公开(公告)号：USD956009S1

公开(公告)日：2022-06-28

申请号：US29724046

申请日：2020-02-12

Applicant: Samsung Electronics Co., Ltd.

Designer： Seung-Ho Lee ,  Jang-Ho Kim ,  Jae-Wook Yoo

公开(公告)号：US09040351B2

公开(公告)日：2015-05-26

申请号：US14339563

申请日：2014-07-24

Applicant: Samsung Electronics Co., Ltd

Inventor： Heung-Kyu Kwon ,  Jae-Wook Yoo ,  Hyon-Chol Kim ,  Su-Chang Lee ,  Min-Ok Na

IPC: H01L23/52 ,  H01L25/00 ,  H01L23/373 ,  H01L23/498 ,  H01L25/10 ,  H01L21/56 ,  H01L21/768 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L25/50 ,  H01L21/565 ,  H01L21/76802 ,  H01L21/76877 ,  H01L23/3128 ,  H01L23/3737 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L25/105 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16221 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/83097 ,  H01L2224/83191 ,  H01L2225/06503 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2924/37001 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/0401

Abstract: A stack package includes a lower package including a lower package substrate and a lower semiconductor chip disposed on the lower package substrate, an upper package including an upper package substrate and an upper semiconductor chip disposed on the upper package substrate, a fastening element formed between a top surface of the lower semiconductor chip and a bottom surface of the upper package substrate, and a halogen-free inter-package connector connecting the lower package substrate to the upper package substrate.

Abstract translation: 堆叠封装包括下封装，其包括下封装基板和设置在下封装基板上的下半导体芯片，上封装，包括上封装基板和布置在上封装基板上的上半导体芯片，形成在下封装基板上的紧固元件 下部半导体芯片的上表面和上部封装基板的底面，以及将下部封装基板连接到上部封装基板的无卤素的封装间连接器。

公开(公告)号：USD989017S1

公开(公告)日：2023-06-13

申请号：US29786077

申请日：2021-05-28

Applicant: Samsung Electronics Co., Ltd.

Designer： Jae-Wook Yoo ,  Sin-Wi Moon ,  Dae-Hun Jung ,  Byung-Min Woo ,  Dong-Wook Kim ,  Jee-Won Kim

Abstract: FIG. 1 is a front perspective view of a television receiver showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left-side view thereof;
FIG. 5 is a right-side view thereof;
FIG. 6 is a top view thereof;
FIG. 7 is a bottom view thereof; and,
FIG. 8 is a rear perspective view thereof.
The evenly-dashed broken lines in the figures depict portions of the television receiver and form no part of the claimed design.

公开(公告)号：USD976855S1

公开(公告)日：2023-01-31

申请号：US29785795

申请日：2021-05-27

Applicant: Samsung Electronics Co., Ltd.

Designer： Jae-Wook Yoo ,  Sin-Wi Moon ,  Dae-Hun Jung ,  Byung-Min Woo ,  Dong-Wook Kim ,  Jee-Won Kim

公开(公告)号：USD797692S1

公开(公告)日：2017-09-19

申请号：US29567484

申请日：2016-06-09

Applicant: Samsung Electronics Co., Ltd.

Designer： Jae-Neung Lee ,  Chul-Yong Cho ,  Jae-Wook Yoo

公开(公告)号：US20140232005A1

公开(公告)日：2014-08-21

申请号：US14266836

申请日：2014-05-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jae-Wook Yoo ,  Sun-Kyoung Seo

IPC: H01L23/00 ,  H01L23/492

CPC classification number: H01L24/30 ,  H01L23/3128 ,  H01L23/492 ,  H01L23/49816 ,  H01L24/10 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/07802 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Provided are a stacked package, a method of fabricating a stacked package, and a method of mounting the stacked package fabricated by the same. The method of fabricating a stacked package includes providing an upper semiconductor package including an upper package substrate, upper semiconductor chips formed on a top surface of the upper package substrate, and first solders formed on a bottom surface of the upper package substrate and having a first melting temperature, providing a lower semiconductor package including a lower package substrate, lower semiconductor chips formed on a top surface of the lower package substrate, and solder paste nodes formed on the top surface of the lower package substrate and having a second melting temperature lower than the first melting temperature, and forming inter-package bonding units by attaching respective first solders and solder paste nodes to each other by performing annealing at a temperature higher than the second melting temperature and lower than the first melting temperature.

Abstract translation: 提供堆叠封装，制造堆叠封装的方法以及安装由其制造的堆叠封装的方法。 制造堆叠封装的方法包括提供上半导体封装，其包括上封装衬底，形成在上封装衬底的顶表面上的上半导体芯片和形成在上封装衬底的底表面上的第一焊料，并且具有第一 提供下半导体封装，其包括下封装衬底，形成在下封装衬底的顶表面上的下半导体芯片，以及形成在下封装衬底的顶表面上并具有低于 第一熔融温度，并且通过在高于第二熔融温度并低于第一熔融温度的温度下进行退火将各自的第一焊料和焊膏结点彼此连接来形成封装间接合单元。