公开(公告)号：US5281742A

公开(公告)日：1994-01-25

申请号：US823454

申请日：1992-01-21

申请人： Kenji Hirai ,  Tomoyuki Yano ,  Mitsuo Yamashita ,  Emiko Ejiri ,  Tomoko Tateno ,  Kiyomi Aizawa

发明人： Kenji Hirai ,  Tomoyuki Yano ,  Mitsuo Yamashita ,  Emiko Ejiri ,  Tomoko Tateno ,  Kiyomi Aizawa

IPC分类号： C07C205/43 ,  C07C219/34 ,  C07C265/12 ,  C07C269/02 ,  C07C269/06 ,  C07C271/28 ,  C07D263/44 ,  C07D263/20

CPC分类号： C07D263/44 ,  C07C205/43 ,  C07C219/34 ,  C07C265/12 ,  C07C269/02 ,  C07C269/06 ,  C07C271/28

摘要： Disclosed are fluorobenzene derivatives, which are important intermediates for producing herbicidal oxazolidinedione derivatives, and methods of producing them. The fluorobenzene derivatives include compounds of a formula (11): ##STR1## where X is a halogen atom, R.sup.3 is a nitro, amino or isocyanato group or R.sup.1 OCONH, and R.sup.1 is an alkyl or phenyl group. Via the intermediates of the invention, oxazolidinedione derivatives can be produced with high yield.

摘要翻译： 公开了作为生产除草恶唑烷二酮衍生物的重要中间体的氟苯衍生物及其制备方法。 氟苯衍生物包括式（11）的化合物：（*化学结构*）（11）其中X是卤素原子，R3是硝基，氨基或异氰酸基或R1OCONH，R1是烷基或苯基。 通过本发明的中间体，可以高产率制备恶唑烷二酮衍生物。

公开(公告)号：US5053557A

公开(公告)日：1991-10-01

申请号：US578242

申请日：1990-09-06

申请人： Kenji Hirai ,  Mitsuo Yamashita

发明人： Kenji Hirai ,  Mitsuo Yamashita

IPC分类号： C07C37/62 ,  C07C39/27

CPC分类号： C07C37/62

摘要： A process is disclosed for preparing 2-chloro-4-fluorophenol which comprises chlorinating 4-fluorophenol with a chlorinating agent in the presence of water. The process according to the present invention has advantages in that the chlorination can be carried out using inexpensive reagents without requiring the use of particular apparatus and under mild conditions, and the desired product can be obtained in good yields and with high selectivity. 2-Chloro-4-fluorophenol obtained in the present invention is useful as a starting material for producing various pharmaceutical agents and agricultural agents.

公开(公告)号：US4809036A

公开(公告)日：1989-02-28

申请号：US109397

申请日：1987-10-19

申请人： Mitsuo Yamashita ,  Shinji Nakagawa

发明人： Mitsuo Yamashita ,  Shinji Nakagawa

IPC分类号： G03G15/08

CPC分类号： G03G15/0818

摘要： A developing apparatus is disclosed which includes a rotatable development sleeve which carries a non-magnetic one-constituent toner on a surface thereof. When the development sleeve rotates, the toner thereon is transferred to an electrostatic latent image, an elastic blade being urged against the surface of the development sleeve, to ensure that the layer of toner thereon is of uniform thickness. The interior of the development sleeve has a ribbed structure which provides additional structural rigidity.

摘要翻译： 公开了一种显影装置，其包括在其表面上承载非磁性单组分调色剂的可旋转显影套筒。 当显影套筒旋转时，其上的调色剂转印到静电潜像上，弹性片被推压到显影套筒的表面上，以确保其上的调色剂层具有均匀的厚度。 显影套筒的内部具有肋结构，其提供额外的结构刚性。

公开(公告)号：US4385376A

公开(公告)日：1983-05-24

申请号：US299483

申请日：1981-09-04

申请人： Takashi Takaoka ,  Masahiko Mochizuki ,  Tadao Miura ,  Mitsuo Yamashita

发明人： Takashi Takaoka ,  Masahiko Mochizuki ,  Tadao Miura ,  Mitsuo Yamashita

IPC分类号： G03C1/735 ,  B29B15/00 ,  B29D7/00 ,  C23C8/10 ,  G03C1/72 ,  G03C1/725 ,  G11B7/24 ,  G11B7/241 ,  G11B7/243 ,  G11B7/254 ,  G11B7/257 ,  G11B7/26

CPC分类号： G11B7/2578 ,  C23C8/10 ,  G11B7/243 ,  G11B7/2548 ,  G11B2007/24316 ,  G11B2007/25715 ,  G11B7/2531 ,  G11B7/2533 ,  Y10S428/913 ,  Y10S430/146 ,  Y10S430/162

摘要： A method of making an optical memory disk and a product thereby comprising the steps of applying a thin tellurium film to a base plate, and of forming an oxidizing layer on the surface of the tellurium by oxidizing treatment of the tellurium film, and an optical memory disk produced by the above-mentioned method.

公开(公告)号：US4368503A

公开(公告)日：1983-01-11

申请号：US229594

申请日：1981-01-16

申请人： Keiji Kurosawa ,  Kenji Yamamoto ,  Mitsuo Yamashita ,  Hisami Mitsui ,  Ayako Miyabara ,  Kiyotaka Miyagawa ,  Takayoshi Imura

发明人： Keiji Kurosawa ,  Kenji Yamamoto ,  Mitsuo Yamashita ,  Hisami Mitsui ,  Ayako Miyabara ,  Kiyotaka Miyagawa ,  Takayoshi Imura

IPC分类号： B32B15/08 ,  H05K1/05 ,  H05K3/42 ,  H05K3/46 ,  H05K1/14

CPC分类号： H05K3/462 ,  H05K3/429 ,  H05K1/0272 ,  H05K1/053 ,  H05K2201/0379 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2203/0315 ,  H05K3/426 ,  H05K3/427 ,  H05K3/4623 ,  Y10T29/49126

摘要： A hollow multilayer printed wiring board and a process for manufacturing the same are provided. The hollow multilayer printed wiring board is comprised of a plurality of printed substrates (1), (2), (3) and (4), superposed upon each other with a predetermined space therebetween each of which substrate has a signal conductor pattern (6) formed on at least one surface thereof and a land conductor pattern (7) formed on at least one surface thereof. Each substrate has plated throughholes (10) in the land conductor pattern, each of which holes is in line with another plated throughhole of at least one of the neighboring substrates to form a throughhole or an interstitial via hole (12) or (13). A layer of a low melting point metal is formed at least on the upper and lower end surfaces of each plated throughholes (10), which layer serves as a through connection between two or more signal conductor patterns of the substrates and as an interlayer adhesion between the substrates. The superposed substrates, except for at least one surface substrate, are made of a thermally resistant organic synthetic resin sheet or an insulation-treated metal.

摘要翻译： PCT No.PCT / JP80 / 00111 Sec。 371日期：1981年1月24日 102（e）日期1981年1月16日PCT提交1980年5月23日PCT公布。 出版物WO80 / 02633 日期为1980年11月27日。提供了一种中空多层印刷线路板及其制造方法。 中空多层印刷线路板由多个印刷基板（1），（2），（3）和（4）组成，其间具有预定的间隔，每个基板具有信号导体图案（6） ）和形成在其至少一个表面上的接地导体图案（7）。 每个基板在陆地导体图案中具有电镀通孔（10），每个孔与至少一个相邻基板的另一个电镀通孔对齐，以形成通孔或间隙通孔（12）或（13）。 至少在每个电镀通孔（10）的上下表面上形成低熔点金属层，该层用作基板的两个或更多个信号导体图案之间的通孔连接，并且作为层间粘合 底物。 除了至少一个表面基板之外，叠置的基板由耐热有机合成树脂片材或绝缘处理的金属制成。

公开(公告)号：US09184695B2

公开(公告)日：2015-11-10

申请号：US13318301

申请日：2010-06-29

申请人： Mitsuo Yamashita ,  Kouki Uchida

发明人： Mitsuo Yamashita ,  Kouki Uchida

IPC分类号： H01R13/46 ,  H05K5/00 ,  H01J5/00 ,  H01J15/00 ,  H05K5/06 ,  H02G3/18 ,  H02B1/00 ,  H02B1/26 ,  B65D1/24 ,  B65D1/36 ,  B65D25/04 ,  B65D57/00 ,  B65D85/00 ,  H02S40/34

CPC分类号： H02S40/34

摘要： It is an object of the invention to provide a terminal box for a solar cell module in which a positive terminal and a negative terminal are electrically isolated from each other, an occurrence of a short circuit is reduced, and reliability is enhanced, and a solar cell module including the same. In order to achieve this object, a terminal box for a solar cell module contains terminals configured to derive an output from a solar cell panel to the outside, and includes a container and a lid body covering an aperture of the container. The container includes a first region in which a first terminal configured to connect a first output conductor of the solar cell panel is disposed, a second region in which a second terminal configured to connect a second output conductor of the solar cell panel is disposed, and a partitioning portion provided so as to partition the first region and the second region and including a groove on an aperture surface of the container. The lid body includes a projection contained in the groove.

摘要翻译： 本发明的目的是提供一种太阳能电池模块的端子盒，其中正极端子和负极端子彼此电绝缘，从而减少了短路的发生，提高了可靠性，并且太阳能电池 电池模块包括相同的。 为了实现该目的，太阳能电池模块用接线盒包含端子，该端子被配置为将太阳能电池板的输出导出到外部，并且包括容器和覆盖容器的孔的盖体。 容器包括：第一区域，其中布置有用于连接太阳能电池面板的第一输出导体的第一端子;第二区域，配置成连接太阳能电池面板的第二输出导体的第二端子;以及第二区域， 分隔部，其设置成分隔第一区域和第二区域，并且在容器的孔表面上包括凹槽。 盖体包括容纳在槽中的突起。

公开(公告)号：US20120018048A1

公开(公告)日：2012-01-26

申请号：US12307370

申请日：2007-07-03

申请人： Mitsuo Yamashita ,  Tomoaki Goto ,  Takeshi Asagi

发明人： Mitsuo Yamashita ,  Tomoaki Goto ,  Takeshi Asagi

IPC分类号： B23K35/26

CPC分类号： H05K3/341 ,  B23K1/0016 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/262 ,  B23K2101/36 ,  B23K2101/42 ,  C22C1/0483 ,  C22C12/00 ,  C22C13/00 ,  C22C28/00 ,  H01L2924/0132 ,  H01L2924/0133 ,  H05K3/3484 ,  H05K2201/0266 ,  H05K2201/0272 ,  H05K2203/04 ,  H05K2203/12 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01029

摘要： A cream solder obtained by kneading an Sn—Ag—Cu alloy together with a flux, wherein the Sn—Ag—Cu alloy includes a mixture of a first powdery alloy and a second powdery alloy, the first powdery alloy is represented by an Sn—Ag phase diagram having a solid-liquid coexistence region and has a given silver amount which is larger than that in the eutectic composition (3.5 wt. % silver), and the second powdery alloy has a silver amount which is that in the eutectic composition (3.5 wt. % silver) or which is close to that in the eutectic composition and is smaller than that in the first powdery alloy. This cream solder has excellent strength and thermal stability, and satisfactory bonding properties. It is based on an inexpensive Sn—Ag—Cu solder alloy. It is suitable for use as a high-temperature-side lead-free solder material conformable to temperature gradation bonding. Also provided is a method of soldering.

摘要翻译： 通过将Sn-Ag-Cu合金与助熔剂捏合而获得的膏状焊料，其中，Sn-Ag-Cu合金包括第一粉末合金和第二粉末合金的混合物，第一粉末合金由Sn- Ag相图具有固液共存区域，并且具有比共晶组合物（3.5重量％银）大的给定银量，第二粉末合金的银量为共晶组合物中的银量（ 3.5重量％的银），或者接近于共晶组合物中的银，并且小于第一粉末合金中的银。 这种膏状焊料具有优异的强度和热稳定性，并且具有令人满意的粘合性能。 它基于廉价的Sn-Ag-Cu焊料合金。 适用于符合温度梯度键合的高温侧无铅焊料。 还提供了一种焊接方法。

公开(公告)号：US20110236845A1

公开(公告)日：2011-09-29

申请号：US13155013

申请日：2011-06-07

申请人： Shigeki AOKI ,  Yuichi Sakai ,  Mitsuo Yamashita ,  Hiroshi Shinya

发明人： Shigeki AOKI ,  Yuichi Sakai ,  Mitsuo Yamashita ,  Hiroshi Shinya

IPC分类号： F24J3/00

CPC分类号： F26B3/20 ,  F26B9/103 ,  F26B21/001 ,  G03F7/168 ,  G03F7/40 ,  H01L21/67109 ,  H01L21/67178 ,  H01L21/67248 ,  H01L21/677 ,  H01L21/67748

摘要： A heat processing apparatus includes a heating plate configured to heat the substrate; a cover configured to surround a space above the heating plate; an exhaust gas flow forming mechanism configured to exhaust gas inside the cover to form exhaust gas flows within the space above the heating plate; a downflow forming mechanism configured to form downflows uniformly supplied onto an upper surface of the substrate placed on the heating plate; and a control mechanism configured to execute mode switching control between a mode arranged to heat the substrate while forming the downflows by the downflow forming mechanism and a mode arranged to heat the substrate while forming the exhaust gas flows by the exhaust gas flow forming mechanism.

摘要翻译： 热处理装置包括：加热板，其被配置为加热所述基板; 盖构造成围绕加热板上方的空间; 排气流动形成机构，其构造成在所述盖内排出气体，以在所述加热板上方的空间内形成废气流; 下降形成机构，其被配置为形成均匀地供给到放置在所述加热板上的所述基板的上表面上的下流; 以及控制机构，其被配置为在通过下流形成机构形成下流的同时，在布置成加热所述基板的模式之间执行模式切换控制，以及布置成在形成所述废气的同时由所述排气流动形成机构流动的模式。

公开(公告)号：US20070029678A1

公开(公告)日：2007-02-08

申请号：US11498873

申请日：2006-08-04

申请人： Kazuyuki Makita ,  Masaki Ichinose ,  Taketo Watashima ,  Masayuki Soutome ,  Mitsuo Yamashita ,  Takeshi Asagi ,  Masatoshi Hirai ,  Toru Murata

发明人： Kazuyuki Makita ,  Masaki Ichinose ,  Taketo Watashima ,  Masayuki Soutome ,  Mitsuo Yamashita ,  Takeshi Asagi ,  Masatoshi Hirai ,  Toru Murata

IPC分类号： H01L23/48

CPC分类号： B23K35/262 ,  Y10T428/31678

摘要： According to one embodiment of the invention, there is provided a lead-free solder including an alloy rolled into a shape of sheet. The alloy includes: tin; from 10 wt % to less than 25 wt % of silver; and from 3 wt % to 5 wt % of copper. The alloy is free from lead.

摘要翻译： 根据本发明的一个实施例，提供了一种无铅焊料，其包括卷成片状的合金。 合金包括：锡; 从10重量％至小于25重量％的银; 和3重量％至5重量％的铜。 该合金不含铅。

公开(公告)号：US06531651B2

公开(公告)日：2003-03-11

申请号：US09846195

申请日：2001-05-02

申请人： Makoto Kanemitsu ,  Mitsuo Yamashita ,  Hiroyuki Kurita ,  Masahiko Abiko

发明人： Makoto Kanemitsu ,  Mitsuo Yamashita ,  Hiroyuki Kurita ,  Masahiko Abiko

IPC分类号： G10C312

CPC分类号： G10C3/12 ,  G10C3/125

摘要： A key is provided for permitting simple attachment of a weight and easy adjustment of a touch load, while using an alternative material for substitution for lead as a material for the weight, to thereby reduce the manufacturing cost. A swingable key body is formed with an embedding hole. The weight is made of a composite material produced by blending a plurality of kinds of materials except for lead in a predetermined blending proportion to have a predetermined specific gravity, and is removably attached to the embedding hole of the key body.

摘要翻译： 提供了一种钥匙，用于允许简单地附接重量并容易地调节触摸负载，同时使用替代材料来代替铅作为重量的材料，从而降低制造成本。 摆动键体形成有嵌入孔。 重量由复合材料制成，该复合材料通过将预定混合比例的铅除外的多种材料混合制成，以具有预定的比重，并且可移除地附着到钥匙体的嵌入孔。