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    Packaged semiconductor device having multi-level leadframes configured as modules
    17.
    发明授权
    Packaged semiconductor device having multi-level leadframes configured as modules 有权

    公开(公告)号：US10211132B2

    公开(公告)日：2019-02-19

    申请号：US15924767

    申请日：2018-03-19

    Applicant: Texas Instruments Incorporated

    Inventor： Chia-Yu Chang ,  Chih-Chien Ho ,  Steven Su

    IPC: H01L23/495 ,  H01L21/00 ,  H05K7/18 ,  H01L23/31 ,  H01L23/13 ,  H01L23/00

    Abstract: A leadframe (100) comprises a frame (101) of sheet metal in a first planar level, where the frame has metallic leads (110) and a first metallic pad (120) extending inward from the frame, and the first pad is tied to the frame by first metallic straps (120a). The leadframe further has a second metallic pad (130) in a second planar level parallel to and spaced from the first level, where the second pad is tied by second metallic straps (132) to the frame. In addition, the leadframe has a third metallic pad (140) in a third planar level parallel to and spaced from the second level and additively from the first level, where the third pad is tied by third metallic straps (131) to the second pad.

    MAKING A PLURALITY OF INTEGRATED CIRCUIT PACKAGES
    20.
    发明申请
    MAKING A PLURALITY OF INTEGRATED CIRCUIT PACKAGES 审中-公开
    制造多种集成电路封装

    公开(公告)号：US20160100490A1

    公开(公告)日：2016-04-07

    申请号：US14965052

    申请日：2015-12-10

    Applicant: Texas Instruments Incorporated

    Inventor： Wen Yu Lee ,  Steven Su

    IPC: H05K3/30 ,  H01L21/56 ,  H01L21/78 ,  H01L21/48

    CPC classification number: H05K3/301 ,  H01L21/4821 ,  H01L21/4825 ,  H01L21/565 ,  H01L21/78 ,  H01L23/49541 ,  H01L23/49555 ,  H01L23/49582 ,  H01L24/97

    Abstract: A method of making a plurality of integrated circuit packages provides a metal strip. A first leadframe having a first die pad is formed on the metal strip. Also formed are a first plurality of leads with proximal ends adjacent to the first die pad, free distal ends positioned outwardly from the first die pad, and a first leadframe dam bar intersecting the proximal ends of the first plurality of leads. A second leadframe having a second die pad, a second plurality of leads with proximal ends adjacent to the second die pad and free distal ends positioned outwardly from the second die pad and a second leadframe dam bar intersecting the proximal ends of the second plurality of leads are formed on the metal strip. The free distal ends of said second plurality of leads are aligned with and adjacent to said free distal ends of said first plurality of leads.

    Abstract translation: 制造多个集成电路封装的方法提供金属条。 具有第一管芯焊盘的第一引线框形成在金属条上。 还形成有第一多个引线，其具有邻近第一管芯焊盘的近端，从第一管芯焊盘向外定位的自由远端，以及与第一多个引线的近端相交的第一引线框阻挡条。 具有第二管芯焊盘的第二引线框架，具有邻近第二管芯焊盘的近端的第二多个引线和从第二管芯焊盘向外定位的自由远端以及与第二多个引线的近端相交的第二引线框阻挡条 形成在金属条上。 所述第二多个引线的自由远端与所述第一多个引线的所述自由远端对准并相邻。

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