Abstract:
A thin film transistor according to an exemplary embodiment of the present invention includes an oxide semiconductor. A source electrode and a drain electrode face each other. The source electrode and the drain electrode are positioned at two opposite sides, respectively, of the oxide semiconductor. A low conductive region is positioned between the source electrode or the drain electrode and the oxide semiconductor. An insulating layer is positioned on the oxide semiconductor and the low conductive region. A gate electrode is positioned on the insulating layer. The insulating layer covers the oxide semiconductor and the low conductive region. A carrier concentration of the low conductive region is lower than a carrier concentration of the source electrode or the drain electrode.
Abstract:
A display includes a substrate, a first electrode base layer and a second electrode base layer spaced from each other on the substrate, a first electrode on the first electrode base layer and a second electrode on the second electrode base layer, a first inner bank between the first electrode base layer and the first electrode and a second inner bank between the second electrode base layer and the second electrode, and a light emitting element between the first electrode and the second electrode, at least one end portion of the light emitting element being electrically connected to the first electrode or the second electrode, wherein a side surface of one end portion of each of the first and second electrode base layers is at the same line as a side surface of an end portion of a corresponding one of the first and second electrodes.
Abstract:
A thin film transistor according to an exemplary embodiment of the present invention includes an oxide semiconductor. A source electrode and a drain electrode face each other. The source electrode and the drain electrode are positioned at two opposite sides, respectively, of the oxide semiconductor. A low conductive region is positioned between the source electrode or the drain electrode and the oxide semiconductor. An insulating layer is positioned on the oxide semiconductor and the low conductive region. A gate electrode is positioned on the insulating layer. The insulating layer covers the oxide semiconductor and the low conductive region. A carrier concentration of the low conductive region is lower than a carrier concentration of the source electrode or the drain electrode.
Abstract:
A thin film transistor according to an exemplary embodiment of the present invention includes an oxide semiconductor. A source electrode and a drain electrode face each other. The source electrode and the drain electrode are positioned at two opposite sides, respectively, of the oxide semiconductor. A low conductive region is positioned between the source electrode or the drain electrode and the oxide semiconductor. An insulating layer is positioned on the oxide semiconductor and the low conductive region. A gate electrode is positioned on the insulating layer. The insulating layer covers the oxide semiconductor and the low conductive region. A carrier concentration of the low conductive region is lower than a carrier concentration of the source electrode or the drain electrode.
Abstract:
A thin film transistor array panel according to an exemplary embodiment of the present disclosure includes: an insulating substrate; a gate electrode disposed on the insulating substrate; a gate insulating layer disposed on the gate electrode; a semiconductor disposed on the gate insulating layer; a source electrode and a drain electrode disposed on the semiconductor; an ohmic contact layer disposed at an interface between at least one of the source and drain electrodes and the semiconductor. Surface heights of the source and drain electrodes different, while surface heights of the semiconductor and the ohmic contact layer are the same. The ohmic contact layer is made of a silicide of a metal used for the source and drain electrodes.
Abstract:
A thin film transistor, a thin film transistor array panel including the same, and a method of manufacturing the same are provided, wherein the thin film transistor includes a channel region including an oxide semiconductor, a source region and a drain region connected to the channel region and facing each other at both sides with respect to the channel region, an insulating layer positioned on the channel region, and a gate electrode positioned on the insulating layer, wherein an edge boundary of the gate electrode and an edge boundary of the channel region are substantially aligned.
Abstract:
A display device includes a substrate, a data conductive layer on the substrate and including a first voltage line, a via layer on the data conductive layer, a light emitting element on the via layer, a first contact electrode on the light emitting element and contacting a first end of the light emitting element, and a second contact electrode on the light emitting element and contacting a second end of the light emitting element, wherein the second contact electrode is electrically connected to the first voltage line through a first contact hole penetrating the via layer.
Abstract:
A display device includes a substrate, a first inner bank and a second inner bank on the substrate and spaced apart from each other, a first electrode on the first inner bank and a second electrode on the second inner bank, and a light emitting element between the first inner bank and the second inner bank, the light emitting element being electrically coupled to the first electrode and the second electrode, wherein the first inner bank comprises a first side surface facing the second inner bank, the second inner bank comprises a second side surface facing the first side surface, and the first side surface and the second side surface are respectively recessed into the first inner bank and the second inner bank, to have a curved shape.
Abstract:
A thin film transistor according to an exemplary embodiment of the present invention includes an oxide semiconductor. A source electrode and a drain electrode face each other. The source electrode and the drain electrode are positioned at two opposite sides, respectively, of the oxide semiconductor. A low conductive region is positioned between the source electrode or the drain electrode and the oxide semiconductor. An insulating layer is positioned on the oxide semiconductor and the low conductive region. A gate electrode is positioned on the insulating layer. The insulating layer covers the oxide semiconductor and the low conductive region. A carrier concentration of the low conductive region is lower than a carrier concentration of the source electrode or the drain electrode.
Abstract:
A display device includes a substrate including a display area and a non-display area around the display area; and a display element layer on the substrate. The display element layer may include first and second electrodes extending in a first direction and spaced apart from each other in a second direction that is different from the first direction; a first light emitting element electrically coupled to the first and second electrodes; a first dummy electrode extending in the first direction and spaced apart from the first and second electrodes; second dummy electrodes spaced apart from each other in the first direction and spaced apart from the first electrode, the second electrode, and the first dummy electrode; and a second light emitting element electrically coupled to the first dummy electrode and the second dummy electrodes.