公开(公告)号：US10665507B2

公开(公告)日：2020-05-26

申请号：US15903815

申请日：2018-02-23

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Tsung-Sheng Kuo ,  Hsu-Shui Liu ,  Jiun-Rong Pai ,  Shou-Wen Kuo ,  Yang-Ann Chu

IPC分类号： H01L21/67 ,  B28D7/04 ,  B28D5/00 ,  H01L21/78 ,  H01L21/66 ,  H01L21/02

摘要： Some embodiments relate to a processing tool for processing a singulated semiconductor die. The tool includes an evaluation unit, a drying unit, and a die wipe station. The evaluation unit is configured to subject the singulated semiconductor die to a liquid to detect flaws in the singulated semiconductor die. The drying unit is configured to dry the liquid from a frontside of the singulated semiconductor die. The die wipe station includes an absorptive drying structure configured to absorb the liquid from a backside of the singulated semiconductor die after the drying unit has dried the liquid from the frontside of the singulated semiconductor die.

公开(公告)号：US20200111652A1

公开(公告)日：2020-04-09

申请号：US16705437

申请日：2019-12-06

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Feng-Kuang Wu ,  Chih-Kuo Chang ,  Hsu-Shui Liu ,  Jiun-Rong Pai ,  Shou-Wen Kuo ,  Sing-Tsung Li

IPC分类号： H01J37/32

摘要： Some embodiments relate to a system. The system includes a radio frequency (RF) generator configured to output a RF signal. A transmission line is coupled to the RF generator. A plasma chamber is coupled to RF generator via the transmission line, wherein the plasma chamber is configured to generate a plasma based on the RF signal. A micro-arc detecting element is configured to determine whether a micro-arc has occurred in the plasma chamber based on the RF signal.

公开(公告)号：US11984331B2

公开(公告)日：2024-05-14

申请号：US17082213

申请日：2020-10-28

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chien-Fa Lee ,  Hsu-Shui Liu ,  Jiun-Rong Pai ,  Shou-Wen Kuo

IPC分类号： H01L21/67 ,  H01L21/677 ,  H01L21/68 ,  H01L21/687

CPC分类号： H01L21/67201 ,  H01L21/67259 ,  H01L21/67766 ,  H01L21/67775 ,  H01L21/681 ,  H01L21/68707

摘要： The present disclosure relates to an equipment front end module (EFEM) teaching element. The EFEM teaching element includes a memory element configured to store data describing an initial position of an EFEM robot within an EFEM chamber. A position measurement device is configured to take measurements describing a new position of the EFEM robot within the EFEM chamber that is different than the initial position of the EFEM robot. A controller is configured to determine a set of new movement commands describing a path of the EFEM robot based upon the data describing the initial position of the EFEM robot and the measurements.

公开(公告)号：US11699619B2

公开(公告)日：2023-07-11

申请号：US17236276

申请日：2021-04-21

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Tsung-Sheng Kuo ,  Hsu-Shui Liu ,  Jiun-Rong Pai ,  Shou-Wen Kuo ,  Yang-Ann Chu

IPC分类号： H01L21/78 ,  B28D5/00 ,  B28D7/04 ,  H01L21/67 ,  H01L21/66 ,  H01L21/02

CPC分类号： H01L21/78 ,  B28D5/0017 ,  B28D7/04 ,  H01L21/02076 ,  H01L21/67034 ,  H01L21/67092 ,  H01L21/67173 ,  H01L21/67288 ,  H01L22/12

摘要： Some embodiments relate to a processing tool for processing a singulated semiconductor die. The tool includes an evaluation unit, a drying unit, and a die wipe station. The evaluation unit is configured to subject the singulated semiconductor die to a liquid to detect flaws in the singulated semiconductor die. The drying unit is configured to dry the liquid from a frontside of the singulated semiconductor die. The die wipe station includes an absorptive drying structure configured to absorb the liquid from a backside of the singulated semiconductor die after the drying unit has dried the liquid from the frontside of the singulated semiconductor die.

公开(公告)号：US11545382B2

公开(公告)日：2023-01-03

申请号：US16853846

申请日：2020-04-21

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chien-Fa Lee ,  Hsu-Shui Liu ,  Jiun-Rong Pai ,  Pin-Yi Hsin ,  Shou-Wen Kuo ,  Patrick Lin

IPC分类号： B08B3/04 ,  H01L21/677 ,  B08B3/08

摘要： The present disclosure, in some embodiments, relates to an integrated chip processing tool. The integrated chip processing tool includes a first transfer module and a second transfer module. The first transfer module has a first robotic arm disposed within a housing. The first transfer module is configured to receive a single and unitary first die tray configured to hold a plurality of integrated chip (IC) die and to concurrently transfer all of the plurality of IC die held by the single and unitary first die tray to a single and unitary die boat. The second transfer module has an additional robotic arm disposed within the housing and configured to concurrently transfer all of the plurality of IC die from the single and unitary die boat to a single and unitary second die tray.

公开(公告)号：US11171065B2

公开(公告)日：2021-11-09

申请号：US16600789

申请日：2019-10-14

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chia-Han Lin ,  Chien-Fa Lee ,  Hsu-Shui Liu ,  Jiun-Rong Pai ,  Sheng-Hsiang Chuang ,  Surendra Kumar Soni ,  Shou-Wen Kuo ,  Wu-An Weng ,  Gary Tsai ,  Chien-Ko Liao ,  Ya Hsun Hsueh ,  Becky Liao ,  Ethan Yu ,  Ming-Chi Tsai ,  Kuo-Yi Liu

IPC分类号： H01L21/66 ,  H05K13/08 ,  G06K9/20 ,  H01L21/67 ,  H01L21/687 ,  H01L21/677

摘要： Some embodiments of the present disclosure relate to a processing tool. The tool includes a housing enclosing a processing chamber, and an input/output port configured to pass a wafer through the housing into and out of the processing chamber. A back-side macro-inspection system is arranged within the processing chamber and is configured to image a back side of the wafer. A front-side macro-inspection system is arranged within the processing chamber and is configured to image a front side of the wafer according to a first image resolution. A front-side micro-inspection system is arranged within the processing chamber and is configured to image the front side of the wafer according to a second image resolution which is higher than the first image resolution.

公开(公告)号：US10991625B2

公开(公告)日：2021-04-27

申请号：US16848931

申请日：2020-04-15

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Tsung-Sheng Kuo ,  Hsu-Shui Liu ,  Jiun-Rong Pai ,  Shou-Wen Kuo ,  Yang-Ann Chu

IPC分类号： H01L21/78 ,  H01L21/02 ,  H01L21/67 ,  B28D5/00 ,  H01L21/66 ,  B28D7/04

摘要： Some embodiments relate to a processing tool for processing a singulated semiconductor die. The tool includes an evaluation unit, a drying unit, and a die wipe station. The evaluation unit is configured to subject the singulated semiconductor die to a liquid to detect flaws in the singulated semiconductor die. The drying unit is configured to dry the liquid from a frontside of the singulated semiconductor die. The die wipe station includes an absorptive drying structure configured to absorb the liquid from a backside of the singulated semiconductor die after the drying unit has dried the liquid from the frontside of the singulated semiconductor die.

公开(公告)号：US10734206B2

公开(公告)日：2020-08-04

申请号：US16705437

申请日：2019-12-06

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Feng-Kuang Wu ,  Chih-Kuo Chang ,  Hsu-Shui Liu ,  Jiun-Rong Pai ,  Shou-Wen Kuo ,  Sing-Tsung Li

IPC分类号： H01J37/32

摘要： Some embodiments relate to a system. The system includes a radio frequency (RF) generator configured to output a RF signal. A transmission line is coupled to the RF generator. A plasma chamber is coupled to RF generator via the transmission line, wherein the plasma chamber is configured to generate a plasma based on the RF signal. A micro-arc detecting element is configured to determine whether a micro-arc has occurred in the plasma chamber based on the RF signal.

公开(公告)号：US10665489B2

公开(公告)日：2020-05-26

申请号：US15249801

申请日：2016-08-29

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chien-Fa Lee ,  Hsu-Shui Liu ,  Jiun-Rong Pai ,  Pin-Yi Hsin ,  Shou-Wen Kuo ,  Patrick Lin

IPC分类号： H01L21/67 ,  H01L21/677 ,  B08B3/04 ,  B08B3/08

摘要： The present disclosure relates to an integrated chip (IC) processing tool having a die exchanger configured to automatically transfer a plurality of IC die between a die tray and a die boat, and an associated method. The integrated chip processing tool has a die exchanger configured to receive a die tray comprising a plurality of IC die. The die exchanger is configured to automatically transfer the plurality of IC die between the die tray and a die boat. An IC die processing tool is configured to receive the die boat from the die exchanger and to perform a processing step on the plurality of IC die within the die boat. By operating the die exchanger to automatically transfer IC die between the die tray and the die boat, the transfer time can be reduced and contamination and/or damage risks related to a manual transfer of IC die can be mitigated.

公开(公告)号：US10283388B1

公开(公告)日：2019-05-07

申请号：US15876225

申请日：2018-01-22

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Tsung-Sheng Kuo ,  Hsu-Shui Liu ,  Jiun-Rong Pai ,  Shou-Wen Kuo ,  Wen-Chin Kan ,  Yang-Ann Chu

IPC分类号： H01L21/683 ,  B32B43/00 ,  H01L21/67 ,  B65H5/28 ,  H05K13/04 ,  H05K13/02

摘要： A detaping machine is adapted for removing a tape from a frame, the tape includes a wafer mounting area and a periphery area surrounding the wafer mounting area. The detaping machine includes a carrier and a detaping module. The carrier is for supporting the tape and the frame. The detaping module includes an elastic pressing device and a detaping head, wherein the periphery area of the tape is adapted to be pressed by the elastic pressing device, and the wafer mounting area of the tape is adapted to be pressed by the detaping head. A detaping method is further provided.