Group-III nitride semiconductor device, epitaxial substrate, and method of fabricating group-III nitride semiconductor device
    11.
    发明授权
    Group-III nitride semiconductor device, epitaxial substrate, and method of fabricating group-III nitride semiconductor device 失效
    III族氮化物半导体器件,外延衬底以及III族氮化物半导体器件的制造方法

    公开(公告)号:US08487327B2

    公开(公告)日:2013-07-16

    申请号:US13484776

    申请日:2012-05-31

    IPC分类号: H01L33/00 H01L29/04

    摘要: A III-nitride semiconductor device has a support base comprised of a III-nitride semiconductor and having a primary surface extending along a first reference plane perpendicular to a reference axis inclined at a predetermined angle with respect to a c-axis of the III-nitride semiconductor, and an epitaxial semiconductor region provided on the primary surface of the support base. The epitaxial semiconductor region includes GaN-based semiconductor layers. The reference axis is inclined at a first angle from the c-axis of the III-nitride semiconductor toward a first crystal axis, either the m-axis or a-axis. The reference axis is inclined at a second angle from the c-axis of the III-nitride semiconductor toward a second crystal axis, the other of the m-axis and a-axis. Morphology of an outermost surface of the epitaxial semiconductor region includes a plurality of pits. A pit density of the pits is not more than 5×104 cm−2.

    摘要翻译: III族氮化物半导体器件具有由III族氮化物半导体构成的支撑基底,其具有沿与第一参考平面垂直的第一参考平面延伸的第一表面,所述第一参考平面垂直于相对于III族氮化物的c轴以预定角度倾斜的参考轴 半导体和设置在支撑基体的主表面上的外延半导体区域。 外延半导体区域包括GaN基半导体层。 基准轴从III族氮化物半导体的c轴朝向第一晶轴倾斜第一角度,即m轴或a轴。 基准轴从III族氮化物半导体的c轴向第二晶轴倾斜第二角度,m轴和a轴的另一方倾斜。 外延半导体区域的最外表面的形态包括多个凹坑。 坑的坑密度不大于5×104cm-2。

    Method for producing nitride semiconductor optical device and epitaxial wafer
    12.
    发明授权
    Method for producing nitride semiconductor optical device and epitaxial wafer 失效
    氮化物半导体光学器件和外延晶片的制造方法

    公开(公告)号:US08183071B2

    公开(公告)日:2012-05-22

    申请号:US12539887

    申请日:2009-08-12

    IPC分类号: H01L21/00

    摘要: In step S106, an InXGa1-XN well layer is grown on a semipolar main surface between times t4 and t5 while a temperature in a growth furnace is maintained at temperature TW. In step S107, immediately after completion of the growth of the well layer, the growth of a protective layer covering the main surface of the well layer is initiated at temperature TW. The protective layer is composed of a gallium nitride-based semiconductor with a band gap energy that is higher than that of the well layer and equal to or less than that of a barrier layer. In step S108, the temperature in the furnace is changed from temperatures TW to TB before the barrier layer growth. The barrier layer composed of the gallium nitride-based semiconductor is grown on the protective layer between times t8 and t9 while the temperature in the furnace is maintained at temperature TB.

    摘要翻译: 在步骤S106中,在时间t4〜t5的半极性主面上生长InXGa1-XN阱层,而生长炉内的温度保持在温度TW。 在步骤S107中,在阱层生长完成之后,在温度TW下开始覆盖阱层主表面的保护层的生长。 保护层由氮化镓系半导体构成,带隙能量高于阱层的带隙能量,并且等于或小于势垒层的带隙能量。 在步骤S108中,在阻挡层生长之前,炉中的温度从温度TW变为TB。 由氮化镓系半导体构成的阻挡层在时刻t8〜t9的保护层上生长,同时炉内的温度保持在温度TB。

    METHOD FOR PRODUCING NITRIDE SEMICONDUCTOR OPTICAL DEVICE AND EPITAXIAL WAFER
    18.
    发明申请
    METHOD FOR PRODUCING NITRIDE SEMICONDUCTOR OPTICAL DEVICE AND EPITAXIAL WAFER 失效
    用于生产氮化物半导体光学器件和外延晶体的方法

    公开(公告)号:US20100055820A1

    公开(公告)日:2010-03-04

    申请号:US12539887

    申请日:2009-08-12

    IPC分类号: H01L33/00

    摘要: In step S106, an InXGa1-XN well layer is grown on a semipolar main surface between times t4 and t5 while a temperature in a growth furnace is maintained at temperature TW. In step S107, immediately after completion of the growth of the well layer, the growth of a protective layer covering the main surface of the well layer is initiated at temperature TW. The protective layer is composed of a gallium nitride-based semiconductor with a band gap energy that is higher than that of the well layer and equal to or less than that of a barrier layer. In step S108, the temperature in the furnace is changed from temperatures TW to TB before the barrier layer growth. The barrier layer composed of the gallium nitride-based semiconductor is grown on the protective layer between times t8 and t9 while the temperature in the furnace is maintained at temperature TB.

    摘要翻译: 在步骤S106中,在时间t4〜t5的半极性主面上生长InXGa1-XN阱层,而生长炉内的温度保持在温度TW。 在步骤S107中,在阱层生长完成之后,在温度TW下开始覆盖阱层主表面的保护层的生长。 保护层由氮化镓系半导体构成,带隙能量高于阱层的带隙能量,并且等于或小于势垒层的带隙能量。 在步骤S108中,在阻挡层生长之前,炉中的温度从温度TW变为TB。 由氮化镓系半导体构成的阻挡层在时刻t8〜t9的保护层上生长,同时炉内的温度保持在温度TB。