Method for producing a control device for operating a radiation-emitting semiconductor component
    11.
    发明授权
    Method for producing a control device for operating a radiation-emitting semiconductor component 有权
    用于制造用于操作辐射发射半导体部件的控制装置的方法

    公开(公告)号:US08519633B2

    公开(公告)日:2013-08-27

    申请号:US12528005

    申请日:2008-02-15

    IPC分类号: H05B41/14 H05B37/00

    CPC分类号: H05B33/0848 H05B33/0818

    摘要: A pulsed electric operating current that rises during a pulse duration is generated for operating at least one radiation-emitting semiconductor component. For this purpose, in a method for producing a control device for operating the at least one radiation-emitting semiconductor component, a temporal profile of a thermal impedance representative of the at least one radiation-emitting semiconductor component is determined. A profile of the electric operating current that is to be set is determined depending on the determined temporal profile of the thermal impedance. The control device is furthermore designed such that the profile of the operating current that is to be set is set in each case during the pulse duration.

    摘要翻译: 产生在脉冲持续时间期间上升的脉冲电工作电流,用于操作至少一个辐射发射半导体部件。 为此,在制造用于操作至少一个辐射发射半导体部件的控制装置的方法中,确定表示至少一个辐射发射半导体部件的热阻抗的时间分布。 将根据所确定的热阻抗的时间特征来确定待设置的电动工作电流的曲线。 此外,控制装置被设计成使得在脉冲持续时间期间,在每种情况下设置要被设置的工作电流的轮廓。

    Optoelectronic Component, and Method for the Production of an Optoelectronic Component
    12.
    发明申请
    Optoelectronic Component, and Method for the Production of an Optoelectronic Component 有权
    光电子元件和光电元件生产方法

    公开(公告)号:US20120112337A1

    公开(公告)日:2012-05-10

    申请号:US13062425

    申请日:2009-08-20

    IPC分类号: H01L23/34 H01L21/52

    摘要: An optoelectronic component (1) is provided, having at least two connecters (2) for electrical contacting of the component (1), a housing body (3), in which the connecters (2) are embedded in places, a heat sink (4), which is connected to at least one connecter (2), wherein the housing body (3) is formed of a plastics material, the housing body (3) comprises an opening (30), in which the heat sink (4) is freely accessible in places, at least one optoelectronic semiconductor chip (5) is arranged in the opening (30) on the heat sink (4), and at least two of the connecters (2) each comprise a chip-end portion (2c), which faces the at least one optoelectronic semiconductor chip (5), wherein the chip-end portions (2c) of the at least two connecters (2) are arranged in a common plane.

    摘要翻译: 提供了一种光电子部件(1),其具有至少两个用于部件(1)的电接触的连接器(2),壳体主体(3),其中连接器(2)嵌入其中,散热器 4),其连接到至少一个连接器(2),其中所述壳体(3)由塑料材料形成,所述壳体(3)包括开口(30),所述散热器(4) 在地方可自由接近,至少一个光电半导体芯片(5)布置在散热器(4)上的开口(30)中,并且至少两个连接器(2)各自包括芯片端部分(2c) ),其面向所述至少一个光电半导体芯片(5),其中所述至少两个连接器(2)的所述芯片端部分(2c)布置在公共平面中。

    Microoptical device with mirrors
    15.
    发明授权
    Microoptical device with mirrors 失效
    带镜子的微光学装置

    公开(公告)号:US5808323A

    公开(公告)日:1998-09-15

    申请号:US625636

    申请日:1996-03-29

    摘要: The microoptical device has beam-parallelizing optics and a deflecting mirror configuration. The device converts a laser beam bundle, which is emitted by a laser diode strip structure or individual diode chips and which is comprised of a plurality of strip-shaped individual laser beams, into a rectangular or parallelogram-shaped laser beam bundle composed of parallelized strip-shaped individual laser beams arranged parallel next to one another. The beam-parallelizing optics may be a cylindrical lens, and the deflecting mirror configuration may be two rows of mirrors. The cylindrical lens and the rows of mirrors are preferably produced from a semiconductor material and they can therefore be produced cost effectively by means of methods used in semiconductor process engineering.

    摘要翻译: 微光器件具有光束并行光学元件和偏转镜配置。 该装置将由激光二极管条状结构发射的激光束束或单独的二极管芯片转换成由平行四边形形状的激光束束组成的矩形或平行四边形的激光束束 形的单个激光束彼此并排布置。 光束平行化光学器件可以是柱面透镜,并且偏转镜配置可以是两排反射镜。 柱面透镜和反射镜列优选由半导体材料制成,因此可以通过半导体工艺工程中使用的方法成本有效地制造。