Abstract:
A manufacturing-process equipment has a platform assembly, a measurement feedback assembly and a laser-working assembly. The platform assembly has a base and a hybrid-moving platform. The base has a mounting frame. The hybrid-moving platform is mounted on the base and has a long-stroke moving stage and a piezo-driven micro-stage. The long-stroke moving stage has a benchmark set and a driving device. The piezo-driven micro-stage is connected to the long-stroke moving stage and has a working platform. The measurement feedback assembly is securely mounted on the platform assembly and has a laser interferometer, a reflecting device and a signal-receiving device. The laser-working assembly is mounted on the platform assembly, is electrically connected to the measurement feedback assembly and has a laser direct-writing head, a controlling interface device and a positioning interface device.
Abstract:
A method for manufacturing metal nano particles having a hollow structure is provided. First, a suitable reducing agent is added into a first metal salt solution, and first metal ions are reduced to form first metal nano particles. Next, after the reducing agent is decomposed, a second metal salt solution with a higher reduction potential than that of the first metal is added. Then, the first metal particles are oxidized to form first metal ions when the second metal ions are reduced on the surface of the first metal by electrochemical oxidation reduction reaction, and thus, second metal nano particles having a hollow structure and a larger surface area are obtained. The method is simple and the metal nano particles with uniform particle size are obtained by this method.
Abstract:
A method for manufacturing a multi cap layer includes providing a substrate, forming a multi cap layer comprising a first cap layer and a second cap layer formed thereon on the substrate, forming a patterned metal hard mask layer on the multi cap layer, and performing an etching process to etch the multi cap layer through the patterned hard mask layer and to form an opening in the second cap layer.
Abstract:
An interconnect structure is described, disposed on a substrate with a conductive part thereon and including a first porous low-k layer on the substrate, a damascene structure in the first porous low-k layer electrically connecting with the conductive part, a second porous low-k layer over the first porous low-k layer and the damascene structure, and a UV cutting layer at least between the first and the second porous low-k layers, wherein the UV cutting layer is a UV reflection layer or a UV reflection-absorption layer.
Abstract:
An interconnect structure is described, disposed on a substrate with a conductive part thereon and including a first porous low-k layer on the substrate, a damascene structure in the first porous low-k layer electrically connecting with the conductive part, a second porous low-k layer over the first porous low-k layer and the damascene structure, and a UV cutting layer at least between the first and the second porous low-k layers, wherein the UV cutting layer is a UV reflection layer or a UV reflection-absorption layer.
Abstract:
An optical head to access data on an optical recording medium, which has two data storage densities, includes two sets of optical path systems to provide two optical paths that are crossed. Each optical path system includes a laser light generation unit, a light guiding unit, a converging objective lens and a photo detector. The light guiding unit is located on the optical path of the laser light generation unit, to direct the laser light to pass through the converging objective lens and focus on the data side of the optical recording medium to carry optical data signals from the data side. The laser light returns to the light guiding unit and travels along the optical path and is received by the photo detector.
Abstract:
An electronic device includes a first module including a first conductive component and a power control unit coupled to the first conductive component. The electronic device further includes a second module, a first hinge for pivoting the second module relative to the first module, and a first arm connected to the first hinge. The power control unit controls whether to execute a first power management status according to whether the first arm contacts the first conductive component as the second module pivots relative to the first module at a first angle by the first hinge.
Abstract:
A stress sensor includes a circuit board having a stress sensitive structure, a pointing stick and a metallic back plate. The stress sensitive structure includes a stress deformation region and multiple resistors located on the stress deformation region. The pointing stick is disposed on a top of the circuit board and connected to the stress sensitive structure. The metallic back plate includes at least one fixing material coating region, and thus the fixing edges of the circuit board are fixed on the corresponding fixing material coating region. An assembly method for the stress sensor is also provided.
Abstract:
The present invention provides a lamp device. The lamp device of the present invention comprises a lamp holder, a frame on the lamp holder, and a lamp tube having a height. At least one third of the height of the lamp tube is contacted with the frame to improve mechanical strength of the lamp tube.