公开(公告)号：US07258011B2

公开(公告)日：2007-08-21

申请号：US11285493

申请日：2005-11-21

申请人： Steven S. Nasiri ,  Joseph Seeger

发明人： Steven S. Nasiri ,  Joseph Seeger

IPC分类号： G01P15/125

CPC分类号： G01P15/18 ,  G01P1/023 ,  G01P15/0802 ,  G01P15/125 ,  G01P2015/082

摘要： A sensor for measuring acceleration in three mutually orthogonal axes, X, Y and Z is disclosed. The sensor comprises a sensor subassembly. The sensor subassembly further comprises a base which is substantially parallel to the X-Y sensing plane; a proof mass disposed in the X-Y sensing plane and constrained to move substantially in the X, Y, and Z, about by at least one linkage and is responsive to accelerations in the X, Y and Z directions. The sensor includes at least one paddle disposed in the sensing plane; and at least one pivot on the linkage. Finally, the sensor includes at least one electrode at the base plate and at least one transducer for each sensing direction of the sensor subassembly responsive to the acceleration.

公开(公告)号：US06843574B2

公开(公告)日：2005-01-18

申请号：US10225081

申请日：2002-08-20

申请人： James Starr ,  Mitchell J. Novack ,  Haesung Kwon ,  James H. Smith ,  Steven S. Nasiri

发明人： James Starr ,  Mitchell J. Novack ,  Haesung Kwon ,  James H. Smith ,  Steven S. Nasiri

IPC分类号： B81B3/00 ,  G02B6/35 ,  G02B26/08 ,  G02B7/182

CPC分类号： G02B6/3564 ,  B81B3/0062 ,  B81B2201/042 ,  G02B6/3512 ,  G02B6/3584 ,  G02B26/0833

摘要： The present invention is directed towards apparatuses for rotating a gimbaled platform with rotatable actuators. Gimbal springs comprised of component springs with compliant axes that intersect at a nonzero angle are coupled to the gimbaled platform. Preferably, the compliant axes of the component springs are oriented at an approximately 45 degree angle relative to the actuator rotation axes. Wraparound lever arms coupling the rotatable actuators with the gimbal springs serve to increase the leverage ratio, thereby permitting greater platform rotation for a given actuator rotation.

摘要翻译： 本发明涉及用可旋转致动器旋转万向平台的装置。 由具有与非零角度相交的柔性轴的分量弹簧组成的万向弹簧耦合到万向平台。 优选地，组件弹簧的柔顺轴线相对于致动器旋转轴线定向成大致45度的角度。 将可旋转致动器与万向弹簧联接的环绕杆臂用于增加杠杆比，从而允许给定致动器旋转更大的平台旋转。

公开(公告)号：US06823127B2

公开(公告)日：2004-11-23

申请号：US10236471

申请日：2002-09-05

申请人： Steven S. Nasiri ,  Janusz Liberkowski ,  Zhenfang Chen ,  Jeff Jarfa

发明人： Steven S. Nasiri ,  Janusz Liberkowski ,  Zhenfang Chen ,  Jeff Jarfa

IPC分类号： G02B600

CPC分类号： G02B6/3644 ,  G02B6/32 ,  G02B6/3672 ,  G02B6/3692 ,  G02B6/3833 ,  G02B6/3834 ,  G02B6/4248

摘要： Optical fibers are inserted and bonded in a two dimensional array of feedthroughs provided by an insert having a top plate, a bottom plate and a sandwiched spacer plate. Top and bottom plate feature funnel shaped hole sections that capture the approaching fiber end during its insertion. The funnel sections terminate in narrow hole sections that tightly hold the inserted fiber ends. Having top and bottom plate spaced apart provides for high angular precision of the bonded fiber ends with minimal fabrication effort of the insert. Optical fibers may be combined in linear arrays and simultaneously inserted significantly reducing assembly efforts. The insert is attached to a fiber housing and hermetically sealed within an external housing, which features a glass plate to provide beam propagation to and from the fiber ends. An optical gel fills the gap between the insert's output face and the glass plate.

摘要翻译： 将光纤插入并结合在由具有顶板，底板和夹持间隔板的插入件提供的馈通的二维阵列中。 顶板和底板都具有漏斗形孔部分，在其插入期间捕获接近光纤端。 漏斗部分终止于紧密地保持插入的光纤端部的窄孔部分。 具有间隔开的顶板和底板，以最小的插入件制造工作提供了粘合的纤维端部的高角度精度。 光纤可以以线性阵列组合，并同时显着地减少组装工作。 插入件附接到纤维壳体并气密地密封在外部壳体内，其具有玻璃板以提供光纤传播到光纤端和从纤维端传播。 光学凝胶填充插入件的输出面和玻璃板之间的间隙。

公开(公告)号：US08508039B1

公开(公告)日：2013-08-13

申请号：US12117264

申请日：2008-05-08

申请人： Steven S. Nasiri ,  Goksen G. Yaralioglu

发明人： Steven S. Nasiri ,  Goksen G. Yaralioglu

IPC分类号： H01L23/12

CPC分类号： B81C1/0023 ,  B81C1/00238 ,  B81C2203/0792 ,  H01L2224/11

摘要： In a method and system in accordance with the present invention, solder balls are added on top of vertically integrated MEMS with CMOS by using wafer scale fabrication compatible with existing chip scale packaging capabilities. In the present invention, both the MEMS and the CMOS dies are fabricated in equal dimensions. On the MEMS level, silicon islands are defined by DRIE etching to be bonded on top of CMOS pads. These conducting silicon islands later provide electrical connections between the CMOS pads and the conducting traces that lead to solder balls on top.

摘要翻译： 在根据本发明的方法和系统中，通过使用与现有芯片级封装能力兼容的晶片级制造，将焊球添加到具有CMOS的垂直集成MEMS的顶部上。 在本发明中，MEMS和CMOS晶体管的尺寸相同。 在MEMS级别上，硅岛由DRIE蚀刻限定，以连接在CMOS焊盘之上。 这些导电硅岛稍后提供CMOS焊盘和导致焊球顶部的导电迹线之间的电连接。

公开(公告)号：US08084332B2

公开(公告)日：2011-12-27

申请号：US12184231

申请日：2008-07-31

申请人： Steven S. Nasiri ,  Anthony Francis Flannery, Jr.

发明人： Steven S. Nasiri ,  Anthony Francis Flannery, Jr.

IPC分类号： H01L21/30 ,  H01L21/46 ,  H01L21/00 ,  H01L29/40

CPC分类号： B81C1/00238 ,  B23K20/023 ,  B81B3/0018 ,  B81B7/007 ,  B81B2203/0315 ,  B81B2207/012 ,  B81B2207/094 ,  B81C1/00269 ,  B81C3/001 ,  B81C2203/0118 ,  B81C2203/035 ,  B81C2203/038 ,  B81C2203/0792 ,  H01L21/187

摘要： A method of bonding of germanium to aluminum between two substrates to create a robust electrical and mechanical contact is disclosed. An aluminum-germanium bond has the following unique combination of attributes: (1) it can form a hermetic seal; (2) it can be used to create an electrically conductive path between two substrates; (3) it can be patterned so that this conduction path is localized; (4) the bond can be made with the aluminum that is available as standard foundry CMOS process. This has the significant advantage of allowing for wafer-level bonding or packaging without the addition of any additional process layers to the CMOS wafer.

摘要翻译： 公开了一种在两个基板之间将锗键合到铝以产生牢固的电气和机械接触的方法。 铝 - 锗键具有以下独特的属性组合：（1）可形成气密封; （2）可用于在两个基板之间形成导电路径; （3）可以对其进行图案化，使得该导电路径被定位; （4）可以用作为标准铸造CMOS工艺的铝制成。 这具有允许晶片级接合或封装而不向CMOS晶片添加任何附加工艺层的显着优点。

公开(公告)号：US08047075B2

公开(公告)日：2011-11-01

申请号：US11766776

申请日：2007-06-21

申请人： Steven S. Nasiri ,  Joseph Seeger ,  Goksen Yaralioglu

发明人： Steven S. Nasiri ,  Joseph Seeger ,  Goksen Yaralioglu

IPC分类号： G01P15/125

CPC分类号： G01P15/125 ,  G01P15/18 ,  G01P2015/0814 ,  G01P2015/0831

摘要： A system and method in accordance with the present invention provides for a low cost, bulk micromachined accelerometer integrated with electronics. The accelerometer can also be integrated with rate sensors that operate in a vacuum environment. The quality factor of the resonances is suppressed by adding dampers. Acceleration sensing in each axis is achieved by separate structures where the motion of the proof mass affects the value of sense capacitors differentially. Two structures are used per axis to enable full bridge measurements to further reduce the mechanical noise, immunity to power supply changes and cross axis coupling. To reduce the sensitivity to packaging and temperature changes, each mechanical structure is anchored to a single anchor pillar bonded to the top cover.

摘要翻译： 根据本发明的系统和方法提供了一种与电子器件集成的低成本，体积微机械加速度计。 加速度计也可以与在真空环境中运行的速率传感器集成。 通过加入阻尼器来抑制谐振的品质因数。 每个轴上的加速度感测通过单独的结构实现，其中检测质量的运动差异地影响感测电容器的值。 每个轴使用两个结构，以实现全桥测量，以进一步降低机械噪声，对电源变化的抗扰度和交叉轴耦合。 为了降低对包装和温度变化的敏感性，每个机械结构被锚定到结合到顶盖的单个锚柱上。

公开(公告)号：US07247246B2

公开(公告)日：2007-07-24

申请号：US10771135

申请日：2004-02-02

申请人： Steven S. Nasiri ,  Anthony Francis Flannery, Jr.

发明人： Steven S. Nasiri ,  Anthony Francis Flannery, Jr.

IPC分类号： C23F1/00

CPC分类号： B81C1/00238 ,  B81B2201/0235 ,  B81C2201/019 ,  B81C2203/0118 ,  H01L2224/29011

摘要： A wafer-scale fabrication method for providing MEMS assemblies having a MEMS subassembly sandwiched between and bonded to a cap and a base is provided. The MEMS subassembly includes at least one MEMS device element flexibly connected to the MEMS assembly. The vertical separation between the MEMS device element and an electrode on the base is lithographically defined. Precise control of this critical vertical gap dimension is thereby provided. Fabrication cost is greatly reduced by wafer scale integration.

摘要翻译： 提供了一种用于提供MEMS组件的晶片级制造方法，所述MEMS组件具有夹在盖子和底座之间并结合到盖子和底座的MEMS子组件。 MEMS子组件包括至少一个柔性地连接到MEMS组件的MEMS器件元件。 MEMS器件元件与基底上的电极之间的垂直间隔是光刻的。 由此提供了该临界垂直间隙尺寸的精确控制。 晶圆规模集成大大降低了制造成本。

公开(公告)号：US08350346B1

公开(公告)日：2013-01-08

申请号：US13541306

申请日：2012-07-03

申请人： Kegang Huang ,  Martin Lim ,  Steven S. Nasiri

发明人： Kegang Huang ,  Martin Lim ,  Steven S. Nasiri

IPC分类号： H01L29/84

CPC分类号： B81B3/0051 ,  B81B7/02 ,  B81B2201/025 ,  B81B2201/0271 ,  B81C1/00293 ,  H01L29/0657

摘要： An integrated MEMS device comprises a wafer where the wafer contains two or more cavities of different depths. The MEMS device includes one movable structure within a first cavity of a first depth and a second movable structure within a second cavity of a second depth. The cavities are sealed to maintain different pressures for the different movable structures for optimal operation. MEMS stops can be formed in the same multiple cavity depth processing flow. The MEMS device can be integrated with a CMOS wafer.

公开(公告)号：US08069726B2

公开(公告)日：2011-12-06

申请号：US12621463

申请日：2009-11-18

申请人： Joseph Seeger ,  Steven S. Nasiri ,  Alexander Castro

发明人： Joseph Seeger ,  Steven S. Nasiri ,  Alexander Castro

IPC分类号： G01P9/04 ,  G01C19/00

CPC分类号： G01C19/56 ,  G01C19/5712 ,  G01C19/5719 ,  G01C19/574

摘要： An angular velocity sensor has two masses which are laterally disposed in an X-Y plane and indirectly connected to a frame. The two masses are linked together by a linkage such that they necessarily move in opposite directions along Z. Angular velocity of the sensor about the Y axis can be sensed by driving the two masses into Z-directed antiphase oscillation and measuring the angular oscillation amplitude thereby imparted to the frame. In a preferred embodiment, the angular velocity sensor is fabricated from a bulk MEMS gyroscope wafer, a cap wafer and a reference wafer. In a further preferred embodiment, this assembly of wafers provides a hermetic barrier between the masses and an ambient environment.

摘要翻译： 角速度传感器具有横向设置在X-Y平面中并间接连接到框架的两个质量块。 两个质量通过联动使得它们必须沿着相反方向移动。传感器绕Y轴的角速度可以通过将两个质量驱动为Z向反相振荡并测量角振荡幅度来感测 传给框架。 在优选实施例中，角速度传感器由体MEMS陀螺仪晶片，盖晶片和参考晶片制成。 在另一优选实施例中，晶片组件提供了质量和周围环境之间的密封屏障。

公开(公告)号：US20080283990A1

公开(公告)日：2008-11-20

申请号：US12184231

申请日：2008-07-31

申请人： Steven S. Nasiri ,  Anthony Francis Flannery, JR.

发明人： Steven S. Nasiri ,  Anthony Francis Flannery, JR.

IPC分类号： H01L23/02 ,  H01L21/50

CPC分类号： B81C1/00238 ,  B23K20/023 ,  B81B3/0018 ,  B81B7/007 ,  B81B2203/0315 ,  B81B2207/012 ,  B81B2207/094 ,  B81C1/00269 ,  B81C3/001 ,  B81C2203/0118 ,  B81C2203/035 ,  B81C2203/038 ,  B81C2203/0792 ,  H01L21/187

摘要： A method of bonding of germanium to aluminum between two substrates to create a robust electrical and mechanical contact is disclosed. An aluminum-germanium bond has the following unique combination of attributes: (1) it can form a hermetic seal; (2) it can be used to create an electrically conductive path between two substrates; (3) it can be patterned so that this conduction path is localized; (4) the bond can be made with the aluminum that is available as standard foundry CMOS process. This has the significant advantage of allowing for wafer-level bonding or packaging without the addition of any additional process layers to the CMOS wafer.

摘要翻译： 公开了一种在两个基板之间将锗键合到铝以产生牢固的电气和机械接触的方法。 铝 - 锗键具有以下独特的属性组合：（1）可形成气密封; （2）可用于在两个基板之间形成导电路径; （3）可以对其进行图案化，使得该导电路径被定位; （4）可以用作为标准铸造CMOS工艺的铝制成。 这具有允许晶片级接合或封装而不向CMOS晶片添加任何附加工艺层的显着优点。