-
公开(公告)号:US12142690B2
公开(公告)日:2024-11-12
申请号:US18588163
申请日:2024-02-27
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jung Taek Kim , Seok Hoon Kim , Pan Kwi Park , Moon Seung Yang , Seo Jin Jeong , Min-Hee Choi , Ryong Ha
IPC: H01L29/786 , H01L29/06 , H01L29/423
Abstract: A semiconductor device includes a multi-channel active pattern, a plurality of gate structures on the multi-channel active pattern and spaced apart from each other in a first direction, the plurality of gate structures including a gate electrode that extends in a second direction different from the first direction, a source/drain recess between the adjacent gate structures, and a source/drain pattern on the multi-channel active pattern in the source/drain recess, wherein the source/drain pattern includes: a semiconductor liner layer including silicon-germanium and extending along the source/drain recess, a semiconductor filling layer including silicon-germanium on the semiconductor liner layer, and at least one or more semiconductor insertion layers between the semiconductor liner layer and the semiconductor filling layer, and wherein the at least one or more semiconductor insertion layers have a saddle structure.
-
公开(公告)号:US20240194789A1
公开(公告)日:2024-06-13
申请号:US18588163
申请日:2024-02-27
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jung Taek Kim , Seok Hoon Kim , Pan Kwi Park , Moon Seung Yang , Seo Jin Jeong , Min-Hee Choi , Ryong Ha
IPC: H01L29/786 , H01L29/06 , H01L29/423
CPC classification number: H01L29/78618 , H01L29/0665 , H01L29/42392 , H01L29/78696
Abstract: A semiconductor device includes a multi-channel active pattern, a plurality of gate structures on the multi-channel active pattern and spaced apart from each other in a first direction, the plurality of gate structures including a gate electrode that extends in a second direction different from the first direction, a source/drain recess between the adjacent gate structures, and a source/drain pattern on the multi-channel active pattern in the source/drain recess, wherein the source/drain pattern includes: a semiconductor liner layer including silicon-germanium and extending along the source/drain recess, a semiconductor filling layer including silicon-germanium on the semiconductor liner layer, and at least one or more semiconductor insertion layers between the semiconductor liner layer and the semiconductor filling layer, and wherein the at least one or more semiconductor insertion layers have a saddle structure.
-
公开(公告)号:US11942528B2
公开(公告)日:2024-03-26
申请号:US18196533
申请日:2023-05-12
Applicant: Samsung Electronics Co., Ltd.
Inventor: Hyun-Kwan Yu , Min-Hee Choi
IPC: H01L29/417 , H01L21/762 , H01L21/8234 , H01L27/088
CPC classification number: H01L29/41791 , H01L21/76224 , H01L21/823425 , H01L21/823431 , H01L27/0886
Abstract: A semiconductor device comprising a plurality of active patterns on a substrate. The semiconductor device may include a device isolation layer defining the plurality of active patterns, a gate electrode extending across the plurality of active patterns, and a source/drain pattern on the active patterns. The plurality of active patterns may comprise a first active pattern and a second active pattern. The source/drain pattern comprises a first part on the first active pattern, a second part on the second active pattern, and a third part extending from the first part and along an upper portion of the first active pattern. The device isolation layer comprises a first outer segment on a sidewall of the first active pattern below the source/drain pattern. A lowermost level of a bottom surface of the third part may be lower than an uppermost level of a top surface of the first outer segment.
-
公开(公告)号:US11728434B2
公开(公告)日:2023-08-15
申请号:US17011221
申请日:2020-09-03
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Seok Hoon Kim , Dong Myoung Kim , Dong Suk Shin , Seung Hun Lee , Cho Eun Lee , Hyun Jung Lee , Sung Uk Jang , Edward Nam Kyu Cho , Min-Hee Choi
IPC: H01L29/78 , H01L29/66 , H01L21/8234 , H01L21/768 , H01L21/02 , H01L29/423 , H01L29/165 , H01L27/088 , H01L29/08 , H01L29/49 , H01L27/12
CPC classification number: H01L29/7855 , H01L21/02532 , H01L21/76871 , H01L21/823431 , H01L27/0886 , H01L29/0847 , H01L29/165 , H01L29/4232 , H01L29/6656 , H01L29/66795 , H01L29/785 , H01L21/02645 , H01L27/1211 , H01L29/4966 , H01L29/66545
Abstract: A semiconductor device includes a first fin type pattern on a substrate, a second fin type pattern, parallel to the first fin type pattern, on the substrate, and an epitaxial pattern on the first and second fin type patterns. The epitaxial pattern may include a shared semiconductor pattern on the first fin type pattern and the second fin type pattern. The shared semiconductor pattern may include a first sidewall adjacent to the first fin type pattern and a second sidewall adjacent to the second fin type pattern. The first sidewall may include a first lower facet, a first upper facet on the first lower facet and a first connecting curved surface connecting the first lower and upper facets. The second sidewall may include a second lower facet, a second upper facet on the second lower facet and a second connecting curved surface connecting the second lower and upper facets.
-
公开(公告)号:US20220190168A1
公开(公告)日:2022-06-16
申请号:US17519967
申请日:2021-11-05
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jung Taek Kim , Seok Hoon Kim , Pan Kwi Park , Moon Seung Yang , Seo Jin Jeong , Min-Hee Choi , Ryong Ha
IPC: H01L29/786 , H01L29/06 , H01L29/423
Abstract: A semiconductor device includes a multi-channel active pattern, a plurality of gate structures on the multi-channel active pattern and spaced apart from each other in a first direction, the plurality of gate structures including a gate electrode that extends in a second direction different from the first direction, a source/drain recess between the adjacent gate structures, and a source/drain pattern on the multi-channel active pattern in the source/drain recess, wherein the source/drain pattern includes: a semiconductor liner layer including silicon-germanium and extending along the source/drain recess, a semiconductor filling layer including silicon-germanium on the semiconductor liner layer, and at least one or more semiconductor insertion layers between the semiconductor liner layer and the semiconductor filling layer, and wherein the at least one or more semiconductor insertion layers have a saddle structure.
-
公开(公告)号:US11688781B2
公开(公告)日:2023-06-27
申请号:US17131977
申请日:2020-12-23
Applicant: Samsung Electronics Co., Ltd.
Inventor: Hyun-Kwan Yu , Min-Hee Choi
IPC: H01L29/417 , H01L27/088 , H01L21/8234 , H01L21/762
CPC classification number: H01L29/41791 , H01L21/76224 , H01L21/823425 , H01L21/823431 , H01L27/0886
Abstract: A semiconductor device comprising a plurality of active patterns on a substrate. The semiconductor device may include a device isolation layer defining the plurality of active patterns, a gate electrode extending across the plurality of active patterns, and a source/drain pattern on the active patterns. The plurality of active patterns may comprise a first active pattern and a second active pattern. The source/drain pattern comprises a first part on the first active pattern, a second part on the second active pattern, and a third part extending from the first part and along an upper portion of the first active pattern. The device isolation layer comprises a first outer segment on a sidewall of the first active pattern below the source/drain pattern. A lowermost level of a bottom surface of the third part may be lower than an uppermost level of a top surface of the first outer segment.
-
17.
公开(公告)号:US11469237B2
公开(公告)日:2022-10-11
申请号:US16388347
申请日:2019-04-18
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jin-Bum Kim , Myung-Gil Kang , Kang-Hun Moon , Cho-Eun Lee , Su-Jin Jung , Min-Hee Choi , Yang Xu , Dong-Suk Shin , Kwan-Heum Lee , Hoi-Sung Chung
IPC: H01L27/088 , H01L27/11 , H01L29/66 , H01L29/78 , H01L23/485 , H01L21/8234 , H01L29/417 , H01L23/528 , H01L29/08 , H01L29/161 , H01L29/45 , H01L27/092 , H01L29/165
Abstract: A semiconductor device may include a first active fin, a plurality of second active fins, a first source/drain layer structure, and a second source/drain layer structure. The first active fin may be on a first region of a substrate. The second active fins may be on a second region of the substrate. The first and second gate structures may be on the first and second active fins, respectively. The first source/drain layer structure may be on a portion of the first active fin that is adjacent to the first gate structure. The second source/drain layer structure may commonly contact upper surfaces of the second active fins adjacent to the second gate structure. A top surface of the second source/drain layer structure may be further from the surface of the substrate than a top surface of the first source/drain layer structure is to the surface of the substrate.
-
公开(公告)号:US20190244963A1
公开(公告)日:2019-08-08
申请号:US16388347
申请日:2019-04-18
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jin-Bum Kim , Myung-Gil Kang , Kang-Hun Moon , Cho-Eun Lee , Su-Jin Jung , Min-Hee Choi , Yang Xu , Dong-Suk Shin , Kwan-Heum Lee , Hoi-Sung Chung
IPC: H01L27/11 , H01L29/66 , H01L29/161 , H01L29/78 , H01L29/08 , H01L23/528 , H01L29/417 , H01L21/8234 , H01L27/088 , H01L23/485 , H01L29/45
CPC classification number: H01L27/1104 , H01L21/823431 , H01L23/485 , H01L23/5283 , H01L27/0886 , H01L27/0924 , H01L29/0847 , H01L29/161 , H01L29/165 , H01L29/41791 , H01L29/456 , H01L29/66545 , H01L29/66795 , H01L29/7848 , H01L29/785
Abstract: A semiconductor device may include a first active fin, a plurality of second active fins, a first source/drain layer structure, and a second source/drain layer structure. The first active fin may be on a first region of a substrate. The second active fins may be on a second region of the substrate. The first and second gate structures may be on the first and second active fins, respectively. The first source/drain layer structure may be on a portion of the first active fin that is adjacent to the first gate structure. The second source/drain layer structure may commonly contact upper surfaces of the second active fins adjacent to the second gate structure. A top surface of the second source/drain layer structure may be further from the surface of the substrate than a top surface of the first source/drain layer structure is to the surface of the substrate.
-
公开(公告)号:US20190181225A1
公开(公告)日:2019-06-13
申请号:US16138064
申请日:2018-09-21
Applicant: Samsung Electronics Co., Ltd.
Inventor: Choeun Lee , Seokhoon Kim , Sanggil Lee , Seung Hun LEE , Min-Hee Choi
IPC: H01L29/08 , H01L29/10 , H01L29/165 , H01L29/04 , H01L27/11 , H01L29/78 , H01L29/06 , H01L21/8238 , H01L21/308 , H01L21/02 , H01L29/66
Abstract: Disclosed is a semiconductor device that comprises a substrate including a first active pattern vertically protruding from a top surface of the substrate, and a first source/drain pattern filing a first recess formed on an upper portion of the first active pattern. The first source/drain pattern comprises a first semiconductor pattern and a second semiconductor pattern on the first semiconductor pattern. The first semiconductor pattern has a first face, a second face, and a first corner edge defined when the first face and the second face meet with each other. The second semiconductor pattern covers the first face and the second face of the first semiconductor pattern and exposes the first corner edge.
-
公开(公告)号:US08648408B2
公开(公告)日:2014-02-11
申请号:US13753588
申请日:2013-01-30
Applicant: Samsung Electronics Co., Ltd.
Inventor: Yong-Kuk Jeong , Sang-Wook Park , Min-Hee Choi
IPC: H01L21/02
CPC classification number: H01L29/7831 , H01L21/76832 , H01L21/76834 , H01L21/76837 , H01L21/823807 , H01L21/8258 , H01L23/291 , H01L29/1054 , H01L29/165 , H01L29/665 , H01L29/6656 , H01L29/66575 , H01L29/7843 , H01L2924/0002 , H01L2924/00
Abstract: A semiconductor device includes a substrate, a gate structure disposed on the substrate and which includes a gate insulating layer and a gate electrode layer, a first nitride layer disposed on the substrate and the gate structure and which includes silicon, and a second nitride layer that is disposed on the first nitride layer and has an atomic percentage of silicon less than that of the first nitride layer.
Abstract translation: 半导体器件包括衬底,设置在衬底上的栅极结构,其包括栅极绝缘层和栅极电极层,设置在衬底上的第一氮化物层和栅极结构,并且包括硅;以及第二氮化物层, 设置在第一氮化物层上,并且硅的原子百分比小于第一氮化物层的原子百分比。
-
-
-
-
-
-
-
-
-