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    Windowed wafer assemblies having interposers
    11.
    发明授权
    Windowed wafer assemblies having interposers 有权

    公开(公告)号：US12021156B2

    公开(公告)日：2024-06-25

    申请号：US16588592

    申请日：2019-09-30

    Applicant: Texas Instruments Incorporated

    Inventor： Simon Joshua Jacobs

    IPC: H01L31/02 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/18

    CPC classification number: H01L31/02002 ,  H01L31/0203 ,  H01L31/02327 ,  H01L31/18

    Abstract: Windowed wafer assemblies having interposers are described. A described example integrated circuit (IC) package includes first and second dies, where at least one of the first or second dies includes an optical window with a light transmittance wavelength range between 0.1 micrometers and 1.0 millimeter, and an interposer die between the first and second dies, where the interposer die is coupled to the first die at a first surface of the interposer to form a first bonded interface, where the interposer is coupled to the second die at a second surface of the interposer die to form a second bonded interface, where the second surface is opposite the first surface, where the first and second bonded interfaces form a sealed cavity of the IC package that is at least partially formed by the optical window, and where the interposer die includes electrical routing.

    OPTICAL ELECTRONICS DEVICE
    15.
    发明申请
    OPTICAL ELECTRONICS DEVICE 有权

    公开(公告)号：US20210139320A1

    公开(公告)日：2021-05-13

    申请号：US17121955

    申请日：2020-12-15

    Applicant: Texas Instruments Incorporated

    Inventor： Simon Joshua Jacobs

    IPC: B81C1/00 ,  B81B3/00 ,  G02B26/08 ,  H01L33/48 ,  B81B7/00 ,  G02B1/115

    Abstract: An optical electronics device includes first, second and third wafers. The first wafer has a semiconductor substrate with a dielectric layer on a side of the semiconductor substrate. The second wafer has a transparent substrate with an anti-reflective coating on a side of the transparent substrate. The first wafer is bonded to the second wafer at a silicon dioxide layer between the semiconductor substrate and the anti-reflective coating. The first and second wafers include a cavity extending from the dielectric layer through the semiconductor substrate and through the silicon dioxide layer to the anti-reflective coating. The third wafer includes micromechanical elements. The third wafer is bonded to the dielectric layer, and the micromechanical elements are contained within the cavity.

    Hermetically sealed molecular spectroscopy cell with buried ground plane
    18.
    发明授权
    Hermetically sealed molecular spectroscopy cell with buried ground plane 有权

    公开(公告)号：US10424523B2

    公开(公告)日：2019-09-24

    申请号：US15697505

    申请日：2017-09-07

    Applicant: TEXAS INSTRUMENTS INCORPORATED

    Inventor： Adam Joseph Fruehling ,  Juan Alejandro Herbsommer ,  Simon Joshua Jacobs ,  Benjamin Stassen Cook

    IPC: H01L23/08 ,  B81C1/00 ,  H01L21/768

    Abstract: A method for forming a sealed cavity includes bonding a non-conductive structure to a first substrate to form a non-conductive aperture into the first substrate. On a surface of the non-conductive structure opposite the first substrate, the method includes depositing a first metal layer. The method further includes patterning a first iris in the first metal layer, depositing a first dielectric layer on a surface of the first metal layer opposite the non-conductive structure, and patterning an antenna on a surface of the first dielectric layer opposite the first metal layer. The method also includes creating a cavity in the first substrate, depositing a second metal layer on a surface of the cavity, patterning a second iris in the second metal layer, and bonding a second substrate to a surface of the first substrate opposite the non-conductive structure to thereby seal the cavity.

    ROTATIONAL TRANSITION BASED CLOCK, ROTATIONAL SPECTROSCOPY CELL, AND METHOD OF MAKING SAME
    20.
    发明申请
    ROTATIONAL TRANSITION BASED CLOCK, ROTATIONAL SPECTROSCOPY CELL, AND METHOD OF MAKING SAME 有权
    基于旋转过渡的时钟，旋转光谱单元及其制造方法

    公开(公告)号：US20160291549A1

    公开(公告)日：2016-10-06

    申请号：US14674197

    申请日：2015-03-31

    Applicant: Texas Instruments Incorporated

    Inventor： Juan Alejandro Herbsommer ,  Benjamin S. Cook ,  Phillip Nadeau ,  Simon Joshua Jacobs ,  Django Earl Trombley

    IPC: G04F5/14 ,  H03L7/26

    CPC classification number: G04F5/145 ,  G01N29/36 ,  G01N29/44 ,  G04F5/14 ,  H03L7/26

    Abstract: Described examples include a millimeter wave atomic clock apparatus, chip scale vapor cell, and fabrication method in which a low pressure dipolar molecule gas is provided in a sealed cavity with a conductive interior surface forming a waveguide. Non-conductive apertures provide electromagnetic entrance to, and exit from, the cavity. Conductive coupling structures formed on an outer surface of the vapor cell near the respective non-conductive apertures couple an electromagnetic field to the interior of the cavity for interrogating the vapor cell using a transceiver circuit at a frequency that maximizes the rotational transition absorption of the dipolar molecule gas in the cavity to provide a reference clock signal for atomic clock or other applications.

    Abstract translation: 所描述的实例包括毫米波原子钟装置，芯片尺度蒸汽池及其制造方法，其中低密度偶极子分子气体被设置在具有形成波导的导电内表面的密封腔中。 非导电孔径为腔提供电磁入口并从腔排出。 形成在相应不导电孔隙附近的蒸气室的外表面上的导电耦合结构将电磁场耦合到空腔的内部，以便使用收发器电路以使得偶极子的旋转跃迁吸收最大化的频率 在腔中分配气体，为原子钟或其他应用提供参考时钟信号。

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