ELECTRIC-POWER MANAGEMENT SYSTEM, ELECTRIC-POWER MANAGEMENT METHOD, AND SECTION CONTROLLER
    11.
    发明申请
    ELECTRIC-POWER MANAGEMENT SYSTEM, ELECTRIC-POWER MANAGEMENT METHOD, AND SECTION CONTROLLER 有权
    电力管理系统,电力管理方法和部分控制器

    公开(公告)号:US20130110304A1

    公开(公告)日:2013-05-02

    申请号:US13640642

    申请日:2011-03-16

    IPC分类号: G05F5/00

    摘要: Electric-power management system, an area controller transmits, to each of section controllers, information about a target voltage and information about the present voltage, each of the section controllers calculating a difference between the target voltage and the present voltage, received from the area controller, and calculating a power's demand-supply-adjustment request amount based on difference between the information about the voltages, each of facility-equipment controllers transmitting power-reception/power-release capable equipment information to each section controller, being information about a power-reception/power-release capable equipment in a facility into which the facility-equipment controller is installed, the section controller, based on the power-reception/power-release capable equipment information about the equipment, transmitting the equipment's demand-supply-adjustment request amount and the facility-equipment controller transmitting a control signal to the equipment based on the equipment's demand-supply-adjustment request amount received from the section controller to the facility-equipment controller in the facility.

    摘要翻译: 电力管理系统中,区域控制器向每个分段控制器发送关于目标电压的信息和关于当前电压的信息,每个分段控制器计算从该区域接收的目标电压和当前电压之间的差异 控制器,并且基于关于电压的信息之间的差异来计算功率的需求供应调整请求量,每个设备设备控制器向每个部分控制器发送接收/发送能力的设备信息,是关于功率的信息 在设备设备控制器安装的设施中的接收/释放能力的设备,部分控制器,基于受电/电力发布的设备关于设备的信息,传送设备的供需调整 请求量和设备设备控制器向等式发送控制信号 设备基于从设备控制器向设备中的设备 - 设备控制器接收的设备的需求供应调整请求量。

    Apparatus for cooling integrated circuit chips
    14.
    发明授权
    Apparatus for cooling integrated circuit chips 失效
    集成电路芯片冷却装置

    公开(公告)号:US4694378A

    公开(公告)日:1987-09-15

    申请号:US128

    申请日:1987-01-02

    IPC分类号: H01L23/427 H05K7/20

    摘要: A boiling type cooling structure for cooling semiconductor chips mounted on printed circuit cards, with a heat conductive stud being attached to the surface of each chip. Cooling plates with fins, arranged so as to surround the circumference of each heat conductive stud, are placed between the printed circuit cards in order to condense the vapor bubbles produced near the heat conductive studs.

    摘要翻译: 一种用于冷却安装在印刷电路卡上的半导体芯片的沸腾型冷却结构,其中导热螺柱连接到每个芯片的表面。 布置成围绕每个导热柱的圆周的翅片的冷却板被放置在印刷电路板之间,以冷凝在导热螺柱附近产生的蒸气泡。

    Service providing system for providing services suitable to an end user
request based on characteristics of a request, attributes of a service
and operating conditions of a processor
    15.
    发明授权
    Service providing system for providing services suitable to an end user request based on characteristics of a request, attributes of a service and operating conditions of a processor 失效
    服务提供系统,用于基于请求的特性,服务的属性和处理器的操作条件来提供适合于最终用户请求的服务

    公开(公告)号:US6006251A

    公开(公告)日:1999-12-21

    申请号:US776717

    申请日:1997-01-29

    CPC分类号: G06Q30/06 G06F17/30899

    摘要: In a service providing system, a plurality of information acquiring computers for acquiring informations are connected via a network to a plurality of information providing computers for providing information. A service providing computer for executing an information providing service with respect to apparatuses for acquiring information is interposed between a plurality of in information acquiring apparatuses and a plurality of information providing apparatuses. The service providing computer receives a content of a request of the information acquiring computer, and determines a sort of information to be provided with a user based upon a quality of this request content, individual information and past historical information of the user, and also various sorts of conditions when the request is received. The service providing computer requests at least one of these information providing computers to provide the information. The information obtained from the request result is integrated by the service providing computer to be transmitted to the information acquiring computer.

    摘要翻译: PCT No.PCT / JP96 / 01868 Sec。 371日期1997年1月29日 102(e)1997年1月29日PCT PCT 1996年7月5日PCT公布。 出版物WO97 / 03404 日期1997年1月30日在服务提供系统中,用于获取信息的多个信息获取计算机经由网络连接到提供用于提供信息的计算机的多个信息。 在多个信息获取装置和多个信息提供装置之间插入有关用于获取信息的装置执行信息提供服务的服务提供计算机。 服务提供计算机接收信息获取计算机的请求的内容,并且基于该请求内容的质量,个人信息和用户的过去历史信息来确定要提供给用户的信息的种类,以及各种 收到请求时的各种条件。 服务提供计算机请求提供计算机的这些信息中的至少一个来提供信息。 从请求结果获得的信息由服务提供计算机集成以发送到信息获取计算机。

    Replicated data processing method in distributed processing system
    17.
    发明授权
    Replicated data processing method in distributed processing system 失效
    分布式处理系统中的复制数据处理方法

    公开(公告)号:US5333265A

    公开(公告)日:1994-07-26

    申请号:US780337

    申请日:1991-10-22

    CPC分类号: G06F15/161

    摘要: A replicated data processing method and apparatus for a distributed processing system are provided in which a plurality of processors are connected to one another through a common transmission line. The processors perform processes using replicated data produced by resources such as files replicated in respective processors. Any processor issues an access request and broadcasts the request to the common transmission line. User's program of the processor is initiated by a first-received data in response to the request, and checks matching between the first-received data of the replicated data and the subsequently received data to repeat a retry processing for the request until a mismatch is removed.

    摘要翻译: 提供了一种用于分布式处理系统的复制数据处理方法和装置,其中多个处理器通过公共传输线相互连接。 处理器使用由诸如在相应处理器中复制的文件的资源产生的复制数据来执行处理。 任何处理器发出访问请求并将该请求广播到公共传输线。 处理器的用户程序响应于该请求由第一接收数据发起,并且检查复制数据的首次接收数据与随后接收到的数据之间的匹配,以重复该请求的重试处理,直到不匹配被移除 。

    Vapor-condensing, heat-transfer wall
    18.
    发明授权
    Vapor-condensing, heat-transfer wall 失效
    蒸汽冷凝,传热墙

    公开(公告)号:US4166498A

    公开(公告)日:1979-09-04

    申请号:US815028

    申请日:1977-07-12

    CPC分类号: F28F13/04

    摘要: A condensing, a heat-transfer wall for liquefying vapor having a temperature higher than the wall by bringing the vapor in contact therewith. There are provided many parallel grooves in the basic surface of the heat-transfer wall, thereby defining ridge portions or build-up portions thereamong. These ridge portions have their tip portions tapered at sharp acute angle. Recessed or concave portions are provided in the tip portions of these ridge portions, and these recessed portions have their surfaces inclined to the basic surface of the heat-transfer wall. The width of the respective grooves ranges from 0.05 to 2.5 mm, and the depth thereof is not more than 10 mm. The thickness of the respective ridge portions ranges from 0.01 to 2.5 mm, and the height there of is not more than 10 mm. The depth of the recessed portions ranges from 0.02 to 0.8 times the depth of the grooves, and the pitch of recessed portion is not more than 2.0 mm. The width of the tip portions of the portions is 0.01 to 1.0 times the pitch of the recessed portions.

    摘要翻译: 冷凝物,通过使蒸气与其接触而液化具有高于壁温度的蒸气的传热壁。 在传热壁的基面上设有许多平行的凹槽,从而在其之间形成脊部或组合部分。 这些脊部的尖端部分以锐角锐化。 在这些脊部的前端设置有凹部或凹部,这些凹部的表面倾斜于传热壁的基面。 各槽的宽度为0.05〜2.5mm,其深度为10mm以下。 各脊部的厚度为0.01〜2.5mm,高度为10mm以下。 凹部的深度为凹槽深度的0.02〜0.8倍,凹部的间距为2.0mm以下。 这些部分的前端部的宽度为凹部的间距的0.01〜1.0倍。