公开(公告)号：US20250029906A1

公开(公告)日：2025-01-23

申请号：US18646834

申请日：2024-04-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyounglim Suk ,  Kimin Cheong ,  Hyeonjeong Hwang

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/31 ,  H01L23/522 ,  H01L25/00 ,  H01L25/18

Abstract: Provided are a semiconductor package including a pad with high reliability and a method of manufacturing the semiconductor package. The semiconductor package includes a first redistribution substrate, a semiconductor chip on the first redistribution substrate, a through post extending around the semiconductor chip and on the first redistribution substrate, and a second redistribution substrate on the semiconductor chip and the through post. A first pad region and a second pad region are defined on an upper surface of the second redistribution substrate, the first pad region positioned at a central portion of the second redistribution substrate, and the second pad region extending around the first pad region, a first-type pad in a planar shape is in a first opening, a second-type pad having an outer protruding portion is in a second opening.

公开(公告)号：US20240321839A1

公开(公告)日：2024-09-26

申请号：US18530542

申请日：2023-12-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyungdon Mun ,  Kyounglim Suk ,  Jihwang Kim

IPC: H01L25/10 ,  H01L23/00 ,  H01L23/31 ,  H01L23/367 ,  H01L23/498 ,  H10B80/00

CPC classification number: H01L25/105 ,  H01L23/3107 ,  H01L23/367 ,  H01L23/49822 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H10B80/00 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/1431 ,  H01L2924/1434

Abstract: A semiconductor package includes a first redistribution structure including a first redistribution insulating layer and a first redistribution pattern, a first lower semiconductor device mounted on the first redistribution structure, a molding layer surrounding the first lower semiconductor device on the first redistribution structure, a plurality of vertical connection conductors in the molding layer and electrically connected to the first redistribution pattern, a heat dissipation plate disposed on an upper surface of the first lower semiconductor device, and a plurality of upper semiconductor devices disposed on the molding layer and on the first lower semiconductor device, each of the plurality of upper semiconductor devices vertically overlapping a different respective region of the first lower semiconductor device.

公开(公告)号：US12068302B2

公开(公告)日：2024-08-20

申请号：US18301420

申请日：2023-04-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seho You ,  Kyounglim Suk

IPC: H01L23/538 ,  H01L23/00 ,  H01L23/31 ,  H01L23/48 ,  H01L23/498 ,  H01L23/522 ,  H01L23/66 ,  H01L25/18

CPC classification number: H01L25/18 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/5226 ,  H01L23/5389 ,  H01L23/66 ,  H01L24/20 ,  H01L24/16 ,  H01L2223/6677 ,  H01L2224/16227

Abstract: A semiconductor package is provided. The semiconductor package comprising a first redistribution structure comprising a first redistribution pattern; a first semiconductor chip on the first redistribution structure, the first semiconductor chip comprising a semiconductor substrate comprising a first surface and a second surface, a first back end of line (BEOL) structure on the first surface of the semiconductor substrate and comprising a first interconnect pattern, and a second BEOL structure on the second surface of the semiconductor substrate and comprising a second interconnect pattern; a molding layer covering a sidewall of the first semiconductor chip; a second redistribution structure on the first semiconductor chip and the molding layer and comprising a second redistribution pattern electrically connected to the second interconnect pattern.

公开(公告)号：US11955499B2

公开(公告)日：2024-04-09

申请号：US17363931

申请日：2021-06-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Minjung Kim ,  Dongkyu Kim ,  Kyounglim Suk ,  Jaegwon Jang ,  Hyeonjeong Hwang

IPC: H01L27/146 ,  H01L23/00

CPC classification number: H01L27/14636 ,  H01L27/14618 ,  H01L27/14634 ,  H01L24/16 ,  H01L27/14621 ,  H01L27/14625 ,  H01L2224/16227

Abstract: An image sensor package includes a glass substrate configured to focus incident light, a first redistribution layer and a second redistribution layer both disposed under the glass substrate while being horizontally spaced apart from each other by a first distance, an image sensor disposed such that an upper surface thereof is vertically spaced apart from both a lower surface of the first redistribution layer and a lower surface of the second redistribution layer by a second distance, and a first connector that connects both the first redistribution layer and the second redistribution layer to the image sensor. The thickness of the glass substrate is 0.6 to 0.8 mm. The first distance is smaller than the horizontal length of the image sensor by 50 μm to 1 mm. The second distance is equal to or less than 0.1 mm.