H02N1/006 , H04N9/3129 , H04N9/3135 , Y10T29/49002
Abstract: An electrostatically actuated oscillating structure includes a first stator subregion, a second stator subregion, a first rotor subregion and a second rotor subregion. Torsional elastic elements mounted to the first and second rotor subregions define an axis of rotation. A mobile element is coupled to the torsional elastic elements. The stator subregions are electrostatically coupled to respective regions of actuation on the mobile element. The stator subregions exhibit an element of structural asymmetry such that the electrostatic coupling surface between the first stator subregion and the first actuation region differs from the electrostatic coupling surface between the second stator subregion and the second actuation region.
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13.发明申请公开(公告)号：US20170123202A1
公开(公告)日：2017-05-04
申请号：US15401681
申请日：2017-01-09
Inventor： Benedetto Vigna , Marco Ferrera , Sonia Costantini , Marco Salina
CPC classification number: G02B26/0841 , B81B3/0045 , B81B2201/042 , B81B2203/0154 , B81C1/00198 , G02B27/1006 , H02N1/002 , H02N1/006 , H04N9/3129 , H04N9/3135 , Y10T29/49002
Abstract: An electrostatically actuated oscillating structure includes a first stator subregion, a second stator subregion, a first rotor subregion and a second rotor subregion. Torsional elastic elements mounted to the first and second rotor subregions define an axis of rotation. A mobile element is coupled to the torsional elastic elements. The stator subregions are electrostatically coupled to respective regions of actuation on the mobile element. The stator subregions exhibit an element of structural asymmetry such that the electrostatic coupling surface between the first stator subregion and the first actuation region differs from the electrostatic coupling surface between the second stator subregion and the second actuation region.
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14.发明授权公开(公告)号：US09096424B2
公开(公告)日：2015-08-04
申请号：US14312307
申请日：2014-06-23
Applicant: STMicroelectronics S.r.l.
Inventor： Sebastiano Conti , Benedetto Vigna , Mario Francesco Cortese
IPC: H04R25/00 , B81C1/00 , B81B7/00 , H04R1/28 , H04R19/00 , H04R19/04 , B81B3/00 , H04R1/04 , H04R1/06 , H04R1/08
CPC classification number: B81C1/00158 , B81B3/0018 , B81B7/0061 , B81B2201/0257 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48479 , H01L2924/00014 , H01L2924/16151 , H01L2924/16152 , H04R1/04 , H04R1/06 , H04R1/086 , H04R1/2838 , H04R19/005 , H04R19/04 , H04R2201/003 , H01L2224/48471 , H01L2224/4554 , H01L2924/00012
Abstract: A microelectromechanical-acoustic-transducer assembly has: a first die integrating a MEMS sensing structure having a membrane, which has a first surface in fluid communication with a front chamber and a second surface, opposite to the first surface, in fluid communication with a back chamber of the microelectromechanical acoustic transducer, is able to undergo deformation as a function of incident acoustic-pressure waves, and faces a rigid electrode so as to form a variable-capacitance capacitor; a second die, integrating an electronic reading circuit operatively coupled to the MEMS sensing structure and supplying an electrical output signal as a function of the capacitive variation; and a package, housing the first die and the second die and having a base substrate with external electrical contacts. The first and second dice are stacked in the package and directly connected together mechanically and electrically; the package delimits at least one of the front and back chambers.
Abstract translation: 微机电声换能器组件具有：集成具有膜的MEMS感测结构的第一模具，其具有与前室相反流体连通的第一表面和与第一表面相对的第二表面，其与背面流体连通 微机电声换能器的腔室能够经受作为入射声压波函数的变形，并且面向刚性电极以形成可变电容电容器; 集成了可操作地耦合到MEMS感测结构并且提供作为电容变化的函数的电输出信号的电子阅读电路; 以及包装体，其容纳所述第一模具和所述第二模具，并且具有带有外部电触点的基底基板。 第一和第二骰子堆叠在包装中并机械和电气直接连接在一起; 该包装限定前室和后室中的至少一个。
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15.发明申请公开(公告)号：US20150168715A1
公开(公告)日：2015-06-18
申请号：US14564237
申请日：2014-12-09
Inventor： Benedetto Vigna , Marco Ferrera , Sonia Costantini , Marco Salina
CPC classification number: G02B26/0841 , B81B3/0045 , B81B2201/042 , B81B2203/0154 , B81C1/00198 , G02B27/1006 , H02N1/002 , H02N1/006 , H04N9/3129 , H04N9/3135 , Y10T29/49002
Abstract: An electrostatically actuated oscillating structure includes a first stator subregion, a second stator subregion, a first rotor subregion and a second rotor subregion. Torsional elastic elements mounted to the first and second rotor subregions define an axis of rotation. A mobile element is coupled to the torsional elastic elements. The stator subregions are electrostatically coupled to respective regions of actuation on the mobile element. The stator subregions exhibit an element of structural asymmetry such that the electrostatic coupling surface between the first stator subregion and the first actuation region differs from the electrostatic coupling surface between the second stator subregion and the second actuation region.
Abstract translation: 静电驱动的振荡结构包括第一定子子区域，第二定子子区域，第一转子子区域和第二转子子区域。 安装到第一和第二转子子区域上的扭转弹性元件限定了旋转轴线。 移动元件联接到扭转弹性元件。 定子子区域静电耦合到移动元件上的各个致动区域。 定子子区域呈现结构不对称的元件，使得第一定子子区域和第一致动区域之间的静电耦合表面与第二定子子区域和第二致动区域之间的静电耦合表面不同。
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Patent Agency Ranking
16.发明申请公开(公告)号：US20130334627A1
公开(公告)日：2013-12-19
申请号：US13916416
申请日：2013-06-12
Inventor： Sebastiano Conti , Benedetto Vigna
CPC classification number: B81B3/0021 , B81C1/00158 , H01L2224/48091 , H01L2224/48137 , H01L2924/16151 , H01L2924/16152 , H04R19/005 , H01L2924/00014
Abstract: Described herein is a semiconductor integrated device assembly, which envisages: a package defining an internal space; a first die including semiconductor material; and a second die, distinct from the first die, also including semiconductor material; the first die and the second die are coupled to an inner surface of the package facing the internal space. The second die is shaped so as to partially overlap the first die, above the inner surface, with a portion suspended in cantilever fashion above the first die, by an overlapping distance.
Abstract translation: 这里描述的是一种半导体集成器件组件，其设想为：限定内部空间的封装; 包括半导体材料的第一裸片; 以及与第一模具不同的第二模具，还包括半导体材料; 第一模具和第二模具耦合到面向内部空间的封装的内表面。 第二模具成形为使得第一模具在内表面上部分地以悬臂方式悬挂在第一模具上方的部分重叠距离。
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17.发明申请ASSEMBLY FOR A MEMS ENVIRONMENTAL SENSOR DEVICE HAVING IMPROVED RESISTANCE, AND CORRESPONDING MANUFACTURING PROCESS 审中-公开具有改进电阻的MEMS环境传感器装置的组装以及相应的制造工艺公开(公告)号：US20150014798A1
公开(公告)日：2015-01-15
申请号：US14327272
申请日：2014-07-09
Inventor： Dino Faralli , Benedetto Vigna , Laura Maria Castoldi
CPC classification number: B81B3/00 , B81B7/0058 , B81B2201/0257 , B81B2201/0264 , B81B2201/0278 , B81B2203/0127 , B81C1/00 , B81C2203/0109 , G01F1/00 , G01H17/00 , G01K1/00 , G01L1/00 , H01L2224/48145 , H01L2224/73265 , H01L2924/1461 , H01L2924/16151 , H01L2924/16152 , H01L2924/00012
Abstract: Described herein is an assembly for a MEMS sensor device, which envisages: a first body made of semiconductor material, integrating a micromechanical detection structure at a first main face thereof; a cap element, set stacked on the first main face of the first body, above the micromechanical detection structure; and an adhesion structure set between the first body and the cap element, defining a gap in a position corresponding to the micromechanical detection structure. At least one first opening is defined through the adhesion structure in fluidic communication with the gap.
Abstract translation: 这里描述的是一种用于MEMS传感器装置的组件，其设想：由半导体材料制成的第一主体，在其第一主面处集成微机械检测结构; 设置在第一主体的第一主面上的盖元件，位于微机械检测结构的上方; 以及设置在第一主体和盖元件之间的粘合结构，在对应于微机械检测结构的位置中限定间隙。 通过与间隙流体连通的粘合结构限定至少一个第一开口。
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18.发明授权公开(公告)号：US08836111B2
公开(公告)日：2014-09-16
申请号：US13916416
申请日：2013-06-12
Inventor： Sebastiano Conti , Benedetto Vigna
CPC classification number: B81B3/0021 , B81C1/00158 , H01L2224/48091 , H01L2224/48137 , H01L2924/16151 , H01L2924/16152 , H04R19/005 , H01L2924/00014
Abstract: Described herein is a semiconductor integrated device assembly, which envisages: a package defining an internal space; a first die including semiconductor material; and a second die, distinct from the first die, also including semiconductor material; the first die and the second die are coupled to an inner surface of the package facing the internal space. The second die is shaped so as to partially overlap the first die, above the inner surface, with a portion suspended in cantilever fashion above the first die, by an overlapping distance.
Abstract translation: 这里描述的是一种半导体集成器件组件，其设想为：限定内部空间的封装; 包括半导体材料的第一裸片; 以及与第一模具不同的第二模具，还包括半导体材料; 第一模具和第二模具耦合到面向内部空间的封装的内表面。 第二模具成形为使得第一模具在内表面上部分地以悬臂方式悬挂在第一模具上方的部分重叠距离。
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19.发明申请公开(公告)号：US20140015525A1
公开(公告)日：2014-01-16
申请号：US13929635
申请日：2013-06-27
Applicant: STMicroelectronics S.r.l.
Inventor： Dario Paci , Sarah Zerbini , Benedetto Vigna
IPC: G01R33/09
CPC classification number: G01R33/096 , G01R33/0017 , G01R33/0052 , G01R33/0206
Abstract: A magnetic-field sensor includes: a chip including a substrate having a first surface and an insulating layer covering the first surface; first and second magnetoresistors each extending into the insulating layer and having a main axis of magnetization and a secondary axis of magnetization; a first magnetic-field generator configured to generate a first magnetic field having field lines along the main axis of magnetization of the first magnetoresistor; a second magnetic-field generator configured to generate a second magnetic field having field lines along the main axis of magnetization of the second magnetoresistor. The main axes of magnetization extending transversely to each other and the secondary axes of magnetization extending transversely to each other. The first and second magnetoresistors extend into the insulating layer at a first distance and a second distance, respectively, that differ from one another, from the first surface.
Abstract translation: 磁场传感器包括：芯片，其包括具有覆盖第一表面的第一表面和绝缘层的基板; 第一和第二磁阻器各自延伸到绝缘层中并且具有主轴的磁化和次级磁化轴; 第一磁场发生器，被配置为产生具有沿着所述第一磁电阻的主磁化轴的场线的第一磁场; 第二磁场发生器被配置为产生具有沿着第二磁阻的主磁化轴的场线的第二磁场。 磁化的主轴线彼此横向延伸，磁化的副轴相互横向延伸。 第一和第二磁阻器分别从第一表面延伸到彼此不同的第一距离和第二距离处的绝缘层。
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公开(公告)号：US12134556B2
公开(公告)日：2024-11-05
申请号：US17534286
申请日：2021-11-23
Inventor： Enri Duqi , Lorenzo Baldo , Paolo Ferrari , Benedetto Vigna , Flavio Francesco Villa , Laura Maria Castoldi , Ilaria Gelmi
IPC: B81B7/00
Abstract: A semiconductor device includes: a substrate; a transduction microstructure integrated in the substrate; a cap joined to the substrate and having a first face adjacent to the substrate and a second, outer, face; and a channel extending through the cap from the second face to the first face and communicating with the transduction microstructure. A protective membrane made of porous polycrystalline silicon permeable to aeriform substances is set across the channel.
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