公开(公告)号：US12068369B2

公开(公告)日：2024-08-20

申请号：US18348904

申请日：2023-07-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jongsoon Park ,  Jongchul Park ,  Bokyoung Lee ,  Jeongyun Lee ,  Hyunggoo Lee ,  Yeondo Jung ,  Haegeon Jung

IPC: H01L29/06 ,  H01L27/088 ,  H01L29/423 ,  H01L29/786

CPC classification number: H01L29/0657 ,  H01L27/088 ,  H01L29/42392 ,  H01L29/78696

Abstract: A semiconductor device includes a device isolation layer on a substrate; pattern groups including fin patterns extending in a first direction; and gate structures extending in a second direction to intersect the fin patterns. A first pattern group, among the pattern groups, may include first fin patterns. At least a portion of the first fin patterns may be arranged with a first pitch in the second direction. The first pattern group may include a first planar portion extending from a first recess portion. A central axis of the first recess portion may be spaced apart from a central axis of one of the first fin patterns by a first distance in the second direction. The first planar portion may have a first width in the second direction and being greater than the first pitch. The first distance may be about 0.8 times to about 1.2 times the first pitch.

公开(公告)号：US20230352527A1

公开(公告)日：2023-11-02

申请号：US18348904

申请日：2023-07-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jongsoon PARK ,  Jongchul Park ,  Bokyoung Lee ,  Jeongyun Lee ,  Hyunggoo Lee ,  Yeondo Jung ,  Haegeon Jung

IPC: H01L29/06 ,  H01L27/088 ,  H01L29/786 ,  H01L29/423

CPC classification number: H01L29/0657 ,  H01L27/088 ,  H01L29/78696 ,  H01L29/42392

Abstract: A semiconductor device includes a device isolation layer on a substrate; pattern groups including fin patterns extending in a first direction; and gate structures extending in a second direction to intersect the fin patterns. A first pattern group, among the pattern groups, may include first fin patterns. At least a portion of the first fin patterns may be arranged with a first pitch in the second direction. The first pattern group may include a first planar portion extending from a first recess portion. A central axis of the first recess portion may be spaced apart from a central axis of one of the first fin patterns by a first distance in the second direction. The first planar portion may have a first width in the second direction and being greater than the first pitch. The first distance may be about 0.8 times to about 1.2 times the first pitch.

公开(公告)号：US11552176B2

公开(公告)日：2023-01-10

申请号：US17329361

申请日：2021-05-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sanghyun Lee ,  Sungwoo Kang ,  Jongchul Park ,  Youngmook Oh ,  Jeongyun Lee

IPC: H01L29/41 ,  H01L29/417 ,  H01L29/78 ,  H01L29/08 ,  H01L29/66 ,  H01L21/285 ,  H01L29/45

Abstract: An integrated circuit device includes a fin-type active area that extends on a substrate in a first direction, a gate structure that extends on the substrate in a second direction and crosses the fin-type active area, source/drain areas arranged on first and second sides of the gate structure, and a contact structure electrically connected to the source/drain areas. The source/drain areas comprise a plurality of merged source/drain structures. Each source/drain area comprises a plurality of first points respectively located on an upper surface of the source/drain area at a center of each source/drain structure, and each source/drain area comprises at least one second point respectively located on the upper surface of the source/drain area where side surfaces of adjacent source/drain structures merge with one another. A bottom surface of the contact structure is non-uniform and corresponds to the first and second points.

公开(公告)号：US10205020B2

公开(公告)日：2019-02-12

申请号：US15348586

申请日：2016-11-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yongseok Lee ,  Jeongyun Lee ,  Gigwan Park ,  Keo Myoung Shin ,  Hyunji Kim ,  Sangduk Park

IPC: H01L29/78 ,  H01L29/66 ,  H01L27/092 ,  H01L29/06 ,  H01L29/423 ,  H01L21/8238 ,  H01L49/02 ,  H01L29/165

Abstract: A semiconductor device includes an active pattern having sidewalls defined by a device isolation pattern disposed on a substrate and an upper portion protruding from a top surface of the device isolation pattern, a liner insulating layer on the sidewalls of the active pattern, a gate structure on the active pattern, and source/drain regions at both sides of the gate structure. The liner insulating layer includes a first liner insulating layer and a second liner insulating layer having a top surface higher than a top surface of the first liner insulating layer. Each of the source/drain regions includes a first portion defined by the second liner insulating layer, and a second portion protruding upward from the second liner insulating layer and covering the top surface of the first liner insulating layer.

公开(公告)号：US09954061B2

公开(公告)日：2018-04-24

申请号：US15605698

申请日：2017-05-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jeongyun Lee ,  Kwang-Yong Yang ,  Keomyoung Shin ,  Jinwook Lee ,  Yongseok Lee

IPC: H01L27/088 ,  H01L29/10 ,  H01L29/06 ,  H01L29/423 ,  H01L29/40 ,  H01L29/66 ,  H01L21/8234 ,  H01L29/49 ,  H01L29/51

CPC classification number: H01L29/1033 ,  H01L21/823412 ,  H01L29/0649 ,  H01L29/0673 ,  H01L29/401 ,  H01L29/42364 ,  H01L29/4966 ,  H01L29/513 ,  H01L29/66439 ,  H01L29/6653 ,  H01L29/6656

Abstract: A semiconductor device includes an isolation pattern on a substrate, the isolation pattern having a lower insulating pattern on the substrate, and a spacer to cover side surfaces of the lower insulating pattern, a vertical structure through the isolation pattern to contact the substrate, the vertical structure having a first semiconductor layer on the substrate, a lower end of the first semiconductor layer being at a lower level than a lower surface of the isolation pattern, a second semiconductor layer on the first semiconductor layer, and a third semiconductor layer on the second semiconductor layer, and a gate electrode crossing the vertical structure and extending over the isolation pattern.