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25 条记录 (耗时 0.028 秒)

    Cooling system for electronic apparatus and control method therefor
    13.
    发明授权
    Cooling system for electronic apparatus and control method therefor 失效
    电子设备冷却系统及其控制方法

    公开(公告)号：US5351498A

    公开(公告)日：1994-10-04

    申请号：US145156

    申请日：1993-11-03

    申请人： Tatsuya Takahashi ,  Shizuo Zushi

    发明人： Tatsuya Takahashi ,  Shizuo Zushi

    IPC分类号： F25B49/02 ,  G05D23/20 ,  G06F1/20 ,  H05K7/20 ,  F25B7/00

    CPC分类号： H05K7/208 ,  F25B49/022 ,  F25B49/025 ,  G05D23/1919 ,  G05D23/20 ,  G06F1/20 ,  H05K7/20836 ,  F25B2400/06 ,  F25B2600/0251 ,  F25B2600/0253 ,  G06F2200/201 ,  Y02B30/741

    摘要： When cooling power corresponding to an amount of heat generated by an electronic apparatus can be generated by either n or n+1 cooling units, n+1 cooling units are operated such that each of the cooling units keeps a sufficient margin in reserve. In this manner, even if an abnormality occurs in one of the cooling units, the operation can be continued by the n cooling units. Further, since an operation frequency of a compressor in the cooling unit can be decreased to rotate a motor in the compressor at a lower rotational speed, a speed at which a bearing is worn is slowed, whereby the useful life of the bearing can be prolonged.

    摘要翻译： 当由n或n + 1个冷却单元产生与电子设备产生的热量相对应的冷却功率时，n + 1个冷却单元被操作，使得每个冷却单元保持足够的余量。 以这种方式，即使在一个冷却单元中发生异常，也可以通过n个冷却单元继续运转。 此外，由于可以降低冷却单元中的压缩机的运转频率以使转子中的电动机以较低的转速旋转，因此轴承的磨损速度变慢，从而能够延长轴承的使用寿命 。

    Cooling apparatus for electronic device
    14.
    发明授权
    Cooling apparatus for electronic device 失效
    电子设备冷却装置

    公开(公告)号：US5126829A

    公开(公告)日：1992-06-30

    申请号：US412130

    申请日：1989-09-25

    申请人： Takahiro Daikoku ,  Nobuo Kawasaki ,  Noriyuki Ashiwake ,  Shizuo Zushi

    发明人： Takahiro Daikoku ,  Nobuo Kawasaki ,  Noriyuki Ashiwake ,  Shizuo Zushi

    IPC分类号： H01L23/433 ,  H05K7/20

    CPC分类号： H01L23/4338 ,  H01L2224/16

    摘要： A cooling apparatus for an electronic device makes a cooling solid body in contact with the electronic device so as to cool the electronic device. The apparatus has a high viscous thermal conductive fluid provided on a heat transfer portion of the electronic device, and a cooling solid body in close contact through the thermal conductive fluid with the heat transfer portion of the electronic device. The close contact portion of at least one of the cooling solid body and the electronic device has multiple grooves open to the outside of the one of the cooling solid body and the electronic device.

    摘要翻译： 一种用于电子设备的冷却装置使冷却固体与电子设备接触，以冷却电子设备。 该设备具有设置在电子设备的传热部分上的高粘性导热流体和通过导电流体与电子设备的传热部分紧密接触的冷却固体。 冷却固体和电子装置中的至少一个的紧密接触部分具有向冷却固体和电子装置之一的外部开口的多个凹槽。

    Cooling apparatus of electronic devices
    15.
    发明授权
    Cooling apparatus of electronic devices 失效
    电子设备冷却装置

    公开(公告)号：US5515912A

    公开(公告)日：1996-05-14

    申请号：US664605

    申请日：1991-03-04

    申请人： Takahiro Daikoku ,  Noriyuki Ashiwake ,  Nobuo Kawasaki ,  Shizuo Zushi

    发明人： Takahiro Daikoku ,  Noriyuki Ashiwake ,  Nobuo Kawasaki ,  Shizuo Zushi

    IPC分类号： H01L23/36 ,  H01L23/433 ,  H01L23/34

    CPC分类号： H01L23/4338 ,  H01L2224/16225

    摘要： A cooling apparatus of electronic devices including thermal conductive members each of which is positioned with one side thereof being in contact with a surface of each electronic device, the other side thereof being fitted to a housing with a small clearance provided therebetween, so as to diffuse and remove heat generated in the electronic devices. In order to press each thermal conductive member onto the associated electronic device, a resilient member is provided between the housing and the thermal conductive member, and is arranged to have a width larger than a width of grooves between fins formed on the housing and also larger than a width of grooves between fins formed on the thermal conductive member. A setting space to receive each resilient member therein is formed in a region where the fins are fitted to each other, so that the resilient member and the thermal conductive member can be fitted and positioned with respect to the housing when the resilient member is provided in this setting space.

    摘要翻译： 一种电子设备的冷却装置，包括导热构件，每个导热构件的一侧与每个电子装置的表面接触，其另一侧装配到具有设置在其间的小间隙的壳体，以便扩散 并去除电子设备中产生的热量。 为了将每个导热构件按压到相关联的电子装置上，弹性构件设置在壳体和导热构件之间，并且布置成具有比形成在壳体上的翅片之间的沟槽宽度更大的宽度，并且还更大 比形成在导热构件上的翅片之间的槽宽度大。 在翅片彼此装配的区域中形成有用于接收其中的每个弹性构件的设置空间，使得当弹性构件设置在弹性构件中时，可以将弹性构件和导热构件相对于壳体配合和定位 这个设置空间。

    Cooling apparatus and temperature control method therefor
    16.
    发明授权
    Cooling apparatus and temperature control method therefor 失效
    冷却装置及其温度控制方法

    公开(公告)号：US5335708A

    公开(公告)日：1994-08-09

    申请号：US953769

    申请日：1992-09-30

    申请人： Kyoshiro Murakami ,  Tetsuji Yamashita ,  Tomio Yoshikawa ,  Hiromu Yasuda ,  Shizuo Zushi

    发明人： Kyoshiro Murakami ,  Tetsuji Yamashita ,  Tomio Yoshikawa ,  Hiromu Yasuda ,  Shizuo Zushi

    IPC分类号： F25D9/00 ,  F25D1/02 ,  F28F27/02 ,  G05D23/20 ,  F28F27/00 ,  G05D23/00

    CPC分类号： F28F27/02 ,  G05D23/1931 ,  G05D23/20 ,  F28D2021/0077 ,  F28F2250/06 ,  F28F27/00

    摘要： A cooling apparatus has a heat exchanger for performing heat exchange between cooling water and fluid, and a flow rate regulator valve for regulating a flow rate of either the cooling water or the fluid which pass through the heat exchanger. A cooling temperature of the fluid is preset. A temperature of the cooled fluid is detected, and an opening degree of the flow rate regulator valve is changed when there is a difference between the detected temperature and the preset temperature. Simultaneously, either a temperature difference of the cooling water and the fluid or a flow rate of the cooling water is detected. The opening degree of the flow rate regulator valve is corrected or compensated on the basis of a result of the detection, thus enabling suitable temperature control of the fluid in accordance with a variation of the temperature or flow rate of the cooling water.

    摘要翻译： 冷却装置具有用于在冷却水和流体之间进行热交换的热交换器，以及调节通过热交换器的冷却水或流体的流量的流量调节阀。 预先设定流体的冷却温度。 检测到冷却液的温度，并且当检测温度与预设温度之间存在差异时，流量调节阀的开度改变。 同时，检测冷却水和流体的温度差或冷却水的流量。 基于检测结果校正或补偿流量调节阀的开度，从而根据冷却水的温度或流量的变化实现对流体的适当温度控制。

    Cooling apparatus of electronic devices
    18.
    发明授权
    Cooling apparatus of electronic devices 失效
    电子设备冷却装置

    公开(公告)号：US5595240A

    公开(公告)日：1997-01-21

    申请号：US464581

    申请日：1995-06-05

    申请人： Takahiro Daikoku ,  Noriyuki Ashiwake ,  Nobuo Kawasaki ,  Shizuo Zushi

    发明人： Takahiro Daikoku ,  Noriyuki Ashiwake ,  Nobuo Kawasaki ,  Shizuo Zushi

    IPC分类号： H01L23/36 ,  H01L23/433 ,  H01L23/34

    CPC分类号： H01L23/4338 ,  H01L2224/16225

    摘要： A cooling apparatus of electronic devices including thermal conductive members each of which is positioned with one side thereof being in contact with a surface of each electronic device, the other side thereof being fitted to a housing with a small clearance provided therebetween, so as to diffuse and remove heat generated in the electronic devices. In order to press each thermal conductive member onto the associated electronic device, a resilient member is provided between the housing and the thermal conductive member, and is arranged to have a width larger than a width of grooves between fins formed on the housing and also larger than a width of grooves between fins formed on the thermal conductive member. A setting space to receive each resilient member therein is formed in a region where the fins are fitted to each other, so that the resilient member and the thermal conductive member can be fitted and positioned with respect to the housing when the resilient member is provided in this setting space.

    摘要翻译： 一种电子设备的冷却装置，包括导热构件，每个导热构件的一侧与每个电子装置的表面接触，其另一侧装配到具有设置在其间的小间隙的壳体，以便扩散 并去除电子设备中产生的热量。 为了将每个导热构件按压到相关联的电子装置上，弹性构件设置在壳体和导热构件之间，并且布置成具有比形成在壳体上的翅片之间的凹槽的宽度更大的宽度，并且还更大 比形成在导热构件上的翅片之间的槽宽度大。 在翅片彼此装配的区域中形成有用于接收其中的每个弹性构件的设置空间，使得当弹性构件设置在弹性构件中时，可以将弹性构件和导热构件相对于壳体配合和定位 这个设置空间。

    Refrigerating apparatus
    20.
    发明授权
    Refrigerating apparatus 失效
    制冷装置

    公开(公告)号：US4910968A

    公开(公告)日：1990-03-27

    申请号：US345839

    申请日：1989-05-01

    申请人： Tetsuji Yamashita ,  Hideo Takemoto ,  Tomio Yoshikawa ,  Shizuo Zushi ,  Kenji Takahashi

    发明人： Tetsuji Yamashita ,  Hideo Takemoto ,  Tomio Yoshikawa ,  Shizuo Zushi ,  Kenji Takahashi

    IPC分类号： F25B1/00 ,  F25B49/02 ,  G05D23/19

    CPC分类号： F25B49/025 ,  G05D23/1912 ,  F25B2400/06 ,  F25B2500/26 ,  F25B2600/021 ,  F25B2600/21 ,  F25B2600/2513 ,  Y02B30/741

    摘要： A refrigerating apparatus has a refrigerating cycle including an electromotive compressor whose operational speed is variable in accordance with a drive frequency, and a control unit for operating the compressor at a frequency correspondent to a load so as to control the operation of the refrigerating cycle. Control of the operational frequency of the compressor by the control unit is effected on the basis of target super heat amounts of a discharged gas which is predetermined over an operational frequency range of the compressor. The target super heat amounts are set such that within a lower region of the operational frequency range, each target amount is larger than a super heat amount at which the maximum refrigeration capability is obtained at each operational frequency, so as to suppress a suction pressure of the compressor within an allowable limit for the compressor.

    摘要翻译： 一种制冷装置具有包括电动压缩机的制冷循环，该电动压缩机的运转速度根据驱动频率而变化，以及控制单元，其以与负载对应的频率运转压缩机，以控制制冷循环的运转。 基于在压缩机的工作频率范围内预定的排出气体的目标超热量来实现控制单元对压缩机的工作频率的控制。 目标超热量被设定为使得在工作频率范围的较低区域内，每个目标量大于在每个操作频率处获得最大制冷能力的超热量，以便抑制 压缩机在压缩机的允许极限内。