摘要:
A method for selecting live seeds of sugar beet (those which are able to germinate) from dead seeds (those which are unable to germinate) based on the case of seed-cap releasing. When immersed in water, live seeds absorb much water and expand appreciably, while dead seeds expand only slightly because less water is absorbed. This expansion of live seeds upon absorption of water makes the seed caps, closely fitted onto the outer shells of fruit, ready to be released. When mechanical vibrations are given to a mixture of water-soaked fruit, only the seed caps of expanded fruit are easily released. Thus live seeds of sugar beet can be effectively obtained by selecting out the fruit from which seed caps have been released.
摘要:
A light-emitting diode array comprising a conductive layer formed on a substrate, pluralities of separate light-emitting portions formed on the conductive layer, a first groove formed in the conductive layer to divide the light-emitting portions to blocks, first electrodes each formed on at least part of an upper surface of each light-emitting portion, one second electrode formed directly on the conductive layer in each block, common switching wirings separately connected to the first electrodes, first bonding pads each connected to each common wiring, first bonding pads each connected to each common wiring, and second bonding pads each connected to each second electrode, n light-emitting portions (n is an even number) being arranged transversely in each block, and second grooves being formed in the conductive layer between adjacent light-emitting portions such that the second grooves are arranged short and long alternately, with the nearest one to the first groove being short.
摘要:
A light emitting diode array comprises compound semiconductor layers epitaxially grown on a p-type GaAs conductive layer 11 formed on a semi-insulating GaAs substrate 30. The epitaxial layer is isolated and divided into a plurality of light emitting parts 1 which function as a light emitting diode. A Si-doped n-type GaAs buffer layer 31 is interposed between the semi-insulating GaAs substrate 30 and the p-type GaAs conductive layer 11. In the light emitting diode array comprising this epitaxial configuration, it is possible to prevent the short-circuit defect due to diffusion of p-type dopant from the p-type GaAs conductive layer into the semi-insulating GaAs substrate made by the LEC method.
摘要:
A light-emitting diode array comprising a conductive layer formed on a substrate, pluralities of separate light-emitting portions formed on the conductive layer, a first groove formed in the conductive layer to divide the light-emitting portions to blocks, first electrodes each formed on at least part of an upper surface of each light-emitting portion, one second electrode formed directly on the conductive layer in each block, common switching wirings separately connected to the first electrodes, first bonding pads each connected to each common wiring, first bonding pads each connected to each common wiring, and second bonding pads each connected to each second electrode, n light-emitting portions (n is an even number) being arranged transversely in each block, and second grooves being formed in the conductive layer between adjacent light-emitting portions such that the second grooves are arranged short and long alternately, with the nearest one to the first groove being short.
摘要:
This invention is aimed at providing a wafer-level package which is capable of relaxing the stress in a chip-size package and exalting the reliability of the operation of mounting on a printed board and a method for the production thereof. This invention is directed toward a wafer-level package of a semiconductor substrate possessed of either or both of an electrode part and a wiring layer connected to an electrode part, which is provided on the semiconductor substrate with an insulating layer formed mainly of a fluorene skeleton-containing resin and on the electrode part with one step or a plurality of steps of posts, and on the posts with bumps formed of electroconductive balls and a method for the production thereof.
摘要:
The line change-over circuit suitable for the semiconductor memory having a redundancy memory column comprises a pair of transfer gate elements provided between a first node to which a first signal to be transmitted is supplied and a pair of transmission lines, first and second switch elements. The paired transfer gate elements are controlled on a switch in complementary manner each other according to a transfer signal. The first switch element is controlled on a switch according to the transfer signal, and the second switch element is controlled on a switch according to the first signal transmitted to one of the paired transmission lines. The first switch element turns one of the transmission lines to a fixed potential like ground potential when it is kept on, and the second switch element turns the other of the transmission lines to a fixed potential when it is kept on. The line change-over circuit in the above configuration is effective to prevent a floating state of the paired transmission lines.
摘要:
A 5-substituted-3-isoxazolecarboxylic acid derivative of the general formula: ##STR1## wherein X stands for a phenyl group, thienyl group, furyl group or pyridyl group, each of which optionally may carry at least one substituent group; R stands for a phenyl group or hydroxyphenyl group; and A stands for a group of the formula: ##STR2## wherein Y stands for ##STR3## in which the carbon atom with which the carboxyl group combines with the nitrogen atom in A, M stands for a hydrogen atom or a substituent group, and Z stands for a hydrogen atom, hydroxy group, acyloxy group, carbamoyloxy group, aromatic heterocycle thio group or aromatic nitrogen-containing heterocycle quaternary ammonium group, is disclosed along with methods for producing these compounds.
摘要:
A resin composition comprising (A) 5 to 95 parts by weight of a copolyphenylene ether derived from a mixture of 50 to 98 mole% of a 2,6-dialkylphenol and 2 to 50 mole% of a 2,3,6-trialkylphenol and (B) 5 to 95 parts by weight of a styrene resin. The composition has superior thermal resistance and oxidation stability under heat and satisfactory mechanical properties, and retains these desirable properties after heat-aging. The composition is suitable for preparation of molded articles.