Abstract:
A system on chip includes a clock generator configured to generate a clock signal, and output the clock signal to a component device external to the system on chip. The system on chip further includes a duty ratio determiner configured to determine a component duty ratio, in response to a response that is received from the component device according to the clock signal, and a duty ratio adjustor configured to adjust a current duty ratio of the clock signal to the component duty ratio, and output the clock signal of which the current duty ratio is adjusted, to the component device.
Abstract:
Provided is an integrated circuit which includes: a plurality of conductive lines extending in a first horizontal direction on a plane separate from a gate line, and including first and second conductive lines; a source/drain contact having a bottom surface connected to a source/drain region, and including a lower source/drain contact and an upper source/drain contact which are connected to each other in a vertical direction; and a gate contact having a bottom surface connected to the gate line, and extending in the vertical direction, in which the upper source/drain contact is placed below the first conductive line, and the gate contact is placed below the second conductive line. A top surface of the lower source/drain contact may be larger than a bottom surface of the upper source/drain contact.
Abstract:
Provided is an integrated circuit which includes: a plurality of conductive lines extending in a first horizontal direction on a plane separate from a gate line, and including first and second conductive lines; a source/drain contact having a bottom surface connected to a source/drain region, and including a lower source/drain contact and an upper source/drain contact which are connected to each other in a vertical direction; and a gate contact having a bottom surface connected to the gate line, and extending in the vertical direction, in which the upper source/drain contact is placed below the first conductive line, and the gate contact is placed below the second conductive line. A top surface of the lower source/drain contact may be larger than a bottom surface of the upper source/drain contact.
Abstract:
Provided are a voltage control circuit including an assist circuit and a memory device including the voltage control circuit. The memory device includes: a volatile memory cell array, which is connected to a plurality of word lines and includes a memory cell including at least one transistor; and an assist circuit, which is connected to at least one of the plurality of word lines and adjusts a driving voltage level of each of the plurality of word lines, wherein the assist circuit includes a diode N-channel metal oxide semiconductor (NMOS) transistor having a gate and a drain connected to each other.
Abstract:
A method of managing a memory of a device is provided. The method includes acquiring amount of memory use information of the device, estimating a memory use pattern, based on the amount of memory use information of the device, and acquiring an amount of memory of the device, based on the estimated memory use pattern.
Abstract:
A composite protective layer for a photoelectrode, the composite protective layer including a chemical protective layer; and a physical protective layer, wherein the chemical protective layer has corrosion rate of 0.1 Coulombs per square centimeter per 10 hours or less when evaluated at a water decomposition potential, and the physical protective layer has a moisture transmittance rate of 0.001 grams per square meter per day or less and has an electrical conductivity.
Abstract:
A light absorbing layer for a photoelectrode structure, the light absorbing layer including copper oxide, wherein metallic copper (Cu) is present at a grain boundary of the copper oxide. Also, a photoelectrode structure including the light absorbing layer, a photoelectrochemical cell including the photoelectrode structure, and a solar cell including the light absorbing layer.
Abstract:
A method of displaying for allowing a plurality of application windows to be easily controlled and a display device therefor are provided. A method of displaying a screen on a display device includes displaying a button on a touch screen; splitting the touch screen into a plurality of regions based on the position at which the button is displayed, receiving a touch input to move a displayed button, obtaining a slope value of a line connecting a start point of the touch input to an end point thereof, selecting a region corresponding to the slope value from among the plurality of regions split, and moving the button to a certain position included in a selected region.
Abstract:
Provided is an integrated circuit which includes: a plurality of conductive lines extending in a first horizontal direction on a plane separate from a gate line, and including first and second conductive lines; a source/drain contact having a bottom surface connected to a source/drain region, and including a lower source/drain contact and an upper source/drain contact which are connected to each other in a vertical direction; and a gate contact having a bottom surface connected to the gate line, and extending in the vertical direction, in which the upper source/drain contact is placed below the first conductive line, and the gate contact is placed below the second conductive line. A top surface of the lower source/drain contact may be larger than a bottom surface of the upper source/drain contact.
Abstract:
A semiconductor light-emitting device, and a method of manufacturing the same. The semiconductor light-emitting device includes a first electrode layer, an insulating layer, a second electrode layer, a second semiconductor layer, an active layer, and a first semiconductor layer that are sequentially stacked on a substrate, a first contact that passes through the substrate to be electrically connected to the first electrode layer, and a second contact that passes through the substrate, the first electrode layer, and the insulating layer to communicate with the second electrode layer. The first electrode layer is electrically connected to the first semiconductor layer by filling a contact hole that passes through the second electrode layer, the second semiconductor layer, and the active layer, and the insulating layer surrounds an inner circumferential surface of the contact hole to insulate the first electrode layer from the second electrode layer.