公开(公告)号：US20230420391A1

公开(公告)日：2023-12-28

申请号：US17944453

申请日：2022-09-14

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Feng Kao ,  Lung-Yuan Wang

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/31 ,  H01L21/56 ,  G02B6/12 ,  G02B6/13

CPC classification number: H01L23/564 ,  H01L23/49811 ,  H01L23/3185 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L21/563 ,  G02B6/12 ,  G02B6/13 ,  H01L23/49827 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  G02B2006/121

Abstract: An electronic package is provided, in which an electronic element that is electrically connected to a plurality of conductive vias and a functional part that has a hollow area are disposed on a photonic die that has the plurality of conductive vias and at least one external connection portion, where a cladding layer covers the electronic element and the functional part, such that the external connection portion is exposed from the hollow area and the cladding layer for an optical fiber to insert into the hollow area and connect to the external connection portion, so as to achieve the purpose of optoelectronic integration.

公开(公告)号：US20230369229A1

公开(公告)日：2023-11-16

申请号：US17858358

申请日：2022-07-06

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Hsin-Jou Lin ,  Lung-Yuan Wang ,  Chih-Nan Lin ,  Feng Kao ,  Chiu-Ling Chen

IPC: H01L23/538 ,  H01L25/10 ,  H01L23/00 ,  H01L23/498 ,  H01L21/48

CPC classification number: H01L23/5381 ,  H01L25/105 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/5386 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/4857 ,  H01L23/49838 ,  H01L23/5385 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/3512 ,  H01L2924/182

Abstract: An electronic package and manufacturing method thereof are provided, in which an electronic module served as a bridge element and a plurality of conductive pillars are embedded in a packaging layer, a routing structure is formed on the packaging layer, and a plurality of electronic elements are disposed on the routing structure, such that the electronic elements electrically bridge the electronic module via the routing structure.

公开(公告)号：US20230178451A1

公开(公告)日：2023-06-08

申请号：US17944464

申请日：2022-09-14

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Hsin-Jou Lin ,  Lung-Yuan Wang ,  Feng Kao ,  Chiu-Ling Chen

IPC: H01L23/367 ,  H01L23/00 ,  H01L25/10 ,  H01L23/498 ,  H01L25/00 ,  H01L21/48

CPC classification number: H01L23/3675 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L23/3677 ,  H01L25/105 ,  H01L23/3672 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/49838 ,  H01L25/50 ,  H01L21/4882 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/16235 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2225/1076 ,  H01L2924/16151 ,  H01L2924/16196 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/1632 ,  H01L2924/16315

Abstract: A method of manufacturing an electronic package is provided, in which a package module including a routing structure is stacked on a carrier structure via a plurality of conductive elements, a heat dissipation member covers a part of a surface of the routing structure, and an electronic module is disposed on another part of the surface of the routing structure, so that the routing structure is formed with at least one heat dissipation pad bonded to the heat dissipation member, such that the heat energy of the electronic module and the package module can be dissipated via the heat dissipation pad and the heat dissipation member.

公开(公告)号：US20220005786A1

公开(公告)日：2022-01-06

申请号：US17481610

申请日：2021-09-22

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Lung-Yuan Wang ,  Feng Kao ,  Mao-Hua Yeh

IPC: H01L25/065 ,  H01L23/552 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L25/16 ,  H01L25/00 ,  H01L23/31

Abstract: An electronic package and a method for fabricating the same are provided. Two packaging modules are stacked on each other. An area that an electronic package occupies a mother board is reduced during a subsequent process of fabricating an electronic product. Therefore, the electronic product has a reduced size.

公开(公告)号：US11152331B2

公开(公告)日：2021-10-19

申请号：US16673078

申请日：2019-11-04

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Lung-Yuan Wang ,  Feng Kao ,  Mao-Hua Yeh

IPC: H01L25/065 ,  H01L23/552 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L25/16 ,  H01L25/00 ,  H01L23/31

Abstract: An electronic package and a method for fabricating the same are provided. Two packaging modules are stacked on each other. An area that an electronic package occupies a mother board is reduced during a subsequent process of fabricating an electronic product. Therefore, the electronic product has a reduced size.